Jimmy Liang

Person

Chung Li City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Package structures and methods for forming the same
- Patent number 9,362,236
- Issue date Jun 7, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Liang Meng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Easily stackable dies
- Patent number 8,424,357
- Issue date Apr 23, 2013
- Aflash Technology Co., Ltd.
- Leo Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit card
- Patent number 8,416,576
- Issue date Apr 9, 2013
- Aflash Technology Co., Ltd.
- Tse Min Chu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flash memory
- Patent number 8,184,464
- Issue date May 22, 2012
- Aflash Technology, Co., Ltd.
- Kuei-Wu Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip holder with wafer level redistribution layer
- Patent number 8,049,323
- Issue date Nov 1, 2011
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Shien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced reliability of wafer-level chip-scale packaging (WLCSP) di...
- Patent number 7,838,424
- Issue date Nov 23, 2010
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tjandra Winata Karta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball-mounting method for coplanarity improvement in large package
- Patent number 7,642,129
- Issue date Jan 5, 2010
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jimmy Liang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Package Structures and Methods for Forming the Same
- Publication number 20160268145
- Publication date Sep 15, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Liang Meng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package Structures and Methods for Forming the Same
- Publication number 20140252594
- Publication date Sep 11, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Liang Meng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Layered Integrated Circuit Apparatus
- Publication number 20120091595
- Publication date Apr 19, 2012
- MAO BANG ELECTRONIC CO., LTD.
- Sung Chuan MA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Card
- Publication number 20110228487
- Publication date Sep 22, 2011
- MAO BANG ELECTRONIC CO., LTD.
- Tse Min Chu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Integrated Circuit
- Publication number 20110108983
- Publication date May 12, 2011
- MAO BANG ELECTRONIC CO., LTD.
- Leo Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip for Reliable Stacking on another Chip
- Publication number 20110062586
- Publication date Mar 17, 2011
- MAO BANG ELECTRONIC CO., LTD.
- Leo Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Stacking Device Having Re-Distribution Layer
- Publication number 20110062590
- Publication date Mar 17, 2011
- MAO BANG ELECTRONIC CO., LTD.
- Leo Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Easily Stackable Dies
- Publication number 20110023574
- Publication date Feb 3, 2011
- MAO BANG ELECTRONIC CO., LTD.
- Leo Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flash memory
- Publication number 20110019457
- Publication date Jan 27, 2011
- MAO BANG ELECTRONIC CO., LTD.
- Kuei-Wu Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Enhanced Reliability of Wafer-Level Chip-Scale Packaging (WLCSP) Di...
- Publication number 20090011543
- Publication date Jan 8, 2009
- Tjandra Winata Karta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP HOLDER WITH WAFER LEVEL REDISTRIBUTION LAYER
- Publication number 20080197473
- Publication date Aug 21, 2008
- Taiwan Semiconductor Manufacturing Co., LTD
- Chen-Shien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ball-mounting method for coplanarity improvement in large package
- Publication number 20080160671
- Publication date Jul 3, 2008
- Jimmy Liang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Jimmy Liang

Person

Patents Grantslast 30 patents

Package structures and methods for forming the same

Easily stackable dies

Integrated circuit card

Flash memory

Chip holder with wafer level redistribution layer

Enhanced reliability of wafer-level chip-scale packaging (WLCSP) di...

Ball-mounting method for coplanarity improvement in large package

Patents Applicationslast 30 patents

Package Structures and Methods for Forming the Same

Package Structures and Methods for Forming the Same

Layered Integrated Circuit Apparatus

Integrated Circuit Card

Integrated Circuit

Chip for Reliable Stacking on another Chip

Chip Stacking Device Having Re-Distribution Layer

Easily Stackable Dies

Flash memory

Enhanced Reliability of Wafer-Level Chip-Scale Packaging (WLCSP) Di...

CHIP HOLDER WITH WAFER LEVEL REDISTRIBUTION LAYER

Ball-mounting method for coplanarity improvement in large package