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BOISE, ID, US
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Patents Grants
last 30 patents
Information
Patent Grant
Memory arrays and methods used in forming a memory array comprising...
Patent number
11,641,742
Issue date
May 2, 2023
Micron Technology, Inc.
Cole Smith
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Memory arrays and methods used in forming a memory array comprising...
Patent number
11,152,388
Issue date
Oct 19, 2021
Micron Technology, Inc.
Cole Smith
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Conductive interconnect structures incorporating negative thermal e...
Patent number
11,011,420
Issue date
May 18, 2021
Micron Technology, Inc.
Hongqi Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interconnect assemblies with through-silicon vias and stress-relief...
Patent number
10,847,442
Issue date
Nov 24, 2020
Micron Technology, Inc.
Hongqi Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Conductive interconnect structures incorporating negative thermal e...
Patent number
10,546,777
Issue date
Jan 28, 2020
Micron Technology, Inc.
Hongqi Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interconnect structure with nitrided barrier
Patent number
10,403,575
Issue date
Sep 3, 2019
Micron Technology, Inc.
Gregory C. Herdt
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Capping poly channel pillars in stacked circuits
Patent number
10,319,678
Issue date
Jun 11, 2019
Intel Corporation
Hongqi Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Through substrate via liner densification
Patent number
10,163,655
Issue date
Dec 25, 2018
Micron Technology, Inc.
Jin Lu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Conductive interconnect structures incorporating negative thermal e...
Patent number
9,922,875
Issue date
Mar 20, 2018
Micron Technology, Inc.
Hongqi Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor constructions and methods of forming intersecting lin...
Patent number
9,911,643
Issue date
Mar 6, 2018
Micron Technology, Inc.
Hongqi Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Low capacitance interconnect structures and associated systems and...
Patent number
9,911,653
Issue date
Mar 6, 2018
Micron Technology, Inc.
Jin Lu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Conductive interconnect structures incorporating negative thermal e...
Patent number
9,754,825
Issue date
Sep 5, 2017
Micron Technology, Inc.
Hongqi Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Low capacitance interconnect structures and associated systems and...
Patent number
9,613,864
Issue date
Apr 4, 2017
Micron Technology, Inc.
Jin Lu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for forming a metal cap in a semiconductor memory device
Patent number
9,577,192
Issue date
Feb 21, 2017
SONY SEMICONDUCTOR SOLUTIONS CORPORATION
Muralikrishnan Balakrishnan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor constructions
Patent number
9,391,001
Issue date
Jul 12, 2016
Micron Technology, Inc.
Hongqi Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Capping poly channel pillars in stacked circuits
Patent number
9,263,459
Issue date
Feb 16, 2016
Intel Corporation
Hongqi Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming a planar surface for a semiconductor device struc...
Patent number
9,153,451
Issue date
Oct 6, 2015
Micron Technology, Inc.
Andrew Dennis Watson Carswell
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Conductive interconnect structures incorporating negative thermal e...
Patent number
9,099,442
Issue date
Aug 4, 2015
Micron Technology, Inc.
Hongqi Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Post-tungsten CMP cleaning solution and method of using the same
Patent number
8,911,558
Issue date
Dec 16, 2014
Nanya Technology Corp.
Hongqi Li
C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information
Patent Grant
Method and apparatuses for removing polysilicon from semiconductor...
Patent number
8,071,480
Issue date
Dec 6, 2011
Micron Technology, Inc.
Jin Lu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods and apparatuses for removing polysilicon from semiconductor...
Patent number
7,754,612
Issue date
Jul 13, 2010
Micron Technology, Inc.
Jin Lu
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Memory Arrays and Methods Used in Forming a Memory Array Comprising...
Publication number
20210408039
Publication date
Dec 30, 2021
Micron Technology, Inc.
Cole Smith
G11 - INFORMATION STORAGE
Information
Patent Application
Memory Arrays and Methods Used in Forming a Memory Array Comprising...
Publication number
20210111184
Publication date
Apr 15, 2021
Micron Technology, Inc.
Cole Smith
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONDUCTIVE INTERCONNECT STRUCTURES INCORPORATING NEGATIVE THERMAL E...
Publication number
20200235007
Publication date
Jul 23, 2020
Micron Technology, Inc.
Hongqi Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERCONNECT STRUCTURE WITH NITRIDED BARRIER
Publication number
20180204803
Publication date
Jul 19, 2018
Micron Technology, Inc.
Gregory C. Herdt
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONDUCTIVE INTERCONNECT STRUCTURES INCORPORATING NEGATIVE THERMAL E...
Publication number
20180174902
Publication date
Jun 21, 2018
Micron Technology, Inc.
Hongqi Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONDUCTIVE INTERCONNECT STRUCTURES INCORPORATING NEGATIVE THERMAL E...
Publication number
20170316974
Publication date
Nov 2, 2017
Micron Technology, Inc.
Hongqi Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LOW CAPACITANCE INTERCONNECT STRUCTURES AND ASSOCIATED SYSTEMS AND...
Publication number
20170162440
Publication date
Jun 8, 2017
Micron Technology, Inc.
Jin Lu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THROUGH SUBSTRATE VIA LINER DENSIFICATION
Publication number
20170148674
Publication date
May 25, 2017
Micron Technology, Inc.
JIN LU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR FORMING A METAL CAP IN A SEMICONDUCTOR MEMORY DEVICE
Publication number
20170133585
Publication date
May 11, 2017
Sony Semiconductor Solutions Corporation
Muralikrishnan Balakrishnan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Constructions and Methods of Forming Intersecting Lin...
Publication number
20160293482
Publication date
Oct 6, 2016
Micron Technology, Inc.
Hongqi Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CAPPING POLY CHANNEL PILLARS IN STACKED CIRCUITS
Publication number
20160247756
Publication date
Aug 25, 2016
Intel Corporation
Hongqi Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LOW CAPACITANCE INTERCONNECT STRUCTURES AND ASSOCIATED SYSTEMS AND...
Publication number
20160111372
Publication date
Apr 21, 2016
Micron Technology, Inc.
Jin Lu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONDUCTIVE INTERCONNECT STRUCTURES INCORPORATING NEGATIVE THERMAL E...
Publication number
20150340282
Publication date
Nov 26, 2015
Micron Technology, Inc.
Hongqi Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR FORMING A METAL CAP IN A SEMICONDUCTOR MEMORY DEVICE
Publication number
20150340247
Publication date
Nov 26, 2015
SONY CORPORATION
Muralikrishnan Balakrishnan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERCONNECT ASSEMBLIES WITH THROUGH-SILICON VIAS AND STRESS-RELIEF...
Publication number
20150243583
Publication date
Aug 27, 2015
Micron Technology, Inc.
Hongqi Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Constructions
Publication number
20150054164
Publication date
Feb 26, 2015
Micron Technology, Inc.
Hongqi Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONDUCTIVE INTERCONNECT STRUCTURES INCORPORATING NEGATIVE THERMAL E...
Publication number
20150035150
Publication date
Feb 5, 2015
Micron Technology, Inc.
Hongqi Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF FORMING A PLANAR SURFACE FOR A SEMICONDUCTOR DEVICE STRUC...
Publication number
20140162455
Publication date
Jun 12, 2014
Micron Technology, Inc.
Andrew Dennis Watson Carswell
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Substrates Comprising Integrated Circuitry, Methods Of Processing A...
Publication number
20130313718
Publication date
Nov 28, 2013
Micron Technology, Inc.
Sony Varghese
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POST-TUNGSTEN CMP CLEANING SOLUTION AND METHOD OF USING THE SAME
Publication number
20120244705
Publication date
Sep 27, 2012
Hongqi LI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD AND APPARATUSES FOR REMOVING POLYSILICON FROM SEMICONDUCTOR...
Publication number
20100267239
Publication date
Oct 21, 2010
Micron Technology, Inc.
Jin Lu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS AND APPARATUSES FOR REMOVING POLYSILICON FROM SEMICONDUCTOR...
Publication number
20080233749
Publication date
Sep 25, 2008
Micron Technology, Inc.
Jin Lu
H01 - BASIC ELECTRIC ELEMENTS