Jin Onuki

Person

Hitachi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Circuit board
- Patent number 7,141,741
- Issue date Nov 28, 2006
- Hitachi, Ltd.
- Kazuji Yamada
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor device
- Patent number 6,434,008
- Issue date Aug 13, 2002
- Hitachi, Ltd.
- Kazuji Yamada
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor module
- Patent number 6,353,258
- Issue date Mar 5, 2002
- Hitachi, Ltd.
- Hirokazu Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of high frequency pulse arc welding and apparatus therefor
- Patent number 6,225,598
- Issue date May 1, 2001
- Hitachi, Ltd.
- Masayasu Nihei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device having power semiconductor elements
- Patent number 5,956,231
- Issue date Sep 21, 1999
- Hitachi, Ltd.
- Kazuji Yamada
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Method of solder bonding and power semiconductor device manufacture...
- Patent number 5,767,577
- Issue date Jun 16, 1998
- Hitachi, Ltd.
- Masayasu Nihei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power semiconductor device
- Patent number 5,539,244
- Issue date Jul 23, 1996
- Hitachi, Ltd.
- Mutsuhiro Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of and apparatus for sputtering, and integrated circuit device
- Patent number 5,175,608
- Issue date Dec 29, 1992
- Hitachi, Ltd.
- Masayasu Nihei
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device using annealed bonding wire
- Patent number 5,153,704
- Issue date Oct 6, 1992
- Hitachi, Ltd.
- Jin Onuki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 5,051,812
- Issue date Sep 24, 1991
- Hitachi, Ltd.
- Jin Onuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 5,019,891
- Issue date May 28, 1991
- Hitachi, Ltd.
- Jin Onuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of and apparatus for sputtering
- Patent number 4,999,096
- Issue date Mar 12, 1991
- Hitachi, Ltd.
- Masayasu Nihei
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device and production process thereof, as well as wir...
- Patent number 4,976,393
- Issue date Dec 11, 1990
- Hitachi, Ltd.
- Makoto Nakajima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 4,965,656
- Issue date Oct 23, 1990
- Hitachi, Ltd.
- Yasushi Koubuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Corrosion-resistant aluminum electronic material
- Patent number 4,912,544
- Issue date Mar 27, 1990
- Hitachi, Ltd.
- Jin Onuki
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Semiconductor devices of multi-emitter type
- Patent number 4,542,398
- Issue date Sep 17, 1985
- Hitachi, Ltd.
- Tsutomu Yatsuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 4,500,904
- Issue date Feb 19, 1985
- Hitachi, Ltd.
- Jin Onuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked structure having matrix-fibered composite layers and a meta...
- Patent number 4,482,912
- Issue date Nov 13, 1984
- Hitachi, Ltd.
- Akio Chiba
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Method of fabricating semiconductor device by bonding together sili...
- Patent number 4,246,693
- Issue date Jan 27, 1981
- Hitachi, Ltd.
- Jin Onuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder layer for a semi-conductor device consisting of at least one...
- Patent number 4,110,783
- Issue date Aug 29, 1978
- Hitachi, Ltd.
- Hisakichi Onodera
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Circuit board
- Publication number 20040056349
- Publication date Mar 25, 2004
- Kazuji Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20030016502
- Publication date Jan 23, 2003
- Kazuji Yamada
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Circuit board

Semiconductor device

Semiconductor module

Method of high frequency pulse arc welding and apparatus therefor

Semiconductor device having power semiconductor elements

Method of solder bonding and power semiconductor device manufacture...

Power semiconductor device

Method of and apparatus for sputtering, and integrated circuit device

Semiconductor device using annealed bonding wire

Semiconductor device and method for manufacturing the same

Semiconductor device and method of fabricating the same

Method of and apparatus for sputtering

Semiconductor device and production process thereof, as well as wir...

Semiconductor device

Corrosion-resistant aluminum electronic material

Semiconductor devices of multi-emitter type

Semiconductor device

Stacked structure having matrix-fibered composite layers and a meta...

Method of fabricating semiconductor device by bonding together sili...

Solder layer for a semi-conductor device consisting of at least one...

Patents Applicationslast 30 patents

Circuit board

Semiconductor device