Jin-Yiing Song

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Hsinchu, TW

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Patents Grantslast 30 patents

Information Patent Grant
Method to reduce dishing and erosion in a CMP process
- Patent number 6,919,276
- Issue date Jul 19, 2005
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shen-Nan Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Metal line formation using advaced CMP slurry
- Publication number 20080265416
- Publication date Oct 30, 2008
- Shen-Nan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method to reduce dishing and erosion in a CMP process
- Publication number 20040214442
- Publication date Oct 28, 2004
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shen-Nan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A HYDROPHILIC SURFACE ON LOW-K DIELECTRIC INSULA...
- Publication number 20040018748
- Publication date Jan 29, 2004
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsin-Hsien Lu
- H01 - BASIC ELECTRIC ELEMENTS