Jindong FENG

Person

Guangdong, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Embedded chip package and manufacturing method thereof
- Patent number 12,148,676
- Issue date Nov 19, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing embedded package structure having air reso...
- Patent number 12,040,526
- Issue date Jul 16, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Circuit prearranged heat dissipation embedded packaging structure a...
- Patent number 12,002,734
- Issue date Jun 4, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded chip package and manufacturing method thereof
- Patent number 11,854,920
- Issue date Dec 26, 2023
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Support frame structure and manufacturing method thereof
- Patent number 11,569,177
- Issue date Jan 31, 2023
- Zhuhai ACCESS Semiconductor Co., Ltd.
- Xianming Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
EMBEDDED MAGNET FRAME, INTEGRATED STRUCTURE AND MANUFACTURING METHOD
- Publication number 20240321594
- Publication date Sep 26, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL FRAME CHIP EMBEDDED PACKAGING SUBSTRATE AND MANUFACTURING MET...
- Publication number 20240312879
- Publication date Sep 19, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- XIANMING CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240087972
- Publication date Mar 14, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD FOR DEVICE EMBEDDED PACKAGING STRUCTURE
- Publication number 20240063055
- Publication date Feb 22, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTICHIP INTERCONNECTING PACKAGING STRUCTURE AND MANUFACTURING MET...
- Publication number 20240030146
- Publication date Jan 25, 2024
- Nantong ACCESS Semiconductor CO.,LTD.
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE MANUFACTURING METHOD
- Publication number 20230326765
- Publication date Oct 12, 2023
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER PLATE FOR PREPARING PACKAGE SUBSTRATE, PACKAGE SUBSTRATE ST...
- Publication number 20230282490
- Publication date Sep 7, 2023
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20230276576
- Publication date Aug 31, 2023
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED INDUCTANCE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230178298
- Publication date Jun 8, 2023
- Zhuhai YUEXIN Semiconductor Limited Liability Company
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPPORT FRAME STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230154859
- Publication date May 18, 2023
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TWO-SIDED INTERCONNECTED EMBEDDED CHIP PACKAGING STRUCTURE AND MANU...
- Publication number 20230154857
- Publication date May 18, 2023
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230145610
- Publication date May 11, 2023
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPORARY CARRIER PLATE AND MANUFACTURING METHOD THEREOF, AND MANUF...
- Publication number 20220287184
- Publication date Sep 8, 2022
- Nantong ACCESS Semiconductor CO.,LTD.
- Xianming CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT PREARRANGED HEAT DISSIPATION EMBEDDED PACKAGING STRUCTURE A...
- Publication number 20220068760
- Publication date Mar 3, 2022
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED PACKAGING STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220045043
- Publication date Feb 10, 2022
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPPORT FRAME STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20210407921
- Publication date Dec 30, 2021
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING EMBEDDED PACKAGE STRUCTURE HAVING AIR RESO...
- Publication number 20210399400
- Publication date Dec 23, 2021
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS

Jindong FENG

Person

Patents Grantslast 30 patents

Embedded chip package and manufacturing method thereof

Method for manufacturing embedded package structure having air reso...

Circuit prearranged heat dissipation embedded packaging structure a...

Embedded chip package and manufacturing method thereof

Support frame structure and manufacturing method thereof

Patents Applicationslast 30 patents

EMBEDDED MAGNET FRAME, INTEGRATED STRUCTURE AND MANUFACTURING METHOD

METAL FRAME CHIP EMBEDDED PACKAGING SUBSTRATE AND MANUFACTURING MET...

EMBEDDED CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

MANUFACTURING METHOD FOR DEVICE EMBEDDED PACKAGING STRUCTURE

MULTICHIP INTERCONNECTING PACKAGING STRUCTURE AND MANUFACTURING MET...

PACKAGE SUBSTRATE MANUFACTURING METHOD

CARRIER PLATE FOR PREPARING PACKAGE SUBSTRATE, PACKAGE SUBSTRATE ST...

PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF

EMBEDDED INDUCTANCE STRUCTURE AND MANUFACTURING METHOD THEREOF

SUPPORT FRAME STRUCTURE AND MANUFACTURING METHOD THEREOF

TWO-SIDED INTERCONNECTED EMBEDDED CHIP PACKAGING STRUCTURE AND MANU...

EMBEDDED CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

TEMPORARY CARRIER PLATE AND MANUFACTURING METHOD THEREOF, AND MANUF...

CIRCUIT PREARRANGED HEAT DISSIPATION EMBEDDED PACKAGING STRUCTURE A...

EMBEDDED PACKAGING STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

SUPPORT FRAME STRUCTURE AND MANUFACTURING METHOD THEREOF

METHOD FOR MANUFACTURING EMBEDDED PACKAGE STRUCTURE HAVING AIR RESO...