Jing-En LUAN

Person

Shenzhen, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Molded proximity sensor
- Patent number 11,513,220
- Issue date Nov 29, 2022
- STMicroelectronics Pte Ltd
- Jing-En Luan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded proximity sensor
- Patent number 10,429,509
- Issue date Oct 1, 2019
- STMicroelectronics Pte Ltd
- Jing-En Luan
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor die attachment with embedded stud bumps in attachment...
- Patent number 10,269,583
- Issue date Apr 23, 2019
- STMicroelectronics Pte Ltd
- Jing-En Luan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Proximity sensor and manufacturing method therefor
- Patent number 10,244,638
- Issue date Mar 26, 2019
- STMicroelectronics Pte Ltd
- Jing-En Luan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Proximity sensor, electronic apparatus and method for manufacturing...
- Patent number 10,126,462
- Issue date Nov 13, 2018
- STMicroelectronics Pte Ltd
- Jing-En Luan
- G01 - MEASURING TESTING
Information Patent Grant
Camera module and method of manufacturing the same
- Patent number 9,923,020
- Issue date Mar 20, 2018
- STMicroelectronics (Shenzhen) R&D Co., Ltd.
- Jing-En Luan
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Electronic device with periphery contact pads surrounding central c...
- Patent number 9,859,196
- Issue date Jan 2, 2018
- STMicroelectronics (Shenzhen) R&D Co., Ltd.
- Jing-En Luan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Proximity detector device with interconnect layers and related methods
- Patent number 9,768,341
- Issue date Sep 19, 2017
- STMicroelectronics (Shenzhen) R&D Co., Ltd.
- Jing-En Luan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, semiconductor package, and method for manufac...
- Patent number 9,754,916
- Issue date Sep 5, 2017
- STMicroelectronics Pte Ltd
- Jing-En Luan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with redistribution layer and stiffeners and rela...
- Patent number 9,698,105
- Issue date Jul 4, 2017
- STMicroelectronics Pte Ltd
- Jing-En Luan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Proximity sensor, electronic apparatus and method for manufacturing...
- Patent number 9,645,238
- Issue date May 9, 2017
- STMicroelectronics Pte Ltd
- Jing-En Luan
- G01 - MEASURING TESTING
Information Patent Grant
Wafer level packaging for proximity sensor
- Patent number 9,583,666
- Issue date Feb 28, 2017
- STMicroelectronics Pte Ltd
- Jing-En Luan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, semiconductor package, and method for manufac...
- Patent number 9,502,381
- Issue date Nov 22, 2016
- STMicroelectronics Pte Ltd
- Jing-En Luan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with first and second contact pads and related me...
- Patent number 9,466,557
- Issue date Oct 11, 2016
- STMicroelectronics (Shenzhen) R&D Co. Ltd.
- Jing-En Luan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with redistribution layer and stiffeners and rela...
- Patent number 9,466,550
- Issue date Oct 11, 2016
- STMicroelectronics Pte Ltd
- Jing-En Luan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensing device with interconnect layer gap
- Patent number 9,455,292
- Issue date Sep 27, 2016
- STMicroelectronics Pte Ltd
- Jing-En Luan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor device with aligned IR filter and dielectric layer and...
- Patent number 9,419,047
- Issue date Aug 16, 2016
- STMicroelectronics (Shenzhen) R&D Co., Ltd.
- Jing-En Luan
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Image sensor device with flexible interconnect layer and related me...
- Patent number 9,385,153
- Issue date Jul 5, 2016
- STMicroelectronics Pte Ltd
- Jing-En Luan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image detector with lens assembly and related methods
- Patent number 9,313,386
- Issue date Apr 12, 2016
- STMicroelectronics (Shenzhen) R&D Co. Ltd.
- Jing-En Luan
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Electronic device with first and second contact pads and related me...
- Patent number 9,287,227
- Issue date Mar 15, 2016
- STMicroelectronics (Shenzhen) R&D Co. Ltd.
- Jing-En Luan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadless surface mount assembly package and method of manufacturing...
- Patent number 9,177,939
- Issue date Nov 3, 2015
- STMicroelectronics (Shenzhen) R&D Co., Ltd.
- Jing-En Luan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Imaging device with adhesive filling openings and related methods
- Patent number 9,083,872
- Issue date Jul 14, 2015
- STMicroelectronics (Shenzhen) R&D Co. Ltd.
- Jing-En Luan
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Optical sensor package with through vias
- Patent number 8,890,269
- Issue date Nov 18, 2014
- STMicroelectronics Pte Ltd
- Jing-En Luan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package with coplanarity controlling feature
- Patent number 8,836,143
- Issue date Sep 16, 2014
- STMicroelectronics Asia Pacific PTE Ltd.
- Jing-en Luan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MOLDED PROXIMITY SENSOR
- Publication number 20190391264
- Publication date Dec 26, 2019
- STMicroelectronics Pte Ltd
- Jing-En LUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLUE BLEEDING PREVENTION CAP FOR OPTICAL SENSOR PACKAGES
- Publication number 20180062003
- Publication date Mar 1, 2018
- STMicroelectronics Pte Ltd
- Jing-En LUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS FOR FORMING SAME
- Publication number 20170186674
- Publication date Jun 29, 2017
- STMicroelectronics Pte Ltd
- Jing-En Luan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROXIMITY SENSOR, ELECTRONIC APPARATUS AND METHOD FOR MANUFACTURING...
- Publication number 20170123101
- Publication date May 4, 2017
- STMicroelectronics Pte Ltd
- Jing-En LUAN
- G01 - MEASURING TESTING
Information Patent Application
PROXIMITY SENSOR, ELECTRONIC APPARATUS AND METHOD FOR MANUFACTURING...
- Publication number 20170123064
- Publication date May 4, 2017
- STMicroelectronics Pte Ltd
- Jing-En LUAN
- G01 - MEASURING TESTING
Information Patent Application
PROXIMITY SENSOR AND MANUFACTURING METHOD THEREFOR
- Publication number 20170052040
- Publication date Feb 23, 2017
- STMicroelectronics Pte Ltd
- Jing-En LUAN
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DIE ATTACHMENT WITH EMBEDDED STUD BUMPS IN ATTACHMENT...
- Publication number 20170053856
- Publication date Feb 23, 2017
- STMicroelectronics Pte Ltd
- Jing-En Luan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND METHOD FOR MANUFAC...
- Publication number 20170040286
- Publication date Feb 9, 2017
- STMicroelectronics Pte Ltd
- Jing-En Luan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Device with First and Second Contact Pads and Related Me...
- Publication number 20160372406
- Publication date Dec 22, 2016
- STMicroelectronics (Shenzhen) R&D Co. Ltd.
- Jing-En Luan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Device with Redistribution Layer and Stiffeners and Rela...
- Publication number 20160372426
- Publication date Dec 22, 2016
- STMicroelectronics Pte Ltd
- Jing-En Luan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PACKAGING FOR PROXIMITY SENSOR
- Publication number 20160190380
- Publication date Jun 30, 2016
- STMicroelectronics Pte Ltd
- Jing-En LUAN
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND METHOD FOR MANUFAC...
- Publication number 20160190097
- Publication date Jun 30, 2016
- STMicroelectronics Pte Ltd
- Jing-En Luan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED PROXIMITY SENSOR
- Publication number 20160187483
- Publication date Jun 30, 2016
- STMicroelectronics Pte Ltd
- Jing-En LUAN
- G01 - MEASURING TESTING
Information Patent Application
ELECTRONIC DEVICE WITH FIRST AND SECOND CONTACT PADS AND RELATED ME...
- Publication number 20160111354
- Publication date Apr 21, 2016
- STMicroelectronics (Shenzhen) R&D Co., Ltd.
- Jing-En LUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR DEVICE WITH FLEXIBLE INTERCONNECT LAYER AND RELATED ME...
- Publication number 20160104737
- Publication date Apr 14, 2016
- STMicroelectronics Pte Ltd
- Jing-En Luan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSING DEVICE WITH INTERCONNECT LAYER GAP AND RELATED METHODS
- Publication number 20160104738
- Publication date Apr 14, 2016
- STMicroelectronics Pte Ltd
- Jing-En Luan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH REDISTRIBUTION LAYER AND STIFFENERS AND RELA...
- Publication number 20160104656
- Publication date Apr 14, 2016
- STMicroelectronics Pte Ltd
- Jing-En Luan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAMERA MODULE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20150380454
- Publication date Dec 31, 2015
- STMicroelectronics (Shenzhen) R&D Co. Ltd.
- Jing-En Luan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH FIRST AND SECOND CONTACT PADS AND RELATED ME...
- Publication number 20150155215
- Publication date Jun 4, 2015
- STMICROELECTRONICS (SHENZHEN) MANUFACTURING CO. LTD
- Jing-En LUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADLESS SURFACE MOUNT ASSEMBLY PACKAGE AND METHOD OF MANUFACTURING...
- Publication number 20150145110
- Publication date May 28, 2015
- STMicroelectronics (Shenzhen) R&D Co., Ltd.
- Jing-En LUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE DETECTOR WITH LENS ASSEMBLY AND RELATED METHODS
- Publication number 20150029384
- Publication date Jan 29, 2015
- STMICROELECTRONICS (SHENZHEN) MANUFACTURING CO. LTD
- Jing-En LUAN
- G02 - OPTICS
Information Patent Application
PROXIMITY DETECTOR DEVICE WITH INTERCONNECT LAYERS AND RELATED METHODS
- Publication number 20140319548
- Publication date Oct 30, 2014
- STMICROELECTRONICS (SHENZHEN) MANUFACTURING CO. LTD
- Jing-En LUAN
- G01 - MEASURING TESTING
Information Patent Application
IMAGE SENSOR DEVICE WITH ALIGNED IR FILTER AND DIELECTRIC LAYER AND...
- Publication number 20140184809
- Publication date Jul 3, 2014
- STMICROELECTRONICS (SHENZHEN) MANUFACTURING Co., Ltd.
- Jing-En LUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGING DEVICE WITH ADHESIVE FILLING OPENINGS AND RELATED METHODS
- Publication number 20140092297
- Publication date Apr 3, 2014
- STMICROELECTRONICS (SHENZHEN) MANUFACTURING Co., Ltd.
- Jing-En LUAN
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
WAFER LEVEL OPTICAL SENSOR PACKAGE AND LOW PROFILE CAMERA MODULE, A...
- Publication number 20130320471
- Publication date Dec 5, 2013
- STMicroelectronics Pte Ltd
- Jing-En Luan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF CHIP PACKAGE WITH COPLANARITY CONTROLLING F...
- Publication number 20130009326
- Publication date Jan 10, 2013
- STMIROELECTRONICS ASIA PACIFIC PTE LTD.
- Jing-en Luan
- H01 - BASIC ELECTRIC ELEMENTS

Jing-En LUAN

Person

Patents Grantslast 30 patents

Molded proximity sensor

Molded proximity sensor

Semiconductor die attachment with embedded stud bumps in attachment...

Proximity sensor and manufacturing method therefor

Proximity sensor, electronic apparatus and method for manufacturing...

Camera module and method of manufacturing the same

Electronic device with periphery contact pads surrounding central c...

Proximity detector device with interconnect layers and related methods

Semiconductor device, semiconductor package, and method for manufac...

Electronic device with redistribution layer and stiffeners and rela...

Proximity sensor, electronic apparatus and method for manufacturing...

Wafer level packaging for proximity sensor

Semiconductor device, semiconductor package, and method for manufac...

Electronic device with first and second contact pads and related me...

Electronic device with redistribution layer and stiffeners and rela...

Image sensing device with interconnect layer gap

Image sensor device with aligned IR filter and dielectric layer and...

Image sensor device with flexible interconnect layer and related me...

Image detector with lens assembly and related methods

Electronic device with first and second contact pads and related me...

Leadless surface mount assembly package and method of manufacturing...

Imaging device with adhesive filling openings and related methods

Optical sensor package with through vias

Chip package with coplanarity controlling feature

Patents Applicationslast 30 patents

MOLDED PROXIMITY SENSOR

GLUE BLEEDING PREVENTION CAP FOR OPTICAL SENSOR PACKAGES

SEMICONDUCTOR PACKAGES AND METHODS FOR FORMING SAME

PROXIMITY SENSOR, ELECTRONIC APPARATUS AND METHOD FOR MANUFACTURING...

PROXIMITY SENSOR, ELECTRONIC APPARATUS AND METHOD FOR MANUFACTURING...

PROXIMITY SENSOR AND MANUFACTURING METHOD THEREFOR

SEMICONDUCTOR DIE ATTACHMENT WITH EMBEDDED STUD BUMPS IN ATTACHMENT...

SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND METHOD FOR MANUFAC...

Electronic Device with First and Second Contact Pads and Related Me...

Electronic Device with Redistribution Layer and Stiffeners and Rela...

WAFER LEVEL PACKAGING FOR PROXIMITY SENSOR

SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND METHOD FOR MANUFAC...

MOLDED PROXIMITY SENSOR

ELECTRONIC DEVICE WITH FIRST AND SECOND CONTACT PADS AND RELATED ME...

IMAGE SENSOR DEVICE WITH FLEXIBLE INTERCONNECT LAYER AND RELATED ME...

IMAGE SENSING DEVICE WITH INTERCONNECT LAYER GAP AND RELATED METHODS

ELECTRONIC DEVICE WITH REDISTRIBUTION LAYER AND STIFFENERS AND RELA...

CAMERA MODULE AND METHOD OF MANUFACTURING THE SAME

ELECTRONIC DEVICE WITH FIRST AND SECOND CONTACT PADS AND RELATED ME...

LEADLESS SURFACE MOUNT ASSEMBLY PACKAGE AND METHOD OF MANUFACTURING...

IMAGE DETECTOR WITH LENS ASSEMBLY AND RELATED METHODS

PROXIMITY DETECTOR DEVICE WITH INTERCONNECT LAYERS AND RELATED METHODS

IMAGE SENSOR DEVICE WITH ALIGNED IR FILTER AND DIELECTRIC LAYER AND...

IMAGING DEVICE WITH ADHESIVE FILLING OPENINGS AND RELATED METHODS

WAFER LEVEL OPTICAL SENSOR PACKAGE AND LOW PROFILE CAMERA MODULE, A...

MANUFACTURING METHOD OF CHIP PACKAGE WITH COPLANARITY CONTROLLING F...