Jing Jing

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Opposite-facing interleaved transformer design
- Patent number 12,073,973
- Issue date Aug 27, 2024
- Xilinx, Inc.
- Jing Jing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductor design in active 3D stacking technology
- Patent number 11,043,470
- Issue date Jun 22, 2021
- Xilinx, Inc.
- Jing Jing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for providing capacitor structures in an integr...
- Patent number 10,847,604
- Issue date Nov 24, 2020
- Xilinx, Inc.
- Jing Jing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-port inductors and transformers for accurately predicting vol...
- Patent number 10,715,153
- Issue date Jul 14, 2020
- Xilinx, Inc.
- Adebabay M. Bekele
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Systems and methods for providing capacitor structures in an integr...
- Patent number 10,332,885
- Issue date Jun 25, 2019
- Xilinx, Inc.
- Jing Jing
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Circuits for and methods of implementing an inductor and a pattern...
- Patent number 10,217,703
- Issue date Feb 26, 2019
- Xilinx, Inc.
- Parag Upadhyaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate noise isolation structures for semiconductor devices
- Patent number 9,923,051
- Issue date Mar 20, 2018
- Xilinx, Inc.
- Jing Jing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor structure in an integrated circuit
- Patent number 9,524,964
- Issue date Dec 20, 2016
- Xilinx, Inc.
- Jing Jing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High quality factor inductive and capacitive circuit structure
- Patent number 9,270,247
- Issue date Feb 23, 2016
- Xilinx, Inc.
- Jing Jing
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Devices and methods for tuning an inductor
- Patent number 8,922,309
- Issue date Dec 30, 2014
- Xilinx, Inc.
- Jing Jing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductor structure with a current return encompassing a coil
- Patent number 8,860,180
- Issue date Oct 14, 2014
- Xilinx, Inc.
- Jing Jing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit inductor having a patterned ground shield
- Patent number 8,427,266
- Issue date Apr 23, 2013
- Xilinx, Inc.
- Zhaoyin D. Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film capacitors
- Patent number 6,404,615
- Issue date Jun 11, 2002
- Intarsia Corporation
- Sunil D. Wijeyesekera
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE NOISE ISOLATION STRUCTURES FOR ELECTRONIC DEVICES
- Publication number 20250185311
- Publication date Jun 5, 2025
- Xilinx, Inc.
- Jing JING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTOR CIRCUITRY
- Publication number 20250104904
- Publication date Mar 27, 2025
- Xilinx, Inc.
- Jing Jing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE WITH INTEGRATED EMBEDDED OFF-DIE INDUCTORS
- Publication number 20240071958
- Publication date Feb 29, 2024
- Xilinx, Inc.
- Hong SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE WITH INTEGRATED OFF-DIE INDUCTOR
- Publication number 20230268306
- Publication date Aug 24, 2023
- Xilinx, Inc.
- Jing Jing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTOR DESIGN IN ACTIVE 3D STACKING TECHNOLOGY
- Publication number 20210159212
- Publication date May 27, 2021
- Xilinx, Inc.
- Jing JING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUITS FOR AND METHODS OF IMPLEMENTING AN INDUCTOR AND A PATTERN...
- Publication number 20180190584
- Publication date Jul 5, 2018
- Xilinx, Inc.
- Parag Upadhyaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE NOISE ISOLATION STRUCTURES FOR SEMICONDUCTOR DEVICES
- Publication number 20180083096
- Publication date Mar 22, 2018
- Xilinx, Inc.
- Jing Jing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT WITH SHIELDING STRUCTURES
- Publication number 20180076134
- Publication date Mar 15, 2018
- Xilinx, Inc.
- Jing Jing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR STRUCTURE IN AN INTEGRATED CIRCUIT
- Publication number 20160049393
- Publication date Feb 18, 2016
- Xilinx, Inc.
- Jing Jing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH QUALITY FACTOR INDUCTIVE AND CAPACITIVE CIRCUIT STRUCTURE
- Publication number 20150145615
- Publication date May 28, 2015
- Xilinx, Inc.
- Jing Jing
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
INDUCTOR STRUCTURE WITH PRE-DEFINED CURRENT RETURN
- Publication number 20140117494
- Publication date May 1, 2014
- Xilinx, Inc.
- Jing Jing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT INDUCTOR HAVING A PATTERNED GROUND SHIELD
- Publication number 20120242446
- Publication date Sep 27, 2012
- Xilinx, Inc.
- Zhaoyin D. Wu
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Opposite-facing interleaved transformer design

Inductor design in active 3D stacking technology

Systems and methods for providing capacitor structures in an integr...

Multi-port inductors and transformers for accurately predicting vol...

Systems and methods for providing capacitor structures in an integr...

Circuits for and methods of implementing an inductor and a pattern...

Substrate noise isolation structures for semiconductor devices

Capacitor structure in an integrated circuit

High quality factor inductive and capacitive circuit structure

Devices and methods for tuning an inductor

Inductor structure with a current return encompassing a coil

Integrated circuit inductor having a patterned ground shield

Thin film capacitors

Patents Applicationslast 30 patents

SUBSTRATE NOISE ISOLATION STRUCTURES FOR ELECTRONIC DEVICES

INDUCTOR CIRCUITRY

CHIP PACKAGE WITH INTEGRATED EMBEDDED OFF-DIE INDUCTORS

CHIP PACKAGE WITH INTEGRATED OFF-DIE INDUCTOR

INDUCTOR DESIGN IN ACTIVE 3D STACKING TECHNOLOGY

CIRCUITS FOR AND METHODS OF IMPLEMENTING AN INDUCTOR AND A PATTERN...

SUBSTRATE NOISE ISOLATION STRUCTURES FOR SEMICONDUCTOR DEVICES

INTEGRATED CIRCUIT WITH SHIELDING STRUCTURES

CAPACITOR STRUCTURE IN AN INTEGRATED CIRCUIT

HIGH QUALITY FACTOR INDUCTIVE AND CAPACITIVE CIRCUIT STRUCTURE

INDUCTOR STRUCTURE WITH PRE-DEFINED CURRENT RETURN

INTEGRATED CIRCUIT INDUCTOR HAVING A PATTERNED GROUND SHIELD