Jing Ruei Lu

Person

Taipei City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Carrier tape system and methods of making and using the same
- Patent number 11,725,120
- Issue date Aug 15, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Ming Kuo
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Package-on-package with redistribution structure
- Patent number 11,417,643
- Issue date Aug 16, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chih Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package structure having polymer-based material for warp...
- Patent number 11,133,285
- Issue date Sep 28, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming package-on-package structures
- Patent number 10,515,941
- Issue date Dec 24, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chih Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package structure having polymer-based material for warp...
- Patent number 10,269,763
- Issue date Apr 23, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ring structure for chip packaging
- Patent number 9,887,144
- Issue date Feb 6, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and methods of forming the same
- Patent number 9,859,265
- Issue date Jan 2, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chih Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages with die stack including exposed molding underfill
- Patent number 9,793,242
- Issue date Oct 17, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chih Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip packaging
- Patent number 9,666,556
- Issue date May 30, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chih Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package structure having polymer-based material for warp...
- Patent number 9,627,355
- Issue date Apr 18, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package on packaging structure and methods of making same
- Patent number 9,583,474
- Issue date Feb 28, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package structure having polymer-based material for warp...
- Patent number 9,349,663
- Issue date May 24, 2016
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rotating curing
- Patent number 9,147,584
- Issue date Sep 29, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing Ruei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip BGA assembly process
- Patent number 8,993,378
- Issue date Mar 31, 2015
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Chih Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package on packaging structure and methods of making same
- Patent number 8,946,888
- Issue date Feb 3, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for semiconductor packages with improved warpage
- Patent number 8,288,208
- Issue date Oct 16, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chih Liu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CARRIER TAPE SYSTEM AND METHODS OF MAKING AND USING THE SAME
- Publication number 20230340298
- Publication date Oct 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Ming Kuo
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CARRIER TAPE SYSTEM AND METHODS OF MAKING AND USING THE SAME
- Publication number 20210134635
- Publication date May 6, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Ming Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20200066704
- Publication date Feb 27, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chih Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE STRUCTURE HAVING POLYMER-BASED MATERIAL FOR WARP...
- Publication number 20190221544
- Publication date Jul 18, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package Structure and Methods of Forming the Same
- Publication number 20180122791
- Publication date May 3, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chih Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packages with Die Stack Including Exposed Molding Underfill
- Publication number 20180033775
- Publication date Feb 1, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chih Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE STRUCTURE HAVING POLYMER-BASED MATERIAL FOR WARP...
- Publication number 20170194289
- Publication date Jul 6, 2017
- Taiwan Semiconductor Manufacturing Co., LTD
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flip Chip Packaging
- Publication number 20160379955
- Publication date Dec 29, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chih Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE STRUCTURE HAVING POLYMER-BASED MATERIAL FOR WARP...
- Publication number 20160247782
- Publication date Aug 25, 2016
- Taiwan Semiconductor Manufacturing Co., LTD
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package Structure and Methods of Forming the Same
- Publication number 20150357309
- Publication date Dec 10, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chih Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package on Packaging Structure and Methods of Making Same
- Publication number 20150200190
- Publication date Jul 16, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packages with Die Stack Including Exposed Molding Underfill
- Publication number 20150187734
- Publication date Jul 2, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chih Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE STRUCTURE HAVING POLYMER-BASED MATERIAL FOR WARP...
- Publication number 20140001652
- Publication date Jan 2, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tse CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Rotating Curing
- Publication number 20130119565
- Publication date May 16, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing Ruei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package on Packaging Structure and Methods of Making Same
- Publication number 20130082372
- Publication date Apr 4, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RING STRUCTURE FOR CHIP PACKAGING
- Publication number 20130062752
- Publication date Mar 14, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Yi LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP BGA ASSEMBLY PROCESS
- Publication number 20130059416
- Publication date Mar 7, 2013
- Taiwan Semiconductor Manufacturing Co., LTD
- Yu-Chih LIU
- H01 - BASIC ELECTRIC ELEMENTS

Jing Ruei Lu

Person

Patents Grantslast 30 patents

Carrier tape system and methods of making and using the same

Package-on-package with redistribution structure

Package-on-package structure having polymer-based material for warp...

Methods of forming package-on-package structures

Package-on-package structure having polymer-based material for warp...

Ring structure for chip packaging

Package structure and methods of forming the same

Packages with die stack including exposed molding underfill

Flip chip packaging

Package-on-package structure having polymer-based material for warp...

Package on packaging structure and methods of making same

Package-on-package structure having polymer-based material for warp...

Rotating curing

Flip-chip BGA assembly process

Package on packaging structure and methods of making same

Apparatus and methods for semiconductor packages with improved warpage

Patents Applicationslast 30 patents

CARRIER TAPE SYSTEM AND METHODS OF MAKING AND USING THE SAME

CARRIER TAPE SYSTEM AND METHODS OF MAKING AND USING THE SAME

PACKAGE STRUCTURE AND METHODS OF FORMING THE SAME

PACKAGE-ON-PACKAGE STRUCTURE HAVING POLYMER-BASED MATERIAL FOR WARP...

Package Structure and Methods of Forming the Same

Packages with Die Stack Including Exposed Molding Underfill

PACKAGE-ON-PACKAGE STRUCTURE HAVING POLYMER-BASED MATERIAL FOR WARP...

Flip Chip Packaging

PACKAGE-ON-PACKAGE STRUCTURE HAVING POLYMER-BASED MATERIAL FOR WARP...

Package Structure and Methods of Forming the Same

Package on Packaging Structure and Methods of Making Same

Packages with Die Stack Including Exposed Molding Underfill

PACKAGE-ON-PACKAGE STRUCTURE HAVING POLYMER-BASED MATERIAL FOR WARP...

Rotating Curing

Package on Packaging Structure and Methods of Making Same

RING STRUCTURE FOR CHIP PACKAGING

FLIP-CHIP BGA ASSEMBLY PROCESS