Jing Shi

Person

Carlsbad, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Assembly of multi-chip modules with proximity connectors using refl...
- Patent number 8,648,463
- Issue date Feb 11, 2014
- Oracle International Corporation
- Hiren D. Thacker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct feedback equalization with dynamic referencing
- Patent number 8,634,500
- Issue date Jan 21, 2014
- Oracle International Corporation
- Zuxu Qin
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Assembly of multi-chip modules using sacrificial features
- Patent number 8,487,429
- Issue date Jul 16, 2013
- Oracle America, Inc.
- Jing Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package with plank stack of semiconductor dies
- Patent number 8,390,109
- Issue date Mar 5, 2013
- Oracle America, Inc.
- Darko R. Popovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanical coupling in a multi-chip module using magnetic components
- Patent number 8,334,149
- Issue date Dec 18, 2012
- Oracle America, Inc.
- Jing Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-locking features in a multi-chip module
- Patent number 8,315,065
- Issue date Nov 20, 2012
- Oracle America, Inc.
- Jing Shi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mechanical coupling in a multi-chip module using magnetic components
- Patent number 8,188,581
- Issue date May 29, 2012
- Oracle America, Inc.
- Jing Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Base plate for use in a multi-chip module
- Patent number 8,164,917
- Issue date Apr 24, 2012
- Oracle America, Inc.
- Jing Shi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Capactive connectors with enhanced capacitive coupling
- Patent number 7,863,743
- Issue date Jan 4, 2011
- Oracle America, Inc.
- Jing Shi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Direct Feedback Equalization with Dynamic Referencing
- Publication number 20130259162
- Publication date Oct 3, 2013
- Zuxu Qin
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
MECHANICAL COUPLING IN A MULTI-CHIP MODULE USING MAGNETIC COMPONENTS
- Publication number 20120220056
- Publication date Aug 30, 2012
- ORACLE INTERNATIONAL CORPORATION
- Jing Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE WITH PLANK STACK OF SEMICONDUCTOR DIES
- Publication number 20120211878
- Publication date Aug 23, 2012
- Oracle International Corporation
- Darko R. Popovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASSEMBLY OF MULTI-CHIP MODULES USING REFLOWABLE FEATURES
- Publication number 20110278718
- Publication date Nov 17, 2011
- Oracle International Corporation
- Hiren D. Thacker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BASE PLATE FOR USE IN A MULTI-CHIP MODULE
- Publication number 20110149539
- Publication date Jun 23, 2011
- SUN MICROSYSTEMS, INC.
- Jing Shi
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
MECHANICAL COUPLING IN A MULTI-CHIP MODULE USING MAGNETIC COMPONENTS
- Publication number 20110074011
- Publication date Mar 31, 2011
- SUN MICROSYSTEMS, INC.
- Jing Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-LOCKING FEATURES IN A MULTI-CHIP MODULE
- Publication number 20110075380
- Publication date Mar 31, 2011
- SUN MICROSYSTEMS, INC.
- Jing Shi
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
ASSEMBLY OF MULTI-CHIP MODULES USING SACRIFICIAL FEATURES
- Publication number 20110068479
- Publication date Mar 24, 2011
- SUN MICROSYSTEMS, INC.
- Jing Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACTIVE CONNECTORS WITH ENHANCED CAPACITIVE COUPLING
- Publication number 20100327460
- Publication date Dec 30, 2010
- SUN MICROSYSTEMS, INC.
- Jing Shi
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Assembly of multi-chip modules with proximity connectors using refl...

Direct feedback equalization with dynamic referencing

Assembly of multi-chip modules using sacrificial features

Chip package with plank stack of semiconductor dies

Mechanical coupling in a multi-chip module using magnetic components

Self-locking features in a multi-chip module

Mechanical coupling in a multi-chip module using magnetic components

Base plate for use in a multi-chip module

Capactive connectors with enhanced capacitive coupling

Patents Applicationslast 30 patents

Direct Feedback Equalization with Dynamic Referencing

MECHANICAL COUPLING IN A MULTI-CHIP MODULE USING MAGNETIC COMPONENTS

CHIP PACKAGE WITH PLANK STACK OF SEMICONDUCTOR DIES

ASSEMBLY OF MULTI-CHIP MODULES USING REFLOWABLE FEATURES

BASE PLATE FOR USE IN A MULTI-CHIP MODULE

MECHANICAL COUPLING IN A MULTI-CHIP MODULE USING MAGNETIC COMPONENTS

SELF-LOCKING FEATURES IN A MULTI-CHIP MODULE

ASSEMBLY OF MULTI-CHIP MODULES USING SACRIFICIAL FEATURES

CAPACTIVE CONNECTORS WITH ENHANCED CAPACITIVE COUPLING