Jing-Yuan Lin

Person

Taipei, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method for forming a semiconductor device including forming a first...
- Patent number 12,266,612
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Pin Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacture overlay mark using laser marking process for...
- Patent number 12,249,581
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method
- Patent number 12,237,238
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dummy structure of stacked and bonded semiconductor device
- Patent number 12,237,291
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company
- Li-Hui Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin-film-deposition equipment
- Patent number 12,198,904
- Issue date Jan 14, 2025
- SKY TECH INC.
- Jing-Cheng Lin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Package structure
- Patent number 12,191,287
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit with latch-up immunity
- Patent number 12,191,306
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jing-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out wafer level package structure
- Patent number 12,170,242
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming integrated fan-out packages with built-in heat sink
- Patent number 12,148,661
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deposition method for tuning magnetic field distribution of deposit...
- Patent number 12,129,541
- Issue date Oct 29, 2024
- SKY TECH INC.
- Jing-Cheng Lin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Bonded semiconductor structures
- Patent number 12,131,898
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Powder-atomic-layer-deposition device with knocker
- Patent number 12,123,092
- Issue date Oct 22, 2024
- SKY TECH INC.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Parallelism-adjustable bonding machine
- Patent number 12,125,721
- Issue date Oct 22, 2024
- SKY TECH INC.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated chip including a tunnel dielectric layer which has diffe...
- Patent number 12,114,503
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jui-Yu Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolation structures in multi-gate semiconductor devices and method...
- Patent number 12,080,780
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Hao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underfill structure for semiconductor packages and methods of formi...
- Patent number 12,080,617
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having thermal conductive pattern
- Patent number 12,068,224
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package structures with recesses in molding comp...
- Patent number 12,057,432
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding machine with movable suction modules
- Patent number 12,040,215
- Issue date Jul 16, 2024
- SKY TECH INC.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Atomic layer deposition apparatus for powders
- Patent number 12,031,208
- Issue date Jul 9, 2024
- SKY TECH INC.
- Jing-Cheng Lin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Atomic layer deposition apparatus for coating on fine powders
- Patent number 12,006,571
- Issue date Jun 11, 2024
- SKY TECH INC.
- Jing-Cheng Lin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Test structure and test method thereof
- Patent number 11,996,338
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jing-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Powder atomic layer deposition apparatus for blowing powders
- Patent number 11,987,883
- Issue date May 21, 2024
- SKY TECH INC.
- Jing-Cheng Lin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Deposition equipment with shielding mechanism
- Patent number 11,981,990
- Issue date May 14, 2024
- SKY TECH INC.
- Jing-Cheng Lin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Shielding device and thin-film-deposition equipment with the same
- Patent number 11,972,936
- Issue date Apr 30, 2024
- SKY TECH INC.
- Jing-Cheng Lin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Shielding device and thin-film-deposition equipment with the same
- Patent number 11,961,724
- Issue date Apr 16, 2024
- SKY TECH INC.
- Jing-Cheng Lin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate-bonding device
- Patent number 11,961,753
- Issue date Apr 16, 2024
- SKY TECH INC.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 11,955,459
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Hang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Powder atomic layer deposition equipment with quick release function
- Patent number 11,952,662
- Issue date Apr 9, 2024
- SKY TECH INC.
- Jing-Cheng Lin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
MEMS device, manufacturing method of the same, and integrated MEMS...
- Patent number 11,939,212
- Issue date Mar 26, 2024
- Industrial Technology Research Institute
- Heng-chung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT WITH LATCH-UP IMMUNITY
- Publication number 20250098296
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Yi Lin
Information Patent Application
METHOD FOR FORMING PACKAGE STRUCTURE
- Publication number 20250087648
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jing-Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT WAFER LEVEL PACKAGE STRUCTURE
- Publication number 20250070004
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Forming a Semiconductor Device Having TSV Formed Through...
- Publication number 20240387393
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Pin Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20240379429
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- JING-CHENG LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATION STRUCTURES IN MULTI-GATE SEMICONDUCTOR DEVICES AND METHOD...
- Publication number 20240371972
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Hao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES HAVING THERMAL CONDUCTIVE PATTERN
- Publication number 20240363488
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING EQUIPMENT AND ITS CONTROL SYSTEM AND CONTROL METHOD
- Publication number 20240361745
- Publication date Oct 31, 2024
- Industrial Technology Research Institute
- Jing-Han LIN
- G05 - CONTROLLING REGULATING
Information Patent Application
Isolation Structures
- Publication number 20240332408
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Feng-Ming Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEST STRUCTURE AND TEST METHOD THEREOF
- Publication number 20240274479
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Yi LIN
- G01 - MEASURING TESTING
Information Patent Application
Memory Device with Improved Margin and Performance and Methods of F...
- Publication number 20240260249
- Publication date Aug 1, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Shih-Hao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW POWER PLASMA SYSTEM MONITOR METHOD
- Publication number 20240242946
- Publication date Jul 18, 2024
- SKY TECH INC.
- JING-CHENG LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING PACKAGE STRUCTURE
- Publication number 20240234372
- Publication date Jul 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Hang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING SEMICONDUCTOR DEVICE HAVING REDUCED BUMP HEIGHT VA...
- Publication number 20240222318
- Publication date Jul 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng LIN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEPARATION METHOD OF BONDED SUBSTRATES
- Publication number 20240194492
- Publication date Jun 13, 2024
- SKY TECH INC.
- JUNG-HUA CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Forming a Semiconductor Device Having TSV Formed Through...
- Publication number 20240105632
- Publication date Mar 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Pin Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL OXIDE LAYERED STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20240096642
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20240096816
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20240087954
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- JING-CHENG LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE WITH CONDUCTIVE SHIELDING FILM
- Publication number 20240079381
- Publication date Mar 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEPOSITION EQUIPMENT WITH SHIELDING MECHANISM
- Publication number 20240068089
- Publication date Feb 29, 2024
- SKY TECH INC.
- JING-CHENG LIN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
WAFER CARRIER WITH ADJUSTABLE ALIGNMENT DEVICES AND DEPOSITION EQUI...
- Publication number 20240060182
- Publication date Feb 22, 2024
- SKY TECH INC.
- JING-CHENG LIN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
BONDING MACHINE WITH MOVABLE SUCTION MODULES
- Publication number 20240021462
- Publication date Jan 18, 2024
- SKY TECH INC.
- JING-CHENG LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240014192
- Publication date Jan 11, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jing-Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING MACHINE FOR WARPED SUBSTRATES
- Publication number 20240006196
- Publication date Jan 4, 2024
- SKY TECH INC.
- JING-CHENG LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING MACHINE WITH HORIZONTAL CORRECTION FUNCTION AND HORIZONTAL...
- Publication number 20230382071
- Publication date Nov 30, 2023
- SKY TECH INC.
- JING-CHENG LIN
- B30 - PRESSES
Information Patent Application
INFRARED DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230366739
- Publication date Nov 16, 2023
- Industrial Technology Research Institute
- Heng-Chung CHANG
- G01 - MEASURING TESTING
Information Patent Application
METHOD FOR CONTROLLING SUBSTRATE CARRIER OF DEPOSITION APPARATUS
- Publication number 20230366090
- Publication date Nov 16, 2023
- SKY TECH INC.
- JING-CHENG LIN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
TEST STRUCTURE AND TEST METHOD THEREOF
- Publication number 20230369143
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Yi LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PARALLELISM-ADJUSTABLE BONDING MACHINE
- Publication number 20230352323
- Publication date Nov 2, 2023
- JING-CHENG LIN
- H01 - BASIC ELECTRIC ELEMENTS

Jing-Yuan Lin

Person

Patents Grantslast 30 patents

Method for forming a semiconductor device including forming a first...

Method of manufacture overlay mark using laser marking process for...

Package structure and method

Dummy structure of stacked and bonded semiconductor device

Thin-film-deposition equipment

Package structure

Integrated circuit with latch-up immunity

Fan-out wafer level package structure

Method of forming integrated fan-out packages with built-in heat sink

Deposition method for tuning magnetic field distribution of deposit...

Bonded semiconductor structures

Powder-atomic-layer-deposition device with knocker

Parallelism-adjustable bonding machine

Integrated chip including a tunnel dielectric layer which has diffe...

Isolation structures in multi-gate semiconductor devices and method...

Underfill structure for semiconductor packages and methods of formi...

Semiconductor packages having thermal conductive pattern

Integrated fan-out package structures with recesses in molding comp...

Bonding machine with movable suction modules

Atomic layer deposition apparatus for powders

Atomic layer deposition apparatus for coating on fine powders

Test structure and test method thereof

Powder atomic layer deposition apparatus for blowing powders

Deposition equipment with shielding mechanism

Shielding device and thin-film-deposition equipment with the same

Shielding device and thin-film-deposition equipment with the same

Substrate-bonding device

Package structure

Powder atomic layer deposition equipment with quick release function

MEMS device, manufacturing method of the same, and integrated MEMS...

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT WITH LATCH-UP IMMUNITY

METHOD FOR FORMING PACKAGE STRUCTURE

FAN-OUT WAFER LEVEL PACKAGE STRUCTURE

Method for Forming a Semiconductor Device Having TSV Formed Through...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

ISOLATION STRUCTURES IN MULTI-GATE SEMICONDUCTOR DEVICES AND METHOD...

SEMICONDUCTOR PACKAGES HAVING THERMAL CONDUCTIVE PATTERN

PROCESSING EQUIPMENT AND ITS CONTROL SYSTEM AND CONTROL METHOD

Isolation Structures

TEST STRUCTURE AND TEST METHOD THEREOF

Memory Device with Improved Margin and Performance and Methods of F...

LOW POWER PLASMA SYSTEM MONITOR METHOD

METHOD OF FORMING PACKAGE STRUCTURE

METHOD OF MAKING SEMICONDUCTOR DEVICE HAVING REDUCED BUMP HEIGHT VA...

SEPARATION METHOD OF BONDED SUBSTRATES

Method for Forming a Semiconductor Device Having TSV Formed Through...

METAL OXIDE LAYERED STRUCTURE AND METHODS OF FORMING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

CHIP PACKAGE STRUCTURE WITH CONDUCTIVE SHIELDING FILM

DEPOSITION EQUIPMENT WITH SHIELDING MECHANISM

WAFER CARRIER WITH ADJUSTABLE ALIGNMENT DEVICES AND DEPOSITION EQUI...

BONDING MACHINE WITH MOVABLE SUCTION MODULES

PACKAGE STRUCTURE

BONDING MACHINE FOR WARPED SUBSTRATES

BONDING MACHINE WITH HORIZONTAL CORRECTION FUNCTION AND HORIZONTAL...

INFRARED DEVICE AND METHOD FOR MANUFACTURING THE SAME

METHOD FOR CONTROLLING SUBSTRATE CARRIER OF DEPOSITION APPARATUS

TEST STRUCTURE AND TEST METHOD THEREOF

PARALLELISM-ADJUSTABLE BONDING MACHINE