Jinjoo PARK

Person

Shiga, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Substrate for printed circuit board and printed circuit board
- Patent number 10,596,782
- Issue date Mar 24, 2020
- Sumitomo Electric Industries, Ltd.
- Kayo Hashizume
- B32 - LAYERED PRODUCTS
Information Patent Grant
Metal powder, ink, sintered body, substrate for printed circuit boa...
- Patent number 10,307,825
- Issue date Jun 4, 2019
- Sumitomo Electric Industries, Ltd.
- Issei Okada
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Substrate for printed circuit board, printed circuit board, and met...
- Patent number 10,292,265
- Issue date May 14, 2019
- Sumitomo Electric Industries, Ltd.
- Takashi Kasuga
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Substrate for printed wiring board and method for producing the sam...
- Patent number 10,244,627
- Issue date Mar 26, 2019
- Sumitomo Electric Industries, Ltd.
- Kayo Hashizume
- B32 - LAYERED PRODUCTS
Information Patent Grant
Substrate for printed circuit board, printed circuit board, and met...
- Patent number 10,237,976
- Issue date Mar 19, 2019
- Sumitomo Electric Industries, Ltd.
- Takashi Kasuga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate for printed circuit board, printed circuit board, and met...
- Patent number 10,225,931
- Issue date Mar 5, 2019
- Sumitomo Electric Industries, Ltd.
- Kayo Hashizume
- B32 - LAYERED PRODUCTS
Information Patent Grant
Substrate for printed circuit board and method for producing substr...
- Patent number 10,143,083
- Issue date Nov 27, 2018
- Sumitomo Electric Industries, Ltd.
- Motohiko Sugiura
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Substrate for printed circuit board, printed circuit board, and met...
- Patent number 10,076,028
- Issue date Sep 11, 2018
- Sumitomo Electric Industries, Ltd.
- Takashi Kasuga
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate for printed circuit board, printed circuit board, and met...
- Patent number 10,076,032
- Issue date Sep 11, 2018
- Sumitomo Electric Industries, Ltd.
- Takashi Kasuga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate for printed circuit board, printed circuit board, and met...
- Patent number 9,967,976
- Issue date May 8, 2018
- Sumitomo Electric Industries, Ltd.
- Kazuhiro Miyata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for manufacturing the same
- Patent number 8,866,027
- Issue date Oct 21, 2014
- Sumitomo Electric Industries, Ltd.
- Yoshio Oka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible printed wiring board
- Patent number 8,309,853
- Issue date Nov 13, 2012
- Sumitomo Electric Industries, Ltd.
- Yoshio Oka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
COATING DEVICE AND METHOD OF PRODUCING COATED SHEET
- Publication number 20180333739
- Publication date Nov 22, 2018
- Sumitomo Electric Industries, Ltd.
- Kazuhiro MIYATA
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
SUBSTRATE FOR PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD
- Publication number 20180147815
- Publication date May 31, 2018
- Sumitomo Electric Industries, Ltd.
- Kayo HASHIZUME
- B32 - LAYERED PRODUCTS
Information Patent Application
SUBSTRATE FOR PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD, AND MET...
- Publication number 20180124925
- Publication date May 3, 2018
- Sumitomo Electric Industries, Ltd.
- Kayo HASHIZUME
- B32 - LAYERED PRODUCTS
Information Patent Application
METAL POWDER, INK, SINTERED BODY, SUBSTRATE FOR PRINTED CIRCUIT BOA...
- Publication number 20180015547
- Publication date Jan 18, 2018
- Sumitomo Electric Industries, Ltd.
- Issei OKADA
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
SUBSTRATE FOR PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD, AND MET...
- Publication number 20180014403
- Publication date Jan 11, 2018
- Sumitomo Electric Industries, Ltd.
- Takashi KASUGA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE FOR PRINTED WIRING BOARD AND METHOD FOR PRODUCING THE SAM...
- Publication number 20170347464
- Publication date Nov 30, 2017
- Sumitomo Electric Industries, Ltd.
- Kayo HASHIZUME
- B32 - LAYERED PRODUCTS
Information Patent Application
SUBSTRATE FOR PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD, AND MET...
- Publication number 20170347459
- Publication date Nov 30, 2017
- Sumitomo Electric Industries, Ltd.
- Kazuhiro MIYATA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE FOR PRINTED CIRCUIT BOARD AND METHOD FOR PRODUCING SUBSTR...
- Publication number 20170347449
- Publication date Nov 30, 2017
- Sumitomo Electric Industries, Ltd.
- Motohiko SUGIURA
- B82 - NANO-TECHNOLOGY
Information Patent Application
SUBSTRATE FOR PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD, AND MET...
- Publication number 20170290150
- Publication date Oct 5, 2017
- Sumitomo Electric Industries, Ltd.
- Takashi KASUGA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE FOR PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD, AND MET...
- Publication number 20170127516
- Publication date May 4, 2017
- Sumitomo Electric Industries, Ltd.
- Takashi KASUGA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE FOR PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD, AND MET...
- Publication number 20170099732
- Publication date Apr 6, 2017
- Sumitomo Electric Industries, Ltd.
- Takashi KASUGA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE PRINTED WIRING BOARD
- Publication number 20100116525
- Publication date May 13, 2010
- Yoshio Oka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20100044094
- Publication date Feb 25, 2010
- Sumitomo Electric Industries, Ltd.
- Yoshio Oka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Jinjoo PARK

Person

Patents Grantslast 30 patents

Substrate for printed circuit board and printed circuit board

Metal powder, ink, sintered body, substrate for printed circuit boa...

Substrate for printed circuit board, printed circuit board, and met...

Substrate for printed wiring board and method for producing the sam...

Substrate for printed circuit board, printed circuit board, and met...

Substrate for printed circuit board, printed circuit board, and met...

Substrate for printed circuit board and method for producing substr...

Substrate for printed circuit board, printed circuit board, and met...

Substrate for printed circuit board, printed circuit board, and met...

Substrate for printed circuit board, printed circuit board, and met...

Printed wiring board and method for manufacturing the same

Flexible printed wiring board

Patents Applicationslast 30 patents

COATING DEVICE AND METHOD OF PRODUCING COATED SHEET

SUBSTRATE FOR PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD

SUBSTRATE FOR PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD, AND MET...

METAL POWDER, INK, SINTERED BODY, SUBSTRATE FOR PRINTED CIRCUIT BOA...

SUBSTRATE FOR PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD, AND MET...

SUBSTRATE FOR PRINTED WIRING BOARD AND METHOD FOR PRODUCING THE SAM...

SUBSTRATE FOR PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD, AND MET...

SUBSTRATE FOR PRINTED CIRCUIT BOARD AND METHOD FOR PRODUCING SUBSTR...

SUBSTRATE FOR PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD, AND MET...

SUBSTRATE FOR PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD, AND MET...

SUBSTRATE FOR PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD, AND MET...

FLEXIBLE PRINTED WIRING BOARD

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME