JINSOO BAE

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Seongnam-si, KR

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package including stacked chip structure
- Patent number 11,961,824
- Issue date Apr 16, 2024
- Samsung Electronics Co., Ltd.
- Hyunggyun Noh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device
- Patent number 11,735,491
- Issue date Aug 22, 2023
- Samsung Electronics Co., Ltd.
- Hyunggyun Noh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR MEMORY MODULE INCLUDING FIXING STRUCTURE
- Publication number 20240429111
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- Hyunggyun NOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING SAME
- Publication number 20240194563
- Publication date Jun 13, 2024
- Samsung Electronics Co., Ltd.
- Hyunggyun Noh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240194642
- Publication date Jun 13, 2024
- Samsung Electronics Co., Ltd.
- Sungmock HA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20230215779
- Publication date Jul 6, 2023
- Samsung Electronics Co., Ltd.
- Hyunggyun NOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING STACKED CHIP STRUCTURE
- Publication number 20230028943
- Publication date Jan 26, 2023
- Samsung Electronics Co., Ltd.
- HYUNGGYUN NOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE
- Publication number 20220301969
- Publication date Sep 22, 2022
- Samsung Electronics Co., Ltd.
- Hyunggyun NOH
- H01 - BASIC ELECTRIC ELEMENTS