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MEMS DEVICE AND MULTI-LAYERED STRUCTURE
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Publication number 20170210614
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Publication date Jul 27, 2017
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Taiwan Semiconductor Manufacturing company Ltd.
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CHUN-WEN CHENG
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B81 - MICRO-STRUCTURAL TECHNOLOGY
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GYROSCOPE SENSORS
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Publication number 20140283369
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Publication date Sep 25, 2014
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Ting-Hau WU
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G01 - MEASURING TESTING
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Triple-Axis MEMS Accelerometer
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Publication number 20140024160
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Publication date Jan 23, 2014
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Taiwan Semiconductor Manufacturing Company, Ltd.
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Ting-Hau Wu
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B81 - MICRO-STRUCTURAL TECHNOLOGY
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GYROSCOPE SENSORS
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Publication number 20130000409
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Publication date Jan 3, 2013
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Taiwan Semiconductor Manufacturing Company, Ltd.
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Ting-Hau WU
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G01 - MEASURING TESTING
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Method for Reducing Chip Warpage
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Publication number 20120007220
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Publication date Jan 12, 2012
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Taiwan Semiconductor Manufacturing Company, Ltd.
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Ting-Hau Wu
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B81 - MICRO-STRUCTURAL TECHNOLOGY
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Triple-Axis MEMS Accelerometer
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Publication number 20100301433
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Publication date Dec 2, 2010
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Taiwan Semiconductor Manufacturing Company, Ltd.
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Ting-Hau Wu
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B81 - MICRO-STRUCTURAL TECHNOLOGY
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Metal-Ceramic Multilayer Structure
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Publication number 20100258883
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Publication date Oct 14, 2010
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Taiwan Semiconductor Manfacturing Company, Ltd.
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Ting-Hau Wu
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B81 - MICRO-STRUCTURAL TECHNOLOGY
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