Jiun-Yu Lai

Person

Taipei, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Vertical-cavity surface-emitting laser and method for forming the same
- Patent number 12,095,231
- Issue date Sep 17, 2024
- WIN SEMICONDUCTORS CORP.
- Min-Chang Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip structure and manufacturing method thereof
- Patent number 11,935,859
- Issue date Mar 19, 2024
- Xintec Inc.
- Jiun-Yen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and manufacturing method thereof
- Patent number 11,873,212
- Issue date Jan 16, 2024
- Xintec Inc.
- Wei-Luen Suen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Antenna device and manufacturing method thereof
- Patent number 11,695,199
- Issue date Jul 4, 2023
- Xintec Inc.
- Jiun-Yen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and manufacturing method thereof
- Patent number 11,387,201
- Issue date Jul 12, 2022
- Xintec Inc.
- Po-Han Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip structure and manufacturing method thereof
- Patent number 11,309,271
- Issue date Apr 19, 2022
- Xintec Inc.
- Jiun-Yen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical chip package and method for forming the same
- Patent number 11,137,559
- Issue date Oct 5, 2021
- Xintec Inc.
- Jiun-Yen Lai
- G02 - OPTICS
Information Patent Grant
Chip package and manufacturing method thereof
- Patent number 11,107,759
- Issue date Aug 31, 2021
- Xintec Inc.
- Wei-Luen Suen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for polishing substrate
- Patent number 10,272,540
- Issue date Apr 30, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jiun-Yu Lai
- B24 - GRINDING POLISHING
Information Patent Grant
Chip package and manufacturing method thereof
- Patent number 9,972,584
- Issue date May 15, 2018
- Xintec Inc.
- Hsing-Lung Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passive component structure and manufacturing method thereof
- Patent number 9,761,555
- Issue date Sep 12, 2017
- Xintec Inc.
- Jiun-Yen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for polishing substrate
- Patent number 9,669,514
- Issue date Jun 6, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jiun-Yu Lai
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250081668
- Publication date Mar 6, 2025
- XINTEC INC.
- Wei-Luen SUEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20250054849
- Publication date Feb 13, 2025
- XINTEC INC.
- Wei-Luen SUEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250056911
- Publication date Feb 13, 2025
- XINTEC INC.
- Wei-Luen SUEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF MEMS DEVICE
- Publication number 20240351865
- Publication date Oct 24, 2024
- XINTEC INC.
- Jiun-Yen LAI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240109769
- Publication date Apr 4, 2024
- XINTEC INC.
- Wei-Luen SUEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230369362
- Publication date Nov 16, 2023
- XINTEC INC.
- Po-Han LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL-CAVITY SURFACE-EMITTING LASER AND METHOD FOR FORMING THE SAME
- Publication number 20220311212
- Publication date Sep 29, 2022
- WIN SEMICONDUCTORS CORP.
- Min-Chang TU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220157762
- Publication date May 19, 2022
- XINTEC INC.
- Jiun-Yen LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20220069454
- Publication date Mar 3, 2022
- XINTEC INC.
- Jiun-Yen LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20210269303
- Publication date Sep 2, 2021
- XINTEC INC.
- Wei-Luen SUEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20210210538
- Publication date Jul 8, 2021
- XINTEC INC.
- Jiun-Yen LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20210104455
- Publication date Apr 8, 2021
- XINTEC INC.
- Wei-Luen SUEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20210082841
- Publication date Mar 18, 2021
- XINTEC INC.
- Po-Han LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20210035940
- Publication date Feb 4, 2021
- XINTEC INC.
- Jiun-Yen LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20200333542
- Publication date Oct 22, 2020
- XINTEC INC.
- Jiun-Yen LAI
- G02 - OPTICS
Information Patent Application
SYSTEM AND METHOD FOR POLISHING SUBSTRATE
- Publication number 20170246723
- Publication date Aug 31, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jiun-Yu LAI
- B24 - GRINDING POLISHING
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20170207194
- Publication date Jul 20, 2017
- XINTEC INC.
- Hsing-Lung SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR POLISHING SUBSTRATE
- Publication number 20160346899
- Publication date Dec 1, 2016
- Taiwan Semiconductor Manufacturing Co., LTD
- Jiun-Yu LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20160322312
- Publication date Nov 3, 2016
- XINTEC INC.
- Hsing-Lung SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP SCALE SENSING CHIP PACKAGE AND A MANUFACTURING METHOD THEREOF
- Publication number 20160284751
- Publication date Sep 29, 2016
- XINTEC INC.
- Yen-Shih HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVE COMPONENT STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20150214162
- Publication date Jul 30, 2015
- XINTEC INC.
- Jiun-Yen LAI
- H01 - BASIC ELECTRIC ELEMENTS

Jiun-Yu Lai

Person

Patents Grantslast 30 patents

Vertical-cavity surface-emitting laser and method for forming the same

Chip structure and manufacturing method thereof

Chip package and manufacturing method thereof

Antenna device and manufacturing method thereof

Chip package and manufacturing method thereof

Chip structure and manufacturing method thereof

Optical chip package and method for forming the same

Chip package and manufacturing method thereof

System and method for polishing substrate

Chip package and manufacturing method thereof

Passive component structure and manufacturing method thereof

System and method for polishing substrate

Patents Applicationslast 30 patents

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

MANUFACTURING METHOD OF MEMS DEVICE

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

VERTICAL-CAVITY SURFACE-EMITTING LASER AND METHOD FOR FORMING THE SAME

CHIP STRUCTURE AND MANUFACTURING METHOD THEREOF

ANTENNA DEVICE AND MANUFACTURING METHOD THEREOF

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

CHIP STRUCTURE AND MANUFACTURING METHOD THEREOF

OPTICAL CHIP PACKAGE AND METHOD FOR FORMING THE SAME

SYSTEM AND METHOD FOR POLISHING SUBSTRATE

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

SYSTEM AND METHOD FOR POLISHING SUBSTRATE

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

CHIP SCALE SENSING CHIP PACKAGE AND A MANUFACTURING METHOD THEREOF

PASSIVE COMPONENT STRUCTURE AND MANUFACTURING METHOD THEREOF