Membership
Tour
Register
Log in
Jiun-Yu Lai
Follow
Person
Taipei, TW
People
Overview
Industries
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Chip structure and manufacturing method thereof
Patent number
11,935,859
Issue date
Mar 19, 2024
Xintec Inc.
Jiun-Yen Lai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip package and manufacturing method thereof
Patent number
11,873,212
Issue date
Jan 16, 2024
Xintec Inc.
Wei-Luen Suen
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Antenna device and manufacturing method thereof
Patent number
11,695,199
Issue date
Jul 4, 2023
Xintec Inc.
Jiun-Yen Lai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip package and manufacturing method thereof
Patent number
11,387,201
Issue date
Jul 12, 2022
Xintec Inc.
Po-Han Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip structure and manufacturing method thereof
Patent number
11,309,271
Issue date
Apr 19, 2022
Xintec Inc.
Jiun-Yen Lai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Optical chip package and method for forming the same
Patent number
11,137,559
Issue date
Oct 5, 2021
Xintec Inc.
Jiun-Yen Lai
G02 - OPTICS
Information
Patent Grant
Chip package and manufacturing method thereof
Patent number
11,107,759
Issue date
Aug 31, 2021
Xintec Inc.
Wei-Luen Suen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
System and method for polishing substrate
Patent number
10,272,540
Issue date
Apr 30, 2019
Taiwan Semiconductor Manufacturing Co., Ltd
Jiun-Yu Lai
B24 - GRINDING POLISHING
Information
Patent Grant
Chip package and manufacturing method thereof
Patent number
9,972,584
Issue date
May 15, 2018
Xintec Inc.
Hsing-Lung Shen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Passive component structure and manufacturing method thereof
Patent number
9,761,555
Issue date
Sep 12, 2017
Xintec Inc.
Jiun-Yen Lai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
System and method for polishing substrate
Patent number
9,669,514
Issue date
Jun 6, 2017
Taiwan Semiconductor Manufacturing Co., Ltd.
Jiun-Yu Lai
B24 - GRINDING POLISHING
Patents Applications
last 30 patents
Information
Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20240109769
Publication date
Apr 4, 2024
XINTEC INC.
Wei-Luen SUEN
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20230369362
Publication date
Nov 16, 2023
XINTEC INC.
Po-Han LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
VERTICAL-CAVITY SURFACE-EMITTING LASER AND METHOD FOR FORMING THE SAME
Publication number
20220311212
Publication date
Sep 29, 2022
WIN SEMICONDUCTORS CORP.
Min-Chang TU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20220157762
Publication date
May 19, 2022
XINTEC INC.
Jiun-Yen LAI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ANTENNA DEVICE AND MANUFACTURING METHOD THEREOF
Publication number
20220069454
Publication date
Mar 3, 2022
XINTEC INC.
Jiun-Yen LAI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20210269303
Publication date
Sep 2, 2021
XINTEC INC.
Wei-Luen SUEN
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
Publication number
20210210538
Publication date
Jul 8, 2021
XINTEC INC.
Jiun-Yen LAI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20210104455
Publication date
Apr 8, 2021
XINTEC INC.
Wei-Luen SUEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20210082841
Publication date
Mar 18, 2021
XINTEC INC.
Po-Han LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20210035940
Publication date
Feb 4, 2021
XINTEC INC.
Jiun-Yen LAI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
OPTICAL CHIP PACKAGE AND METHOD FOR FORMING THE SAME
Publication number
20200333542
Publication date
Oct 22, 2020
XINTEC INC.
Jiun-Yen LAI
G02 - OPTICS
Information
Patent Application
SYSTEM AND METHOD FOR POLISHING SUBSTRATE
Publication number
20170246723
Publication date
Aug 31, 2017
Taiwan Semiconductor Manufacturing Co., Ltd.
Jiun-Yu LAI
B24 - GRINDING POLISHING
Information
Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
Publication number
20170207194
Publication date
Jul 20, 2017
XINTEC INC.
Hsing-Lung SHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SYSTEM AND METHOD FOR POLISHING SUBSTRATE
Publication number
20160346899
Publication date
Dec 1, 2016
Taiwan Semiconductor Manufacturing Co., LTD
Jiun-Yu LAI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20160322312
Publication date
Nov 3, 2016
XINTEC INC.
Hsing-Lung SHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP SCALE SENSING CHIP PACKAGE AND A MANUFACTURING METHOD THEREOF
Publication number
20160284751
Publication date
Sep 29, 2016
XINTEC INC.
Yen-Shih HO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PASSIVE COMPONENT STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20150214162
Publication date
Jul 30, 2015
XINTEC INC.
Jiun-Yen LAI
H01 - BASIC ELECTRIC ELEMENTS