Jixin Yu

Person

Milpitas, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Three-dimensional memory device including backside trench support s...
- Patent number 11,380,707
- Issue date Jul 5, 2022
- SanDisk Technologies LLC
- Koichi Matsuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device including self-aligned dielectric i...
- Patent number 11,043,455
- Issue date Jun 22, 2021
- SanDisk Technologies LLC
- James Kai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device containing asymmetric, different si...
- Patent number 10,854,629
- Issue date Dec 1, 2020
- SanDisk Technologies LLC
- Chun Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device having bonding structures connected...
- Patent number 10,825,826
- Issue date Nov 3, 2020
- SanDisk Technologies LLC
- Jixin Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory die containing stress reducing backside contact via structur...
- Patent number 10,804,197
- Issue date Oct 13, 2020
- SanDisk Technologies LLC
- Motoki Kawasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device having bonding structures connected...
- Patent number 10,707,228
- Issue date Jul 7, 2020
- SanDisk Technologies LLC
- Jixin Yu
- G11 - INFORMATION STORAGE
Information Patent Grant
Memory die having wafer warpage reduction through stress balancing...
- Patent number 10,658,381
- Issue date May 19, 2020
- SanDisk Technologies LLC
- Jixin Yu
- G11 - INFORMATION STORAGE
Information Patent Grant
Bulb-shaped memory stack structures for direct source contact in th...
- Patent number 10,381,443
- Issue date Aug 13, 2019
- SanDisk Technologies LLC
- Kazuyo Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device containing hydrogen diffusion barri...
- Patent number 10,354,956
- Issue date Jul 16, 2019
- SanDisk Technologies LLC
- Jixin Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-tier memory device with through-stack peripheral contact via...
- Patent number 10,269,620
- Issue date Apr 23, 2019
- SanDisk Technologies LLC
- Jixin Yu
- G11 - INFORMATION STORAGE
Information Patent Grant
Through-memory-level via structures between staircase regions in a...
- Patent number 10,256,248
- Issue date Apr 9, 2019
- SanDisk Technologies LLC
- Zhenyu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Within-array through-memory-level via structures and method of maki...
- Patent number 10,249,640
- Issue date Apr 2, 2019
- SanDisk Technologies LLC
- Jixin Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device having L-shaped word lines and a su...
- Patent number 10,217,746
- Issue date Feb 26, 2019
- SanDisk Technologies LLC
- Tae-Kyung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional memory device containing discrete silicon nitride...
- Patent number 10,115,732
- Issue date Oct 30, 2018
- SanDisk Technologies LLC
- Jixin Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device with enhanced mechanical stability...
- Patent number 10,074,666
- Issue date Sep 11, 2018
- SanDisk Technologies LLC
- Chun Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-memory-level via structures for a three-dimensional memory...
- Patent number 10,038,006
- Issue date Jul 31, 2018
- SanDisk Technologies LLC
- Yoko Furihata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bulb-shaped memory stack structures for direct source contact in th...
- Patent number 10,020,363
- Issue date Jul 10, 2018
- SanDisk Technologies LLC
- Hiroyuki Ogawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bulb-shaped memory stack structures for direct source contact in th...
- Patent number 10,008,570
- Issue date Jun 26, 2018
- SanDisk Technologies LLC
- Jixin Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bulb-shaped memory stack structures for direct source contact in th...
- Patent number 9,985,098
- Issue date May 29, 2018
- SanDisk Technologies LLC
- Kazuyo Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a staircase in a semiconductor device using a lin...
- Patent number 9,985,046
- Issue date May 29, 2018
- SanDisk Technologies LLC
- Zhenyu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned isolation dielectric structures for a three-dimensiona...
- Patent number 9,859,363
- Issue date Jan 2, 2018
- SanDisk Technologies LLC
- Zhenyu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-memory-level via structures for a three-dimensional memory...
- Patent number 9,818,759
- Issue date Nov 14, 2017
- SanDisk Technologies LLC
- James Kai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-memory-level via structures for a three-dimensional memory...
- Patent number 9,818,693
- Issue date Nov 14, 2017
- SanDisk Technologies LLC
- Fumiaki Toyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-tier replacement memory stack structure integration scheme
- Patent number 9,728,551
- Issue date Aug 8, 2017
- SanDisk Technologies LLC
- Ching-Huang Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional memory device with peripheral devices under dummy...
- Patent number 9,673,213
- Issue date Jun 6, 2017
- SanDisk Technologies LLC
- Jixin Yu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MEMORY DEVICE INCLUDING WORD LINE CONTACT STRIPS AND METHODS OF FOR...
- Publication number 20240414917
- Publication date Dec 12, 2024
- Western Digital Technologies, Inc.
- Mark D. KRAMAN
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING TRENCH BRIDGE STRUCTURES...
- Publication number 20240386959
- Publication date Nov 21, 2024
- Western Digital Technologies, Inc.
- Jixin YU
- G11 - INFORMATION STORAGE
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING COMPOSITE DIELECTRIC ISO...
- Publication number 20240334695
- Publication date Oct 3, 2024
- SANDISK TECHNOLOGIES LLC
- Jixin YU
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING MULTI-LEVEL WORD LINE CO...
- Publication number 20240290714
- Publication date Aug 29, 2024
- SANDISK TECHNOLOGIES LLC
- Mark D. KRAMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE AND METHOD OF MAKING THEREOF INCLUD...
- Publication number 20240250023
- Publication date Jul 25, 2024
- SANDISK TECHNOLOGIES LLC
- Ruogu Matthew ZHU
- G11 - INFORMATION STORAGE
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE AND METHOD OF MAKING THEREOF INCLUD...
- Publication number 20240251551
- Publication date Jul 25, 2024
- SANDISK TECHNOLOGIES LLC
- Ruogu Matthew ZHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH FINNED SUPPORT PILLAR STRUCTUR...
- Publication number 20220352091
- Publication date Nov 3, 2022
- SANDISK TECHNOLOGIES LLC
- Jixin YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING BACKSIDE TRENCH SUPPORT S...
- Publication number 20220181348
- Publication date Jun 9, 2022
- SANDISK TECHNOLOGIES LLC
- Koichi MATSUNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING SELF-ALIGNED DIELECTRIC I...
- Publication number 20210028111
- Publication date Jan 28, 2021
- SANDISK TECHNOLOGIES LLC
- James KAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DIE CONTAINING STRESS REDUCING BACKSIDE CONTACT VIA STRUCTUR...
- Publication number 20200312765
- Publication date Oct 1, 2020
- SANDISK TECHNOLOGIES LLC
- Motoki KAWASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING ASYMMETRIC, DIFFERENT SI...
- Publication number 20200312865
- Publication date Oct 1, 2020
- SANDISK TECHNOLOGIES LLC
- Chun Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE HAVING BONDING STRUCTURES CONNECTED...
- Publication number 20200295029
- Publication date Sep 17, 2020
- SANDISK TECHNOLOGIES LLC
- Jixin Yu
- G11 - INFORMATION STORAGE
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE HAVING BONDING STRUCTURES CONNECTED...
- Publication number 20200066745
- Publication date Feb 27, 2020
- SANDISK TECHNOLOGIES LLC
- Jixin Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING HYDROGEN DIFFUSION BARRI...
- Publication number 20190214344
- Publication date Jul 11, 2019
- SanDisk Technologies LLC
- Jixin Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BULB-SHAPED MEMORY STACK STRUCTURES FOR DIRECT SOURCE CONTACT IN TH...
- Publication number 20180261671
- Publication date Sep 13, 2018
- SanDisk Technologies LLC
- Kazuyo Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH ENHANCED MECHANICAL STABILITY...
- Publication number 20180197876
- Publication date Jul 12, 2018
- SanDisk Technologies LLC
- Chun GE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BULB-SHAPED MEMORY STACK STRUCTURES FOR DIRECT SOURCE CONTACT IN TH...
- Publication number 20180122906
- Publication date May 3, 2018
- SanDisk Technologies LLC
- Jixin YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BULB-SHAPED MEMORY STACK STRUCTURES FOR DIRECT SOURCE CONTACT IN TH...
- Publication number 20180122904
- Publication date May 3, 2018
- SanDisk Technologies LLC
- Kazuyo Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BULB-SHAPED MEMORY STACK STRUCTURES FOR DIRECT SOURCE CONTACT IN TH...
- Publication number 20180122905
- Publication date May 3, 2018
- SanDisk Technologies LLC
- Hiroyuki Ogawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A STAIRCASE IN A SEMICONDUCTOR DEVICE USING A LIN...
- Publication number 20170358594
- Publication date Dec 14, 2017
- SanDisk Technologies LLC
- Zhenyu LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WITHIN-ARRAY THROUGH-MEMORY-LEVEL VIA STRUCTURES AND METHOD OF MAKI...
- Publication number 20170358593
- Publication date Dec 14, 2017
- SanDisk Technologies LLC
- Jixin YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-MEMORY-LEVEL VIA STRUCTURES BETWEEN STAIRCASE REGIONS IN A...
- Publication number 20170352678
- Publication date Dec 7, 2017
- SanDisk Technologies LLC
- Zhenyu LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL MEMORY DEVICE CONTAINING DISCRETE SILICON NITRIDE...
- Publication number 20170243879
- Publication date Aug 24, 2017
- SANDISK TECHNOLOGIES INC.
- Jixin YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-TIER MEMORY DEVICE WITH THROUGH-STACK PERIPHERAL CONTACT VIA...
- Publication number 20170236746
- Publication date Aug 17, 2017
- SanDisk Technologies LLC
- Jixin YU
- G11 - INFORMATION STORAGE
Information Patent Application
SELF-ALIGNED ISOLATION DIELECTRIC STRUCTURES FOR A THREE-DIMENSIONA...
- Publication number 20170236896
- Publication date Aug 17, 2017
- SanDisk Technologies LLC
- Zhenyu LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-TIER REPLACEMENT MEMORY STACK STRUCTURE INTEGRATION SCHEME
- Publication number 20170229472
- Publication date Aug 10, 2017
- SANDISK TECHNOLOGIES INC.
- Ching-Huang LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-MEMORY-LEVEL VIA STRUCTURES FOR A THREE-DIMENSIONAL MEMORY...
- Publication number 20170179154
- Publication date Jun 22, 2017
- SanDisk Technologies LLC
- Yoko Furihata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-MEMORY-LEVEL VIA STRUCTURES FOR A THREE-DIMENSIONAL MEMORY...
- Publication number 20170179026
- Publication date Jun 22, 2017
- SanDisk Technologies LLC
- Fumiaki Toyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-MEMORY-LEVEL VIA STRUCTURES FOR A THREE-DIMENSIONAL MEMORY...
- Publication number 20170179151
- Publication date Jun 22, 2017
- SanDisk Technologies LLC
- James Kai
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Three-dimensional memory device including backside trench support s...

Three-dimensional memory device including self-aligned dielectric i...

Three-dimensional memory device containing asymmetric, different si...

Three-dimensional memory device having bonding structures connected...

Memory die containing stress reducing backside contact via structur...

Three-dimensional memory device having bonding structures connected...

Memory die having wafer warpage reduction through stress balancing...

Bulb-shaped memory stack structures for direct source contact in th...

Three-dimensional memory device containing hydrogen diffusion barri...

Multi-tier memory device with through-stack peripheral contact via...

Through-memory-level via structures between staircase regions in a...

Within-array through-memory-level via structures and method of maki...

Three-dimensional memory device having L-shaped word lines and a su...

Three dimensional memory device containing discrete silicon nitride...

Three-dimensional memory device with enhanced mechanical stability...

Through-memory-level via structures for a three-dimensional memory...

Bulb-shaped memory stack structures for direct source contact in th...

Bulb-shaped memory stack structures for direct source contact in th...

Bulb-shaped memory stack structures for direct source contact in th...

Method of forming a staircase in a semiconductor device using a lin...

Self-aligned isolation dielectric structures for a three-dimensiona...

Through-memory-level via structures for a three-dimensional memory...

Through-memory-level via structures for a three-dimensional memory...

Multi-tier replacement memory stack structure integration scheme

Three dimensional memory device with peripheral devices under dummy...

Patents Applicationslast 30 patents

MEMORY DEVICE INCLUDING WORD LINE CONTACT STRIPS AND METHODS OF FOR...

THREE-DIMENSIONAL MEMORY DEVICE INCLUDING TRENCH BRIDGE STRUCTURES...

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING COMPOSITE DIELECTRIC ISO...

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING MULTI-LEVEL WORD LINE CO...

THREE-DIMENSIONAL MEMORY DEVICE AND METHOD OF MAKING THEREOF INCLUD...

THREE-DIMENSIONAL MEMORY DEVICE AND METHOD OF MAKING THEREOF INCLUD...

THREE-DIMENSIONAL MEMORY DEVICE WITH FINNED SUPPORT PILLAR STRUCTUR...

THREE-DIMENSIONAL MEMORY DEVICE INCLUDING BACKSIDE TRENCH SUPPORT S...

THREE-DIMENSIONAL MEMORY DEVICE INCLUDING SELF-ALIGNED DIELECTRIC I...

MEMORY DIE CONTAINING STRESS REDUCING BACKSIDE CONTACT VIA STRUCTUR...

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING ASYMMETRIC, DIFFERENT SI...

THREE-DIMENSIONAL MEMORY DEVICE HAVING BONDING STRUCTURES CONNECTED...

THREE-DIMENSIONAL MEMORY DEVICE HAVING BONDING STRUCTURES CONNECTED...

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING HYDROGEN DIFFUSION BARRI...

BULB-SHAPED MEMORY STACK STRUCTURES FOR DIRECT SOURCE CONTACT IN TH...

THREE-DIMENSIONAL MEMORY DEVICE WITH ENHANCED MECHANICAL STABILITY...

BULB-SHAPED MEMORY STACK STRUCTURES FOR DIRECT SOURCE CONTACT IN TH...

BULB-SHAPED MEMORY STACK STRUCTURES FOR DIRECT SOURCE CONTACT IN TH...

BULB-SHAPED MEMORY STACK STRUCTURES FOR DIRECT SOURCE CONTACT IN TH...

METHOD OF FORMING A STAIRCASE IN A SEMICONDUCTOR DEVICE USING A LIN...

WITHIN-ARRAY THROUGH-MEMORY-LEVEL VIA STRUCTURES AND METHOD OF MAKI...

THROUGH-MEMORY-LEVEL VIA STRUCTURES BETWEEN STAIRCASE REGIONS IN A...

THREE DIMENSIONAL MEMORY DEVICE CONTAINING DISCRETE SILICON NITRIDE...

MULTI-TIER MEMORY DEVICE WITH THROUGH-STACK PERIPHERAL CONTACT VIA...

SELF-ALIGNED ISOLATION DIELECTRIC STRUCTURES FOR A THREE-DIMENSIONA...

MULTI-TIER REPLACEMENT MEMORY STACK STRUCTURE INTEGRATION SCHEME

THROUGH-MEMORY-LEVEL VIA STRUCTURES FOR A THREE-DIMENSIONAL MEMORY...

THROUGH-MEMORY-LEVEL VIA STRUCTURES FOR A THREE-DIMENSIONAL MEMORY...

THROUGH-MEMORY-LEVEL VIA STRUCTURES FOR A THREE-DIMENSIONAL MEMORY...