John A. Fitzsimmons

Person

Poughkeepsie, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
SOI wafers with buried dielectric layers to prevent CU diffusion
- Patent number 10,242,947
- Issue date Mar 26, 2019
- GLOBALFOUNDRIES Inc.
- Anthony K. Stamper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self aligned contact structure
- Patent number 10,074,562
- Issue date Sep 11, 2018
- International Business Machines Corporation
- Rosa A. Orozco-Teran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device layer transfer with a preserved handle wafer section
- Patent number 10,037,911
- Issue date Jul 31, 2018
- GLOBALFOUNDRIES Inc.
- Anthony K. Stamper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure having deep trench capacitor and throu...
- Patent number 9,966,310
- Issue date May 8, 2018
- GLOBALFOUNDRIES Inc.
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure having deep trench capacitor and throu...
- Patent number 9,929,085
- Issue date Mar 27, 2018
- GLOBALFOUNDRIES Inc.
- John A. Fitzsimmons
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure having deep trench capacitor and throu...
- Patent number 9,892,970
- Issue date Feb 13, 2018
- GLOBALFOUNDRIES Inc.
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Corrosion resistant chip sidewall connection with crackstop and her...
- Patent number 9,852,959
- Issue date Dec 26, 2017
- GLOBALFOUNDRIES Inc.
- John A. Fitzsimmons
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device layer transfer with a preserved handle wafer section
- Patent number 9,818,637
- Issue date Nov 14, 2017
- GLOBALFOUNDRIES Inc.
- Anthony K. Stamper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connection around a crackstop structure
- Patent number 9,812,404
- Issue date Nov 7, 2017
- GLOBALFOUNDRIES Inc.
- Michael J. Shapiro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SOI wafers with buried dielectric layers to prevent Cu diffusion
- Patent number 9,806,025
- Issue date Oct 31, 2017
- GLOBALFOUNDRIES Inc.
- Anthony K. Stamper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal to metal bonding for stacked (3D) integrated circuits
- Patent number 9,673,176
- Issue date Jun 6, 2017
- International Business Machines Corporation
- Tien-Jen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer to wafer alignment
- Patent number 9,671,215
- Issue date Jun 6, 2017
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal to metal bonding for stacked (3D) integrated circuits
- Patent number 9,666,563
- Issue date May 30, 2017
- International Business Machines Corporation
- Tien-Jen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal to metal bonding for stacked (3D) integrated circuits
- Patent number 9,653,431
- Issue date May 16, 2017
- International Business Machines Corporation
- Tien-Jen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal to metal bonding for stacked (3D) integrated circuits
- Patent number 9,653,432
- Issue date May 16, 2017
- International Business Machines Corporation
- Tien-Jen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit with replacement gate stacks and method of formi...
- Patent number 9,589,806
- Issue date Mar 7, 2017
- GLOBALFOUNDRIES Inc.
- Ruqiang Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Strain detection structures for bonded wafers and chips
- Patent number 9,553,054
- Issue date Jan 24, 2017
- GLOBALFOUNDRIES Inc.
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned contact structure
- Patent number 9,548,244
- Issue date Jan 17, 2017
- International Business Machines Corporation
- Rosa A. Orozco-Teran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal to metal bonding for stacked (3D) integrated circuits
- Patent number 9,515,051
- Issue date Dec 6, 2016
- International Business Machines Corporation
- Tien-Jen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package that includes a plurality of integrated circuit...
- Patent number 9,461,017
- Issue date Oct 4, 2016
- GLOBALFOUNDRIES Inc.
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wet etching of silicon containing antireflective coatings
- Patent number 9,418,865
- Issue date Aug 16, 2016
- Intermolecular, Inc.
- Gregory Nowling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bottom-up plating of through-substrate vias
- Patent number 9,257,336
- Issue date Feb 9, 2016
- GLOBALFOUNDRIES Inc.
- Mukta G. Farooq
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Self-aligned contact structure
- Patent number 9,252,053
- Issue date Feb 2, 2016
- International Business Machines Corporation
- Rosa A. Orozco-Teran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromigration immune through-substrate vias
- Patent number 9,153,558
- Issue date Oct 6, 2015
- International Business Machines Corporation
- Ronald G. Filippi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer to wafer alignment by LED/LSD devices
- Patent number 9,105,517
- Issue date Aug 11, 2015
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective etch chemistry for gate electrode materials
- Patent number 9,070,625
- Issue date Jun 30, 2015
- International Business Machines Corporation
- John A. Fitzsimmons
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electronic fuse line with modified cap
- Patent number 9,059,173
- Issue date Jun 16, 2015
- International Business Machines Corporation
- Ronald G. Filippi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cleaning composition and process for cleaning semiconductor devices...
- Patent number 9,058,976
- Issue date Jun 16, 2015
- International Business Machines Corporation
- Vishal Chhabra
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Grant
Sidewalls of electroplated copper interconnects
- Patent number 9,060,457
- Issue date Jun 16, 2015
- International Business Machines Corporation
- Mukta G. Farooq
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sidewalls of electroplated copper interconnects
- Patent number 9,055,703
- Issue date Jun 9, 2015
- International Business Machines Corporation
- Mukta G. Farooq
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SOI WAFERS WITH BURIED DIELECTRIC LAYERS TO PREVENT CU DIFFUSION
- Publication number 20190172789
- Publication date Jun 6, 2019
- GLOBALFOUNDRIES INC.
- Anthony K. Stamper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE HAVING DEEP TRENCH CAPACITOR AND THROU...
- Publication number 20180108566
- Publication date Apr 19, 2018
- GLOBALFOUNDRIES INC.
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOI WAFERS WITH BURIED DIELECTRIC LAYERS TO PREVENT CU DIFFUSION
- Publication number 20180012845
- Publication date Jan 11, 2018
- GLOBALFOUNDRIES INC.
- Anthony K. Stamper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE LAYER TRANSFER WITH A PRESERVED HANDLE WAFER SECTION
- Publication number 20180005873
- Publication date Jan 4, 2018
- GLOBALFOUNDRIES Inc.
- Anthony K. Stamper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE HAVING DEEP TRENCH CAPACITOR AND THROU...
- Publication number 20170352618
- Publication date Dec 7, 2017
- GLOBALFOUNDRIES INC.
- John A. Fitzsimmons
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE HAVING DEEP TRENCH CAPACITOR AND THROU...
- Publication number 20170352592
- Publication date Dec 7, 2017
- GLOBALFOUNDRIES INC.
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORROSION RESISTANT CHIP SIDEWALL CONNECTION WITH CRACKSTOP AND HER...
- Publication number 20170229362
- Publication date Aug 10, 2017
- GLOBALFOUNDRIES INC.
- John A. Fitzsimmons
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CONNECTION AROUND A CRACKSTOP STRUCTURE
- Publication number 20170194265
- Publication date Jul 6, 2017
- GLOBALFOUNDRIES INC.
- Michael J. Shapiro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE LAYER TRANSFER WITH A PRESERVED HANDLE WAFER SECTION
- Publication number 20170186643
- Publication date Jun 29, 2017
- GLOBALFOUNDRIES INC.
- Anthony K. Stamper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOI WAFERS WITH BURIED DIELECTRIC LAYERS TO PREVENT CU DIFFUSION
- Publication number 20170186693
- Publication date Jun 29, 2017
- GLOBALFOUNDRIES Inc.
- Anthony K. Stamper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF ALIGNED CONTACT STRUCTURE
- Publication number 20160336266
- Publication date Nov 17, 2016
- International Business Machines Corporation
- Rosa A. Orozco-Teran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE THAT INCLUDES A PLURALITY OF INTEGRATED CIRCUIT...
- Publication number 20160300814
- Publication date Oct 13, 2016
- GLOBALFOUNDRIES INC.
- MUKTA G. FAROOQ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER TO WAFER ALIGNMENT
- Publication number 20160178344
- Publication date Jun 23, 2016
- International Business Machines Corporation
- Mukta G. Farooq
- G01 - MEASURING TESTING
Information Patent Application
STRAIN DETECTION STRUCTURES FOR BONDED WAFERS AND CHIPS
- Publication number 20160118348
- Publication date Apr 28, 2016
- International Business Machines Corporation
- Mukta G. FAROOQ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REMOVING METAL OXIDE
- Publication number 20160099158
- Publication date Apr 7, 2016
- International Business Machines Corporation
- Rosa A. Orozco-teran
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METAL TO METAL BONDING FOR STACKED (3D) INTEGRATED CIRCUITS
- Publication number 20160086914
- Publication date Mar 24, 2016
- International Business Machines Corporation
- Tien-Jen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL TO METAL BONDING FOR STACKED (3D) INTEGRATED CIRCUITS
- Publication number 20160086915
- Publication date Mar 24, 2016
- International Business Machines Corporation
- Tien-Jen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL TO METAL BONDING FOR STACKED (3D) INTEGRATED CIRCUITS
- Publication number 20160086916
- Publication date Mar 24, 2016
- International Business Machines Corporation
- Tien-Jen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL TO METAL BONDING FOR STACKED (3D) INTEGRATED CIRCUITS
- Publication number 20160086925
- Publication date Mar 24, 2016
- International Business Machines Corporation
- Tien-Jen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACIDIFIED CONDUCTIVE WATER FOR DEVELOPER RESIDUE REMOVAL
- Publication number 20160041471
- Publication date Feb 11, 2016
- International Business Machines Corporation
- Guillaume D. Briend
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
SELF-ALIGNED CONTACT STRUCTURE
- Publication number 20150371948
- Publication date Dec 24, 2015
- International Business Machines Corporation
- Rosa A. Orozco-Teran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE ETCH CHEMISTRY FOR GATE ELECTRODE MATERIALS
- Publication number 20150275376
- Publication date Oct 1, 2015
- International Business Machines Corporation
- John A. Fitzsimmons
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SELF-ALIGNED CONTACT STRUCTURE
- Publication number 20150200137
- Publication date Jul 16, 2015
- International Business Machines Corporation
- Rosa A. Orozco-Teran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wet Etching of Silicon Containing Antireflective Coatings
- Publication number 20150187596
- Publication date Jul 2, 2015
- INTERMOLECULAR INC.
- Gregory Nowling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER TO WAFER ALIGNMENT BY LED/LSD DEVICES
- Publication number 20150069421
- Publication date Mar 12, 2015
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOTTOM-UP PLATING OF THROUGH-SUBSTRATE VIAS
- Publication number 20150056804
- Publication date Feb 26, 2015
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLEANING COMPOSITION AND PROCESS FOR CLEANING SEMICONDUCTOR DEVICES...
- Publication number 20150024989
- Publication date Jan 22, 2015
- International Business Machines Corporation
- Vishal Chhabra
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Application
ELECTRONIC FUSE LINE WITH MODIFIED CAP
- Publication number 20150021736
- Publication date Jan 22, 2015
- International Business Machines Corporation
- RONALD G. FILIPPI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL TO METAL BONDING FOR STACKED (3D) INTEGRATED CIRCUITS
- Publication number 20140374903
- Publication date Dec 25, 2014
- Tien-Jen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING SEMICONDUCTOR CHIP CONNECTIONS
- Publication number 20140332929
- Publication date Nov 13, 2014
- International Business Machines Corporation
- Kangguo Cheng
- H01 - BASIC ELECTRIC ELEMENTS

John A. Fitzsimmons

Person

Patents Grantslast 30 patents

SOI wafers with buried dielectric layers to prevent CU diffusion

Self aligned contact structure

Device layer transfer with a preserved handle wafer section

Integrated circuit structure having deep trench capacitor and throu...

Integrated circuit structure having deep trench capacitor and throu...

Integrated circuit structure having deep trench capacitor and throu...

Corrosion resistant chip sidewall connection with crackstop and her...

Device layer transfer with a preserved handle wafer section

Electrical connection around a crackstop structure

SOI wafers with buried dielectric layers to prevent Cu diffusion

Metal to metal bonding for stacked (3D) integrated circuits

Wafer to wafer alignment

Metal to metal bonding for stacked (3D) integrated circuits

Metal to metal bonding for stacked (3D) integrated circuits

Metal to metal bonding for stacked (3D) integrated circuits

Integrated circuit with replacement gate stacks and method of formi...

Strain detection structures for bonded wafers and chips

Self-aligned contact structure

Metal to metal bonding for stacked (3D) integrated circuits

Electronic package that includes a plurality of integrated circuit...

Wet etching of silicon containing antireflective coatings

Bottom-up plating of through-substrate vias

Self-aligned contact structure

Electromigration immune through-substrate vias

Wafer to wafer alignment by LED/LSD devices

Selective etch chemistry for gate electrode materials

Electronic fuse line with modified cap

Cleaning composition and process for cleaning semiconductor devices...

Sidewalls of electroplated copper interconnects

Sidewalls of electroplated copper interconnects

Patents Applicationslast 30 patents

SOI WAFERS WITH BURIED DIELECTRIC LAYERS TO PREVENT CU DIFFUSION

INTEGRATED CIRCUIT STRUCTURE HAVING DEEP TRENCH CAPACITOR AND THROU...

SOI WAFERS WITH BURIED DIELECTRIC LAYERS TO PREVENT CU DIFFUSION

DEVICE LAYER TRANSFER WITH A PRESERVED HANDLE WAFER SECTION

INTEGRATED CIRCUIT STRUCTURE HAVING DEEP TRENCH CAPACITOR AND THROU...

INTEGRATED CIRCUIT STRUCTURE HAVING DEEP TRENCH CAPACITOR AND THROU...

CORROSION RESISTANT CHIP SIDEWALL CONNECTION WITH CRACKSTOP AND HER...

ELECTRICAL CONNECTION AROUND A CRACKSTOP STRUCTURE

DEVICE LAYER TRANSFER WITH A PRESERVED HANDLE WAFER SECTION

SOI WAFERS WITH BURIED DIELECTRIC LAYERS TO PREVENT CU DIFFUSION

SELF ALIGNED CONTACT STRUCTURE

ELECTRONIC PACKAGE THAT INCLUDES A PLURALITY OF INTEGRATED CIRCUIT...

WAFER TO WAFER ALIGNMENT

STRAIN DETECTION STRUCTURES FOR BONDED WAFERS AND CHIPS

METHOD FOR REMOVING METAL OXIDE

METAL TO METAL BONDING FOR STACKED (3D) INTEGRATED CIRCUITS

METAL TO METAL BONDING FOR STACKED (3D) INTEGRATED CIRCUITS

METAL TO METAL BONDING FOR STACKED (3D) INTEGRATED CIRCUITS

METAL TO METAL BONDING FOR STACKED (3D) INTEGRATED CIRCUITS

ACIDIFIED CONDUCTIVE WATER FOR DEVELOPER RESIDUE REMOVAL

SELF-ALIGNED CONTACT STRUCTURE

SELECTIVE ETCH CHEMISTRY FOR GATE ELECTRODE MATERIALS

SELF-ALIGNED CONTACT STRUCTURE

Wet Etching of Silicon Containing Antireflective Coatings

WAFER TO WAFER ALIGNMENT BY LED/LSD DEVICES

BOTTOM-UP PLATING OF THROUGH-SUBSTRATE VIAS

CLEANING COMPOSITION AND PROCESS FOR CLEANING SEMICONDUCTOR DEVICES...

ELECTRONIC FUSE LINE WITH MODIFIED CAP

METAL TO METAL BONDING FOR STACKED (3D) INTEGRATED CIRCUITS

FORMING SEMICONDUCTOR CHIP CONNECTIONS