John Acocella

Person

Hopewell Junction, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Solder ball connections and assembly process
- Patent number 6,504,105
- Issue date Jan 7, 2003
- International Business Machines Corporation
- John Acocella
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder ball connections and assembly process
- Patent number 5,675,889
- Issue date Oct 14, 1997
- International Business Machines Corporation
- John Acocella
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder ball interconnected assembly
- Patent number 5,591,941
- Issue date Jan 7, 1997
- International Business Machines Corporation
- John Acocella
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structures for electrically conductive decals filled with inorganic...
- Patent number 5,338,900
- Issue date Aug 16, 1994
- International Business Machines Corporation
- Mark S. Schneider
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for indirect impingement cooling of integrated circuit chips
- Patent number 5,294,830
- Issue date Mar 15, 1994
- International Business Machines Corporation
- Steven P. Young
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for fabricating a low dielectric composite substrate
- Patent number 5,277,725
- Issue date Jan 11, 1994
- International Business Machines Corporation
- John Acocella
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Method of forming an adherent layer of metallurgy on a ceramic subs...
- Patent number 5,167,913
- Issue date Dec 1, 1992
- International Business Machines Corporation
- John Acocella
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low dielectric composite substrate
- Patent number 5,139,851
- Issue date Aug 18, 1992
- International Business Machines Corporation
- John Acocella
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Process for fabricating a low dielectric composite substrate
- Patent number 5,135,595
- Issue date Aug 4, 1992
- International Business Machines Corporation
- John Acocella
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Processes for electrically conductive decals filled with inorganic...
- Patent number 5,108,541
- Issue date Apr 28, 1992
- International Business Machines Corp.
- Mark S. Schneider
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper device and use thereof with semiconductor devices
- Patent number 5,031,029
- Issue date Jul 9, 1991
- International Business Machines Corporation
- John Acocella
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayered ceramic substrate having solid non-porous metal conduc...
- Patent number 4,879,156
- Issue date Nov 7, 1989
- International Business Machines Corporation
- Lester W. Herron
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for forming multilayered ceramic substrate having solid met...
- Patent number 4,753,694
- Issue date Jun 28, 1988
- International Business Machines Corporation
- Lester W. Herron
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal etching process with etch rate enhancement
- Patent number 4,747,907
- Issue date May 31, 1988
- International Business Machines Corporation
- John Acocella
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

John Acocella

Person

Patents Grantslast 30 patents

Solder ball connections and assembly process

Solder ball connections and assembly process

Solder ball interconnected assembly

Structures for electrically conductive decals filled with inorganic...

Apparatus for indirect impingement cooling of integrated circuit chips

Process for fabricating a low dielectric composite substrate

Method of forming an adherent layer of metallurgy on a ceramic subs...

Low dielectric composite substrate

Process for fabricating a low dielectric composite substrate

Processes for electrically conductive decals filled with inorganic...

Copper device and use thereof with semiconductor devices

Multilayered ceramic substrate having solid non-porous metal conduc...

Process for forming multilayered ceramic substrate having solid met...

Metal etching process with etch rate enhancement