IBM Technical Disclosure Bulletin: "Mini Conformal Cold Plate"vol. 27, No. 1B, Jun. 1984, pp. 494-495. |
IBM Technical Disclosure Bulletin: "New TCM Design Using Bellows"vol. 28, No. 11, Apr. 1986, pp. 4759-4761. |
IBM Technical Disclosure Bulletin: "Liquid-Cooled Circuit Package With . . . "vol. 29, No. 7, Dec. 1986, p. 2887. |
IBM Technical Disclosure Bulletin: "Device Cooling"vol. 20, No. 10, Mar. 1978, p. 3919. |
IBM Technical Disclosure Bulletin: "Diaphragm Cooling for Devices"vol. 20, No. 8, Jan. 1978, p. 3121. |
Kenneth Mason Publications Ltd., England: "Thermal Conduction Module . . . "Research Disclosure, Mar. 1988, #28768. |