John August Orlowski

Person

Summerfield, NC, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method of fabricating contact pads for electronic substrates
- Patent number 11,765,826
- Issue date Sep 19, 2023
- Qorvo US, Inc.
- John August Orlowski
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fiducials for laminate structures
- Patent number 11,596,058
- Issue date Feb 28, 2023
- Qorvo US, Inc.
- John August Orlowski
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrates with integrated three dimensional inductors with via col...
- Patent number 11,244,786
- Issue date Feb 8, 2022
- Qorvo US, Inc.
- Dirk Robert Walter Leipold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrates with integrated three dimensional inductors with via col...
- Patent number 11,094,459
- Issue date Aug 17, 2021
- Qorvo US, Inc.
- Dirk Robert Walter Leipold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact pads for electronic substrates and related methods
- Patent number 10,905,007
- Issue date Jan 26, 2021
- Qorvo US, Inc.
- John August Orlowski
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacked laminate inductors for high module volume utilization and p...
- Patent number 10,796,835
- Issue date Oct 6, 2020
- Qorvo US, Inc.
- Michael F. Zybura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrates with integrated three dimensional solenoid inductors
- Patent number 10,483,035
- Issue date Nov 19, 2019
- Qorvo US, Inc.
- Dirk Robert Walter Leipold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Additive conductor redistribution layer (ACRL)
- Patent number 10,043,707
- Issue date Aug 7, 2018
- Qorvo US, Inc.
- John August Orlowski
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE COMPRISING A SINGLE DIELECTRIC LAYER FOR SOLDER M...
- Publication number 20240321707
- Publication date Sep 26, 2024
- Qorvo US, Inc.
- John August Orlowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT PADS FOR ELECTRONIC SUBSTRATES AND RELATED METHODS
- Publication number 20210144853
- Publication date May 13, 2021
- Qorvo US, Inc.
- John August Orlowski
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONTACT PADS FOR ELECTRONIC SUBSTRATES AND RELATED METHODS
- Publication number 20210007224
- Publication date Jan 7, 2021
- Qorvo US, Inc.
- John August Orlowski
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FIDUCIALS FOR LAMINATE STRUCTURES
- Publication number 20200288567
- Publication date Sep 10, 2020
- Qorvo US, Inc.
- John August Orlowski
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATES WITH INTEGRATED THREE DIMENSIONAL INDUCTORS WITH VIA COL...
- Publication number 20190385791
- Publication date Dec 19, 2019
- Qorvo US, Inc.
- Dirk Robert Walter Leipold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATES WITH INTEGRATED THREE DIMENSIONAL INDUCTORS WITH VIA COL...
- Publication number 20190371523
- Publication date Dec 5, 2019
- Qorvo US, Inc.
- Dirk Robert Walter Leipold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATES WITH INTEGRATED THREE DIMENSIONAL INDUCTORS WITH VIA COL...
- Publication number 20170084379
- Publication date Mar 23, 2017
- Qorvo US, Inc.
- Dirk Robert Walter Leipold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATES WITH INTEGRATED THREE DIMENSIONAL SOLENOID INDUCTORS
- Publication number 20170084378
- Publication date Mar 23, 2017
- Qorvo US, Inc.
- Dirk Robert Walter Leipold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED LAMINATE INDUCTORS FOR HIGH MODULE VOLUME UTILIZATION AND P...
- Publication number 20170062119
- Publication date Mar 2, 2017
- Qorvo US, Inc.
- Michael F. Zybura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE FINISH FOR CONDUCTIVE FEATURES ON SUBSTRATES
- Publication number 20150201515
- Publication date Jul 16, 2015
- RF Micro Devices, Inc.
- Donald Joseph Leahy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SURFACE FINISH FOR CONDUCTIVE FEATURES ON SUBSTRATES
- Publication number 20140146489
- Publication date May 29, 2014
- John August Orlowski
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SURFACE FINISH FOR CONDUCTIVE FEATURES ON SUBSTRATES
- Publication number 20140144682
- Publication date May 29, 2014
- RF Micro Devices, Inc.
- John August Orlowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADDITIVE CONDUCTOR REDISTRIBUTION LAYER (ACRL)
- Publication number 20140106564
- Publication date Apr 17, 2014
- RF Micro Devices, Inc.
- John August Orlowski
- H01 - BASIC ELECTRIC ELEMENTS

John August Orlowski

Person

Patents Grantslast 30 patents

Method of fabricating contact pads for electronic substrates

Fiducials for laminate structures

Substrates with integrated three dimensional inductors with via col...

Substrates with integrated three dimensional inductors with via col...

Contact pads for electronic substrates and related methods

Stacked laminate inductors for high module volume utilization and p...

Substrates with integrated three dimensional solenoid inductors

Additive conductor redistribution layer (ACRL)

Patents Applicationslast 30 patents

ELECTRONIC DEVICE COMPRISING A SINGLE DIELECTRIC LAYER FOR SOLDER M...

CONTACT PADS FOR ELECTRONIC SUBSTRATES AND RELATED METHODS

CONTACT PADS FOR ELECTRONIC SUBSTRATES AND RELATED METHODS

FIDUCIALS FOR LAMINATE STRUCTURES

SUBSTRATES WITH INTEGRATED THREE DIMENSIONAL INDUCTORS WITH VIA COL...

SUBSTRATES WITH INTEGRATED THREE DIMENSIONAL INDUCTORS WITH VIA COL...

SUBSTRATES WITH INTEGRATED THREE DIMENSIONAL INDUCTORS WITH VIA COL...

SUBSTRATES WITH INTEGRATED THREE DIMENSIONAL SOLENOID INDUCTORS

STACKED LAMINATE INDUCTORS FOR HIGH MODULE VOLUME UTILIZATION AND P...

SURFACE FINISH FOR CONDUCTIVE FEATURES ON SUBSTRATES

SURFACE FINISH FOR CONDUCTIVE FEATURES ON SUBSTRATES

SURFACE FINISH FOR CONDUCTIVE FEATURES ON SUBSTRATES

ADDITIVE CONDUCTOR REDISTRIBUTION LAYER (ACRL)