John Blake Pavelka

Person

Beacon, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Chip scale package
- Patent number 11,887,924
- Issue date Jan 30, 2024
- Cirrus Logic Inc.
- Craig McAdam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip scale package
- Patent number 11,562,952
- Issue date Jan 24, 2023
- Cirrus Logic, Inc.
- Craig McAdam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit with sensor area and resin dam
- Patent number 9,355,870
- Issue date May 31, 2016
- Silicon Laboratories Inc.
- John B. Pavelka
- G01 - MEASURING TESTING
Information Patent Grant
Systems and methods for packaging integrated circuit gas sensor sys...
- Patent number 8,852,513
- Issue date Oct 7, 2014
- Silicon Laboratories Inc.
- Raymond Speer
- G01 - MEASURING TESTING
Information Patent Grant
Current sensor including an integrated circuit die including a firs...
- Patent number 7,990,132
- Issue date Aug 2, 2011
- Silicon Laboratories Inc.
- Timothy J. Dupuis
- G01 - MEASURING TESTING
Information Patent Grant
RF power amplifier and method for packaging the same
- Patent number 7,935,990
- Issue date May 3, 2011
- Black Sand Technologies, Inc.
- Susanne A. Paul
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Integrated current sensor package
- Patent number 7,679,162
- Issue date Mar 16, 2010
- Silicon Laboratories Inc.
- Timothy J. Dupuis
- G01 - MEASURING TESTING
Information Patent Grant
Integrated current sensor
- Patent number 7,362,086
- Issue date Apr 22, 2008
- Silicon Laboratories Inc.
- Timothy J. Dupuis
- G01 - MEASURING TESTING
Information Patent Grant
RF power amplifier and method for packaging the same
- Patent number 7,224,232
- Issue date May 29, 2007
- Silicon Laboratories Inc.
- Susanne A. Paul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for synthesizing high-frequency signals for wi...
- Patent number 7,209,011
- Issue date Apr 24, 2007
- Silicon Laboratories Inc.
- David R. Welland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for synthesizing high-frequency signals for wi...
- Patent number 6,903,617
- Issue date Jun 7, 2005
- Silicon Laboratories Inc.
- Lysander Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for synthesizing high-frequency signals utiliz...
- Patent number 6,323,735
- Issue date Nov 27, 2001
- Silicon Laboratories, Inc.
- David R. Welland
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Microelectronic package module with temporary lid
- Patent number 6,274,214
- Issue date Aug 14, 2001
- International Business Machines Corporation
- Joseph Ying-Yuen Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for adhesively attaching a temporary lid to a microelectron...
- Patent number 6,054,008
- Issue date Apr 25, 2000
- International Business Machines Corporation
- Joseph Ying-Yuen Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a multilayer electronic packaging substrate with...
- Patent number 5,870,823
- Issue date Feb 16, 1999
- International Business Machines Corporation
- Raschid J. Bezama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for automatic frequency and voltage selection...
- Patent number 5,764,529
- Issue date Jun 9, 1998
- International Business Machines Corporation
- Louis Bennie Capps
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Apparatus and method for non-destructive inspection and/or measurement
- Patent number 5,745,238
- Issue date Apr 28, 1998
- International Business Machines Corporation
- David Clifford Long
- G01 - MEASURING TESTING
Information Patent Grant
Blind hole cold plate cooling system
- Patent number 5,239,443
- Issue date Aug 24, 1993
- International Business Machines Corporation
- Albert J. Fahey
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP SCALE PACKAGE
- Publication number 20230088252
- Publication date Mar 23, 2023
- Cirrus Logic International Semiconductor Ltd.
- Craig MCADAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP SCALE PACKAGE
- Publication number 20220246514
- Publication date Aug 4, 2022
- Cirrus Logic International Semiconductor Ltd.
- Craig MCADAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFORMAL SHIELD FOR BLOCKING LIGHT IN AN INTEGRATED CIRCUIT PACKAGE
- Publication number 20210111131
- Publication date Apr 15, 2021
- Cirrus Logic International Semiconductor Ltd.
- John PAVELKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CURRENT SENSOR WITH RESET CIRCUIT
- Publication number 20090001962
- Publication date Jan 1, 2009
- Timothy J. Dupuis
- G01 - MEASURING TESTING
Information Patent Application
Integrated current sensor package
- Publication number 20070139066
- Publication date Jun 21, 2007
- Silicon Laboratories Inc.
- Timothy J. Dupuis
- G01 - MEASURING TESTING
Information Patent Application
Integrated current sensor
- Publication number 20070139032
- Publication date Jun 21, 2007
- Silicon Laboratories Inc.
- Timothy J. Dupuis
- G01 - MEASURING TESTING
Information Patent Application
RF POWER AMPLIFIER AND METHOD FOR PACKAGING THE SAME
- Publication number 20070096816
- Publication date May 3, 2007
- Susanne A. Paul
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Method and apparatus for synthesizing high-frequency signals for wi...
- Publication number 20050242897
- Publication date Nov 3, 2005
- Silicon Laboratories Inc.
- Lysander Lim
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Method and apparatus for synthesizing high-frequency signals for wi...
- Publication number 20020163396
- Publication date Nov 7, 2002
- Lysander Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for synthesizing dual band high-frequency sign...
- Publication number 20020041216
- Publication date Apr 11, 2002
- Silicon Laboratories, Inc.
- David R. Welland
- H01 - BASIC ELECTRIC ELEMENTS

John Blake Pavelka

Person

Patents Grantslast 30 patents

Chip scale package

Chip scale package

Integrated circuit with sensor area and resin dam

Systems and methods for packaging integrated circuit gas sensor sys...

Current sensor including an integrated circuit die including a firs...

RF power amplifier and method for packaging the same

Integrated current sensor package

Integrated current sensor

RF power amplifier and method for packaging the same

Method and apparatus for synthesizing high-frequency signals for wi...

Method and apparatus for synthesizing high-frequency signals for wi...

Method and apparatus for synthesizing high-frequency signals utiliz...

Microelectronic package module with temporary lid

Process for adhesively attaching a temporary lid to a microelectron...

Method of forming a multilayer electronic packaging substrate with...

Method and apparatus for automatic frequency and voltage selection...

Apparatus and method for non-destructive inspection and/or measurement

Blind hole cold plate cooling system

Patents Applicationslast 30 patents

CHIP SCALE PACKAGE

CHIP SCALE PACKAGE

CONFORMAL SHIELD FOR BLOCKING LIGHT IN AN INTEGRATED CIRCUIT PACKAGE

CURRENT SENSOR WITH RESET CIRCUIT

Integrated current sensor package

Integrated current sensor

RF POWER AMPLIFIER AND METHOD FOR PACKAGING THE SAME

Method and apparatus for synthesizing high-frequency signals for wi...

Method and apparatus for synthesizing high-frequency signals for wi...

Method and apparatus for synthesizing dual band high-frequency sign...