John C. Mather

Person

Cedar Rapids, IA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Ultra wide band balanced antipodal tapered slot antenna and array w...
- Patent number 9,024,834
- Issue date May 5, 2015
- Rockwell Collins, Inc.
- Modhwajih A. ElSallal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-polarized environmentally-hardened low profile radiating element
- Patent number 8,872,713
- Issue date Oct 28, 2014
- Rockwell Collins, Inc.
- Michael J. Buckley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
PCB-based tuners for RF cavity filters
- Patent number 8,598,969
- Issue date Dec 3, 2013
- Rockwell Collins, Inc.
- Anders P. Walker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stripline-to-waveguide transition including metamaterial layers and...
- Patent number 8,576,023
- Issue date Nov 5, 2013
- Rockwell Collins, Inc.
- Michael J. Buckley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Broad band compact load for use in multifunction phased array testing
- Patent number 8,514,032
- Issue date Aug 20, 2013
- Rockwell Collins, Inc.
- Michael J. Buckley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronically scanned antenna
- Patent number 8,497,809
- Issue date Jul 30, 2013
- Rockwell Collins, Inc.
- Brian J. Herting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra wide band balanced antipodal tapered slot antenna and array w...
- Patent number 8,466,846
- Issue date Jun 18, 2013
- Rockwell Collins, Inc.
- Modhwajih A. Elsallal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a multi-band concentric ring antenna
- Patent number 8,230,581
- Issue date Jul 31, 2012
- Rockwell Collins, Inc.
- Ross K. Wilcoxon
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Electronically scanned antenna
- Patent number 8,098,207
- Issue date Jan 17, 2012
- Rockwell Collins, Inc.
- Brian J. Herting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Weather radar system and method using dual polarization antenna
- Patent number 8,098,189
- Issue date Jan 17, 2012
- Rockwell Collins, Inc.
- Daniel L. Woodell
- G01 - MEASURING TESTING
Information Patent Grant
Low profile, conformal global positioning system array for artillery
- Patent number 8,076,622
- Issue date Dec 13, 2011
- Rockwell Collins, Inc.
- Lee M. Paulsen
- F42 - AMMUNITION BLASTING
Information Patent Grant
System for providing a pressure vessel, radome, RF sub-system box a...
- Patent number 8,063,837
- Issue date Nov 22, 2011
- Rockwell Collins, Inc.
- William C. Jennings
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Phased array antenna interconnect having substrate slat structures
- Patent number 7,170,446
- Issue date Jan 30, 2007
- Rockwell Collins, Inc.
- James B. West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display including tiles and a method of operating and manufacturing...
- Patent number 7,091,927
- Issue date Aug 15, 2006
- Rockwell Collins, Inc.
- John K. Hagge
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Split waveguide phased array antenna with integrated bias assembly
- Patent number 6,995,726
- Issue date Feb 7, 2006
- Rockwell Collins
- James B. West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
One-dimensional and two-dimensional electronically scanned slotted...
- Patent number 6,972,727
- Issue date Dec 6, 2005
- Rockwell Collins
- James B. West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for phased array antenna interconnect using an...
- Patent number 6,950,062
- Issue date Sep 27, 2005
- Rockwell Collins
- John C. Mather
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Construction approach for an EMXT-based phased array antenna
- Patent number 6,822,617
- Issue date Nov 23, 2004
- Rockwell Collins
- John C. Mather
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a multilayer circuit board having a window exposin...
- Patent number 6,200,407
- Issue date Mar 13, 2001
- Rockwell Technologies, LLC
- Christopher J. Wieloch
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power substrate module
- Patent number 5,835,356
- Issue date Nov 10, 1998
- Allen Bradley Company, LLC
- Christopher J. Wieloch
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer circuit board having a window exposing an enhanced condu...
- Patent number 5,670,749
- Issue date Sep 23, 1997
- Allen-Bradley Company, Inc.
- Christopher J. Wieloch
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wireless circuit board system for a motor controller
- Patent number 5,648,892
- Issue date Jul 15, 1997
- Allen-Bradley Company, Inc.
- Christopher J. Wieloch
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Solder mask for a finger connector on a single in-line package module
- Patent number 5,644,475
- Issue date Jul 1, 1997
- Allen-Bradley Company, Inc.
- Gerard A. Woychik
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power substrate with improved thermal characteristics
- Patent number 5,641,944
- Issue date Jun 24, 1997
- Allen-Bradley Company, Inc.
- Christopher J. Wieloch
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Rigid-flex circuit board having a window for an insulated mounting...
- Patent number 5,616,888
- Issue date Apr 1, 1997
- Allen-Bradley Company, Inc.
- Steven R. McLaughlin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabrication of a circuit board adapted to receive a singl...
- Patent number 5,581,877
- Issue date Dec 10, 1996
- Allen-Bradley Company, Inc.
- Gerard A. Woychik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure for multichip modules
- Patent number 5,243,145
- Issue date Sep 7, 1993
- Rockwell International Corporation
- John C. Mather
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure for multichip modules
- Patent number 5,034,568
- Issue date Jul 23, 1991
- Rockwell International Corporation
- John C. Mather
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Temporary soldering aid for manufacture of printed wiring assemblies
- Patent number 4,928,387
- Issue date May 29, 1990
- Rockwell International Corp.
- John C. Mather
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

John C. Mather

Person

Patents Grantslast 30 patents

Ultra wide band balanced antipodal tapered slot antenna and array w...

Dual-polarized environmentally-hardened low profile radiating element

PCB-based tuners for RF cavity filters

Stripline-to-waveguide transition including metamaterial layers and...

Broad band compact load for use in multifunction phased array testing

Electronically scanned antenna

Ultra wide band balanced antipodal tapered slot antenna and array w...

Method for producing a multi-band concentric ring antenna

Electronically scanned antenna

Weather radar system and method using dual polarization antenna

Low profile, conformal global positioning system array for artillery

System for providing a pressure vessel, radome, RF sub-system box a...

Phased array antenna interconnect having substrate slat structures

Display including tiles and a method of operating and manufacturing...

Split waveguide phased array antenna with integrated bias assembly

One-dimensional and two-dimensional electronically scanned slotted...

Method and structure for phased array antenna interconnect using an...

Construction approach for an EMXT-based phased array antenna

Method of making a multilayer circuit board having a window exposin...

Power substrate module

Multilayer circuit board having a window exposing an enhanced condu...

Wireless circuit board system for a motor controller

Solder mask for a finger connector on a single in-line package module

Power substrate with improved thermal characteristics

Rigid-flex circuit board having a window for an insulated mounting...

Method of fabrication of a circuit board adapted to receive a singl...

Package structure for multichip modules

Package structure for multichip modules

Temporary soldering aid for manufacture of printed wiring assemblies