John E. Turner

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Woodside, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Nitridation of titanium-tungsten interconnects
- Patent number 5,318,924
- Issue date Jun 7, 1994
- Hewlett-Packard Company
- Jung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming doped shallow electrical junctions
- Patent number 5,310,711
- Issue date May 10, 1994
- Hewlett-Packard Company
- Clifford I. Drowley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for forming shallow electrical junctions
- Patent number 5,256,162
- Issue date Oct 26, 1993
- Hewlett-Packard Company
- Clifford I. Drowley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating an ultra-thin active region for high speed se...
- Patent number 5,177,025
- Issue date Jan 5, 1993
- Hewlett-Packard Company
- John E. Turner
- H01 - BASIC ELECTRIC ELEMENTS