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John Frank Surowka
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Binghamton, NY, US
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Patents Grants
last 30 patents
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Patent Grant
Method for reducing coefficient of thermal expansion in chip attach...
Patent number
6,841,026
Issue date
Jan 11, 2005
International Business Machines Corporation
Lawrence Robert Blumberg
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for reducing coefficient of thermal expansion in chip attach...
Patent number
6,586,352
Issue date
Jul 1, 2003
International Business Machines Corporation
Lawrence Robert Blumberg
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for reducing coefficient of thermal expansion in chip attach...
Patent number
6,387,830
Issue date
May 14, 2002
International Business Machines Corporation
Lawrence Robert Blumberg
B32 - LAYERED PRODUCTS
Information
Patent Grant
Laminated electroplating rack and connection system for optimized p...
Patent number
6,176,985
Issue date
Jan 23, 2001
International Business Machines Corporation
Francis J. Downes
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Method for reducing coefficient of thermal expansion in chip attach...
Patent number
6,136,733
Issue date
Oct 24, 2000
International Business Machines Corporation
Lawrence Robert Blumberg
B32 - LAYERED PRODUCTS
Patents Applications
last 30 patents
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Patent Application
Method for reducing coefficient of thermal expansion in chip attach...
Publication number
20030000081
Publication date
Jan 2, 2003
International Business Machines Corporation
Lawrence Robert Blumberg
B32 - LAYERED PRODUCTS