| Number | Name | Date | Kind |
|---|---|---|---|
| 3968022 | Eng et al. | Jul 1976 | |
| 3970539 | Collins et al. | Jul 1976 | |
| 4051088 | Ford et al. | Sep 1977 | |
| 4100054 | DuRocher | Jul 1978 | |
| 4484996 | Bongartz et al. | Nov 1984 | |
| 4606891 | Murphy, Jr. et al. | Aug 1986 | |
| 4687562 | Smith et al. | Aug 1987 | |
| 4714534 | Fair et al. | Dec 1987 | |
| 4714535 | Coombes, Jr. et al. | Dec 1987 | |
| 4818349 | Smith | Apr 1989 | |
| 4885071 | Murakami | Dec 1989 | |
| 5017275 | Niksa et al. | May 1991 | |
| 5019944 | Ishii et al. | May 1991 | |
| 5118299 | Burns et al. | Jun 1992 | |
| 5172473 | Burns et al. | Dec 1992 | |
| 5185073 | Bindra et al. | Feb 1993 | |
| 5190463 | Datta et al. | Mar 1993 | |
| 5298685 | Bindra et al. | Mar 1994 | |
| 5389220 | Herzog et al. | Feb 1995 | |
| 5435057 | Bindra et al. | Jul 1995 | |
| 5456814 | Metzka | Oct 1995 | |
| 5764071 | Chan et al. | Jun 1998 |
| Entry |
|---|
| Graves, J.E. and Bach, W. “Conveyerized horizontal electroplate system for printed circuit boards,” Proc. IPC Conf. San Jose, CA, Mar. 1997, Abstract. |