Number | Name | Date | Kind |
---|---|---|---|
3968022 | Eng et al. | Jul 1976 | |
3970539 | Collins et al. | Jul 1976 | |
4051088 | Ford et al. | Sep 1977 | |
4100054 | DuRocher | Jul 1978 | |
4484996 | Bongartz et al. | Nov 1984 | |
4606891 | Murphy, Jr. et al. | Aug 1986 | |
4687562 | Smith et al. | Aug 1987 | |
4714534 | Fair et al. | Dec 1987 | |
4714535 | Coombes, Jr. et al. | Dec 1987 | |
4818349 | Smith | Apr 1989 | |
4885071 | Murakami | Dec 1989 | |
5017275 | Niksa et al. | May 1991 | |
5019944 | Ishii et al. | May 1991 | |
5118299 | Burns et al. | Jun 1992 | |
5172473 | Burns et al. | Dec 1992 | |
5185073 | Bindra et al. | Feb 1993 | |
5190463 | Datta et al. | Mar 1993 | |
5298685 | Bindra et al. | Mar 1994 | |
5389220 | Herzog et al. | Feb 1995 | |
5435057 | Bindra et al. | Jul 1995 | |
5456814 | Metzka | Oct 1995 | |
5764071 | Chan et al. | Jun 1998 |
Entry |
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Graves, J.E. and Bach, W. “Conveyerized horizontal electroplate system for printed circuit boards,” Proc. IPC Conf. San Jose, CA, Mar. 1997, Abstract. |