John H. Magerlein

Person

Yorktown Heights, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package structures having liquid cooler integrated wi...
- Patent number 8,772,927
- Issue date Jul 8, 2014
- International Business Machines Corporation
- Raschid Jose Bezama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon based microchannel cooling and electrical package
- Patent number 8,581,392
- Issue date Nov 12, 2013
- International Business Machines Corporation
- John Ulrich Knickerbocker
- G01 - MEASURING TESTING
Information Patent Grant
Structure and apparatus for cooling integrated circuits using coppe...
- Patent number 8,505,617
- Issue date Aug 13, 2013
- International Business Machines Corporation
- Raschid Jose Bezama
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Stacked and redundant chip coolers
- Patent number 8,418,751
- Issue date Apr 16, 2013
- International Business Machines Corporation
- Raschid Jose Bezama
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Silicon based microchannel cooling and electrical package
- Patent number 8,421,220
- Issue date Apr 16, 2013
- International Business Machines Corporation
- John Ulrich Knickerbocker
- G01 - MEASURING TESTING
Information Patent Grant
Structure and apparatus for cooling integrated circuits using coope...
- Patent number 8,210,243
- Issue date Jul 3, 2012
- International Business Machines Corporation
- Raschid Jose Bezama
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Semiconductor package structures having liquid coolers integrated w...
- Patent number 8,115,303
- Issue date Feb 14, 2012
- International Business Machines Corporation
- Raschid Jose Bezama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon based microchannel cooling and electrical package
- Patent number 8,110,415
- Issue date Feb 7, 2012
- International Business Machines Corporation
- John Ulrich Knickerbocker
- G01 - MEASURING TESTING
Information Patent Grant
Method and manufacture of silicon based package and devices manufac...
- Patent number 8,097,492
- Issue date Jan 17, 2012
- International Business Machines Corporation
- John H. Magerlein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double-face heat removal of vertically integrated chip-stacks utili...
- Patent number 7,990,711
- Issue date Aug 2, 2011
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Segmentation of a die stack for 3D packaging thermal management
- Patent number 7,928,562
- Issue date Apr 19, 2011
- International Business Machines Corporation
- Amilcar R. Arvelo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Technology for fabrication of packaging interface substrate wafers...
- Patent number 7,880,305
- Issue date Feb 1, 2011
- International Business Machines Corporation
- Yu-Ting Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Silicon based package
- Patent number 7,855,442
- Issue date Dec 21, 2010
- International Business Machines Corporation
- John H. Magerlein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a high Q factor integrated circuit inductor
- Patent number 7,829,427
- Issue date Nov 9, 2010
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for high-performance liquid cooling of multip...
- Patent number 7,808,781
- Issue date Oct 5, 2010
- International Business Machines Corporation
- Evan George Colgan
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Versatile Si-based packaging with integrated passive components for...
- Patent number 7,808,798
- Issue date Oct 5, 2010
- International Business Machines Corporation
- John Michael Cotte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a high Q factor integrated circuit inductor
- Patent number 7,638,406
- Issue date Dec 29, 2009
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming noble metal contacts
- Patent number 7,581,314
- Issue date Sep 1, 2009
- International Business Machines Corporation
- Hariklia Deligianni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Versatile Si-based packaging with integrated passive components for...
- Patent number 7,518,229
- Issue date Apr 14, 2009
- International Business Machines Corporation
- John Michael Cotte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Space transforming land grid array interposers
- Patent number 7,473,102
- Issue date Jan 6, 2009
- International Business Machines Corporation
- Evan George Colgan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Noble metal contacts for micro-electromechanical switches
- Patent number 7,202,764
- Issue date Apr 10, 2007
- International Business Machines Corporation
- Hariklia Deligianni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for microchannel cooling of semiconductor int...
- Patent number 7,190,580
- Issue date Mar 13, 2007
- International Business Machines Corporation
- Raschid Jose Bezama
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Method of manufacture of silicon based package and devices manufact...
- Patent number 7,189,595
- Issue date Mar 13, 2007
- International Business Machines Corporation
- John H. Magerlein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for microchannel cooling of semiconductor int...
- Patent number 7,139,172
- Issue date Nov 21, 2006
- International Business Machines Corporation
- Raschid Jose Bezama
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Method and apparatus for providing optoelectronic communication wit...
- Patent number 7,128,472
- Issue date Oct 31, 2006
- International Business Machines Corporation
- Alan F. Benner
- G02 - OPTICS
Information Patent Grant
High Q factor integrated circuit inductor
- Patent number 7,068,138
- Issue date Jun 27, 2006
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density area array solder microjoining interconnect structure...
- Patent number 6,819,000
- Issue date Nov 16, 2004
- International Business Machines Corporation
- John Harold Magerlein
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip cooling
- Patent number 6,774,482
- Issue date Aug 10, 2004
- International Business Machines Corporation
- Evan George Colgan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Temporary device attach structure for test and burn in of microjoin...
- Patent number 6,747,472
- Issue date Jun 8, 2004
- International Business Machines Corporation
- John Harold Magerlein
- G01 - MEASURING TESTING
Information Patent Grant
High density raised stud microjoining system and methods of fabrica...
- Patent number 6,732,908
- Issue date May 11, 2004
- International Business Machines Corporation
- Bruce Kenneth Furman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SILICON BASED MICROCHANNEL COOLING AND ELECTRICAL PACKAGE
- Publication number 20130092938
- Publication date Apr 18, 2013
- International Business Machines Corporation
- John Ulrich Knickerbocker
- G01 - MEASURING TESTING
Information Patent Application
Structure and Apparatus for Cooling Integrated Circuits Using Coppe...
- Publication number 20120175100
- Publication date Jul 12, 2012
- International Business Machines Corporation
- Raschid Jose Bezama
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
SILICON BASED MICROCHANNEL COOLING AND ELECTRICAL PACKAGE
- Publication number 20120133051
- Publication date May 31, 2012
- International Business Machines Corporation
- John Ulrich Knickerbocker
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor Package Structures Having Liquid Cooler Integrated wi...
- Publication number 20120049341
- Publication date Mar 1, 2012
- International Business Machines Corporation
- Raschid Jose Bezama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-FACE HEAT REMOVAL OF VERTICALLY INTEGRATED CHIP-STACKS UTILI...
- Publication number 20110205708
- Publication date Aug 25, 2011
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING A HIGH Q FACTOR INTEGRATED CIRCUIT INDUCTOR
- Publication number 20100047990
- Publication date Feb 25, 2010
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEGMENTATION OF A DIE STACK FOR 3D PACKAGING THERMAL MANAGEMENT
- Publication number 20100019377
- Publication date Jan 28, 2010
- International Business Machines Corporation
- Amilcar R. Arvelo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Apparatus for Cooling Integrated Circuits Using Coope...
- Publication number 20100012294
- Publication date Jan 21, 2010
- Raschid Jose Bezama
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Technology for fabrication of packaging interface substrate wafers...
- Publication number 20090302454
- Publication date Dec 10, 2009
- Yu- Ting Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Package Structures Having Liquid Coolers Integrated w...
- Publication number 20090283902
- Publication date Nov 19, 2009
- Raschid Jose Bezama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and Methods for High-Performance Liquid Cooling of Multip...
- Publication number 20090284921
- Publication date Nov 19, 2009
- Evan George Colgan
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Stacked and Redundant Chip Coolers
- Publication number 20090283244
- Publication date Nov 19, 2009
- Raschid Jose Bezama
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
SILICON BASED MICROCHANNEL COOLING AND ELECTRICAL PACKAGE
- Publication number 20090251862
- Publication date Oct 8, 2009
- International Business Machines Corporation
- John Ulrich Knickerbocker
- G01 - MEASURING TESTING
Information Patent Application
METHOD AND MANUFACTURE OF SILICON BASED PACKAGE AND DEVICES MANUFAC...
- Publication number 20090174059
- Publication date Jul 9, 2009
- John H. Magerlein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERSATILE Si-BASED PACKAGING WITH INTEGRATED PASSIVE COMPONENTS FOR...
- Publication number 20080186247
- Publication date Aug 7, 2008
- International Business Machines Corporation
- John Michael Cotte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Versatile Si-based packaging with integrated passive components for...
- Publication number 20080029886
- Publication date Feb 7, 2008
- International Business Machines Corporation
- John Michael Cotte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Space transforming land grid array interposers
- Publication number 20070232090
- Publication date Oct 4, 2007
- Evan George Colgan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of manufacture of silicon based package and devices manufact...
- Publication number 20070111385
- Publication date May 17, 2007
- John H. Magerlein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Noble metal contacts for micro-electromechanical switches
- Publication number 20060164194
- Publication date Jul 27, 2006
- Hariklia Deligianni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Q factor integrated circuit inductor
- Publication number 20060105534
- Publication date May 18, 2006
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and methods for microchannel cooling of semiconductor int...
- Publication number 20060002087
- Publication date Jan 5, 2006
- Raschid Jose Bezama
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Apparatus and methods for microchannel cooling of semiconductor int...
- Publication number 20060002088
- Publication date Jan 5, 2006
- Raschid Jose Bezama
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
High Q factor integrated circuit inductor
- Publication number 20050167780
- Publication date Aug 4, 2005
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Local reduction of compliant thermally conductive material layer th...
- Publication number 20050127500
- Publication date Jun 16, 2005
- International Business Machines Corporation
- Evan G. Colgan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for providing optoelectronic communication wit...
- Publication number 20050025434
- Publication date Feb 3, 2005
- International Business Machines Corporation
- Alan F. Benner
- G02 - OPTICS
Information Patent Application
NOBLE METAL CONTACTS FOR MICRO-ELECTROMECHANICAL SWITCHES
- Publication number 20050007217
- Publication date Jan 13, 2005
- International Business Machines Corporation
- Hariklia Deligianni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacture of silicon based package and devices manufact...
- Publication number 20040229398
- Publication date Nov 18, 2004
- International Business Machines Corporation
- John H. Magerlein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP COOLING
- Publication number 20040124525
- Publication date Jul 1, 2004
- IBM
- Evan George Colgan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Technology for fabrication of packaging interface substrate wafers...
- Publication number 20040089948
- Publication date May 13, 2004
- Yu-Ting Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
High density area array solder microjoining interconnect structure...
- Publication number 20040084782
- Publication date May 6, 2004
- International Business Machines Corporation
- John Harold Magerlein
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

John H. Magerlein

Person

Patents Grantslast 30 patents

Semiconductor package structures having liquid cooler integrated wi...

Silicon based microchannel cooling and electrical package

Structure and apparatus for cooling integrated circuits using coppe...

Stacked and redundant chip coolers

Silicon based microchannel cooling and electrical package

Structure and apparatus for cooling integrated circuits using coope...

Semiconductor package structures having liquid coolers integrated w...

Silicon based microchannel cooling and electrical package

Method and manufacture of silicon based package and devices manufac...

Double-face heat removal of vertically integrated chip-stacks utili...

Segmentation of a die stack for 3D packaging thermal management

Technology for fabrication of packaging interface substrate wafers...

Silicon based package

Method of fabricating a high Q factor integrated circuit inductor

Apparatus and methods for high-performance liquid cooling of multip...

Versatile Si-based packaging with integrated passive components for...

Method of fabricating a high Q factor integrated circuit inductor

Method of forming noble metal contacts

Versatile Si-based packaging with integrated passive components for...

Space transforming land grid array interposers

Noble metal contacts for micro-electromechanical switches

Apparatus and methods for microchannel cooling of semiconductor int...

Method of manufacture of silicon based package and devices manufact...

Apparatus and methods for microchannel cooling of semiconductor int...

Method and apparatus for providing optoelectronic communication wit...

High Q factor integrated circuit inductor

High density area array solder microjoining interconnect structure...

Chip cooling

Temporary device attach structure for test and burn in of microjoin...

High density raised stud microjoining system and methods of fabrica...

Patents Applicationslast 30 patents

SILICON BASED MICROCHANNEL COOLING AND ELECTRICAL PACKAGE

Structure and Apparatus for Cooling Integrated Circuits Using Coppe...

SILICON BASED MICROCHANNEL COOLING AND ELECTRICAL PACKAGE

Semiconductor Package Structures Having Liquid Cooler Integrated wi...

DOUBLE-FACE HEAT REMOVAL OF VERTICALLY INTEGRATED CHIP-STACKS UTILI...

METHOD OF FABRICATING A HIGH Q FACTOR INTEGRATED CIRCUIT INDUCTOR

SEGMENTATION OF A DIE STACK FOR 3D PACKAGING THERMAL MANAGEMENT

Structure and Apparatus for Cooling Integrated Circuits Using Coope...

Technology for fabrication of packaging interface substrate wafers...

Semiconductor Package Structures Having Liquid Coolers Integrated w...

Apparatus and Methods for High-Performance Liquid Cooling of Multip...

Stacked and Redundant Chip Coolers

SILICON BASED MICROCHANNEL COOLING AND ELECTRICAL PACKAGE

METHOD AND MANUFACTURE OF SILICON BASED PACKAGE AND DEVICES MANUFAC...

VERSATILE Si-BASED PACKAGING WITH INTEGRATED PASSIVE COMPONENTS FOR...

Versatile Si-based packaging with integrated passive components for...

Space transforming land grid array interposers

Method of manufacture of silicon based package and devices manufact...

Noble metal contacts for micro-electromechanical switches

High Q factor integrated circuit inductor

Apparatus and methods for microchannel cooling of semiconductor int...

Apparatus and methods for microchannel cooling of semiconductor int...

High Q factor integrated circuit inductor

Local reduction of compliant thermally conductive material layer th...

Method and apparatus for providing optoelectronic communication wit...

NOBLE METAL CONTACTS FOR MICRO-ELECTROMECHANICAL SWITCHES

Method of manufacture of silicon based package and devices manufact...

CHIP COOLING

Technology for fabrication of packaging interface substrate wafers...

High density area array solder microjoining interconnect structure...