John HOANG

Person

Fremont, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Film stack simplification for high aspect ratio patterning and vert...
- Patent number 12,080,592
- Issue date Sep 3, 2024
- Lam Research Corporation
- Hui-Jung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conformal damage-free encapsulation of chalcogenide materials
- Patent number 11,832,533
- Issue date Nov 28, 2023
- Lam Research Corporation
- James Samuel Sims
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Self-aligned vertical integration of three-terminal memory devices
- Patent number 11,792,987
- Issue date Oct 17, 2023
- Lam Research Corporation
- Thorsten Lill
Information Patent Grant
Conformal damage-free encapsulation of chalcogenide materials
- Patent number 11,239,420
- Issue date Feb 1, 2022
- Lam Research Corporation
- James Samuel Sims
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Cobalt etch back
- Patent number 10,784,086
- Issue date Sep 22, 2020
- Lam Research Corporation
- Jialing Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liner and barrier applications for subtractive metal integration
- Patent number 10,199,235
- Issue date Feb 5, 2019
- Lam Research Corporation
- Hui-Jung Wu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Liner and barrier applications for subtractive metal integration
- Patent number 9,899,234
- Issue date Feb 20, 2018
- Lam Research Corporation
- Hui-Jung Wu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Cobalt etch back
- Patent number 9,870,899
- Issue date Jan 16, 2018
- Lam Research Corporation
- Jialing Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of planarizing an upper surface of a semiconductor substrate...
- Patent number 9,589,853
- Issue date Mar 7, 2017
- Lam Research Corporation
- Monica Titus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to etch copper barrier film
- Patent number 9,570,320
- Issue date Feb 14, 2017
- Lam Research Corporation
- Meihua Shen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FILM STACK SIMPLIFICATION FOR HIGH ASPECT RATIO PATTERNING AND VERT...
- Publication number 20240387258
- Publication date Nov 21, 2024
- LAM RESEARCH CORPORATION
- Hui-Jung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES AND APPARATUSES FOR PROCESSING CHALCOGENIDES
- Publication number 20240381790
- Publication date Nov 14, 2024
- LAM RESEARCH CORPORATION
- John Hoang
Information Patent Application
PROTECTION OF CHANNEL LAYER IN THREE-TERMINAL VERTICAL MEMORY STRUC...
- Publication number 20230143057
- Publication date May 11, 2023
- LAM RESEARCH CORPORATION
- John HOANG
Information Patent Application
CONFORMAL DAMAGE-FREE ENCAPSULATION OF CHALCOGENIDE MATERIALS
- Publication number 20220115592
- Publication date Apr 14, 2022
- LAM RESEARCH CORPORATION
- James Samuel Sims
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
FILM STACK SIMPLIFICATION FOR HIGH ASPECT RATIO PATTERNING AND VERT...
- Publication number 20220051938
- Publication date Feb 17, 2022
- LAM RESEARCH CORPORATION
- Hui-Jung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED VERTICAL INTEGRATION OF THREE-TERMINAL MEMORY DEVICES
- Publication number 20210391355
- Publication date Dec 16, 2021
- LAM RESEARCH CORPORATION
- Thorsten LILL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFORMAL DAMAGE-FREE ENCAPSULATION OF CHALCOGENIDE MATERIALS
- Publication number 20200066987
- Publication date Feb 27, 2020
- LAM RESEARCH CORPORATION
- James Samuel Sims
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LINER AND BARRIER APPLICATIONS FOR SUBTRACTIVE METAL INTEGRATION
- Publication number 20180211846
- Publication date Jul 26, 2018
- LAM RESEARCH CORPORATION
- Hui-Jung Wu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
COBALT ETCH BACK
- Publication number 20180102236
- Publication date Apr 12, 2018
- LAM RESEARCH CORPORATION
- Jialing Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COBALT ETCH BACK
- Publication number 20160314985
- Publication date Oct 27, 2016
- LAM RESEARCH CORPORATION
- Jialing Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOVEL METHOD TO ETCH COPPER BARRIER FILM
- Publication number 20160104630
- Publication date Apr 14, 2016
- LAM RESEARCH CORPORATION
- Meihua SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LINER AND BARRIER APPLICATIONS FOR SUBTRACTIVE METAL INTEGRATION
- Publication number 20150380272
- Publication date Dec 31, 2015
- LAM RESEARCH CORPORATION
- Hui-Jung Wu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF PLANARIZING AN UPPER SURFACE OF A SEMICONDUCTOR SUBSTRATE...
- Publication number 20150249016
- Publication date Sep 3, 2015
- LAM RESEARCH CORPORATION
- Monica Titus
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Film stack simplification for high aspect ratio patterning and vert...

Conformal damage-free encapsulation of chalcogenide materials

Self-aligned vertical integration of three-terminal memory devices

Conformal damage-free encapsulation of chalcogenide materials

Cobalt etch back

Liner and barrier applications for subtractive metal integration

Liner and barrier applications for subtractive metal integration

Cobalt etch back

Method of planarizing an upper surface of a semiconductor substrate...

Method to etch copper barrier film

Patents Applicationslast 30 patents

FILM STACK SIMPLIFICATION FOR HIGH ASPECT RATIO PATTERNING AND VERT...

TECHNIQUES AND APPARATUSES FOR PROCESSING CHALCOGENIDES

PROTECTION OF CHANNEL LAYER IN THREE-TERMINAL VERTICAL MEMORY STRUC...

CONFORMAL DAMAGE-FREE ENCAPSULATION OF CHALCOGENIDE MATERIALS

FILM STACK SIMPLIFICATION FOR HIGH ASPECT RATIO PATTERNING AND VERT...

SELF-ALIGNED VERTICAL INTEGRATION OF THREE-TERMINAL MEMORY DEVICES

CONFORMAL DAMAGE-FREE ENCAPSULATION OF CHALCOGENIDE MATERIALS

LINER AND BARRIER APPLICATIONS FOR SUBTRACTIVE METAL INTEGRATION

COBALT ETCH BACK

COBALT ETCH BACK

NOVEL METHOD TO ETCH COPPER BARRIER FILM

LINER AND BARRIER APPLICATIONS FOR SUBTRACTIVE METAL INTEGRATION

METHOD OF PLANARIZING AN UPPER SURFACE OF A SEMICONDUCTOR SUBSTRATE...