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John J. Bladon

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  • Wayland, MA, US
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Patents Grantslast 30 patents

  • Information Patent Grant

    Fluid delivery systems for electronic device manufacture
    • Patent number 6,265,020
    • Issue date Jul 24, 2001
    • Shipley Company, L.L.C.
    • George R. Allardyce
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Grant

    Method of microetching a conductive polymer on multilayer circuit b...
    • Patent number 6,036,835
    • Issue date Mar 14, 2000
    • Shipley Company, L.L.C.
    • Wade Sonnenberg
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Grant

    Electroplating process and composition
    • Patent number 6,017,967
    • Issue date Jan 25, 2000
    • Shipley Company, L.L.C.
    • Egon Matijevic
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Grant

    Electroplating process
    • Patent number 5,425,873
    • Issue date Jun 20, 1995
    • Shipley Company LLC
    • John J. Bladon
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Grant

    Electroplating process
    • Patent number 5,419,829
    • Issue date May 30, 1995
    • Rohm & Haas Company
    • Gordon Fisher
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Grant

    Electroplating process and composition
    • Patent number 5,374,346
    • Issue date Dec 20, 1994
    • Rohm & Haas Company
    • John J. Bladon
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Electroplating process and composition
    • Patent number 5,276,290
    • Issue date Jan 4, 1994
    • Shipley Company Inc.
    • John J. Bladon
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Grant

    Electroplating process and composition
    • Patent number 5,207,888
    • Issue date May 4, 1993
    • Shipley Company Inc.
    • John J. Bladon
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Grant

    Printed circuit board
    • Patent number 5,017,742
    • Issue date May 21, 1991
    • Shipley Company Inc.
    • John J. Bladon
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Electroplating process
    • Patent number 5,007,990
    • Issue date Apr 16, 1991
    • Shipley Company Inc.
    • John J. Bladon
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Grant

    Electroplating process
    • Patent number 4,952,286
    • Issue date Aug 28, 1990
    • Shipley Company Inc.
    • John J. Bladon
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Grant

    Electroplating process
    • Patent number 4,919,768
    • Issue date Apr 24, 1990
    • Shipley Company Inc.
    • John J. Bladon
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Grant

    Pretreatment for electroplating process
    • Patent number 4,895,739
    • Issue date Jan 23, 1990
    • Shipley Company Inc.
    • John J. Bladon
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Grant

    Catalytic metal of reduced particle size
    • Patent number 4,725,314
    • Issue date Feb 16, 1988
    • Shipley Company Inc.
    • Michael Gulla
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Catalytic metal of reduced particle size
    • Patent number 4,652,311
    • Issue date Mar 24, 1987
    • Shipley Company Inc.
    • Michael Gulla
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Catalytic metal of reduced particle size
    • Patent number 4,634,468
    • Issue date Jan 6, 1987
    • Shipley Company Inc.
    • Michael Gulla
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...