Claims
- 1. An article of manufacture comprising a printed circuit board substrate that is an electrically nonconductive plastic clad with copper, said printed circuit board substrate having through holes passing from one surface of the board to the other surface of the board where said through holes have their walls coated with a metal adhered to the plastic surface of the hole walls through an intermediate layer of tin-palladium sulfide.
- 2. The article of claim 1 where the metal adhered to the surface of the hole walls is copper.
Parent Case Info
This is a divisional of co-pending application Ser. No. 07/244,788 filed on Sept. 15, 1988, now U.S. Pat. No. 4,895,739, which in turn is a division of U.S. Pat. application Ser. No. 07/153,357, filed on Feb. 8, 1988, which is a continuation-in-part of U.S. Pat. application Ser. No. 07/071,865, filed on July 10, 1987, now abandoned.
US Referenced Citations (5)
Divisions (2)
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Number |
Date |
Country |
Parent |
244788 |
Sep 1988 |
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Parent |
153357 |
Feb 1988 |
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Continuation in Parts (1)
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Number |
Date |
Country |
Parent |
71865 |
Jul 1987 |
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