John J. Maloney

Person

Essex Junction, VT, US

People

Patents Grantslast 30 patents

Information Patent Grant
Quad flat no-lead chip carrier with standoff
- Patent number 8,134,225
- Issue date Mar 13, 2012
- International Business Machines Corporation
- John J. Maloney
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heatplates for heatsink attachment for semiconductor chips
- Patent number 7,834,444
- Issue date Nov 16, 2010
- International Business Machines Corporation
- Elie Awad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor, method, and design structure for a low-k delamination sensor
- Patent number 7,716,992
- Issue date May 18, 2010
- International Business Machines Corporation
- John J. Maloney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heatplates for heatsink attachment for semiconductor chips
- Patent number 7,498,673
- Issue date Mar 3, 2009
- International Business Machines Corporation
- Elie Awad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Quad flat no-lead chip carrier with stand-off
- Patent number 7,405,106
- Issue date Jul 29, 2008
- International Business Machines Corporation
- John J. Maloney
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optimized electronic package
- Patent number 6,894,382
- Issue date May 17, 2005
- International Business Machines Corporation
- Elie Awad
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SENSOR, METHOD, AND DESIGN STRUCTURE FOR A LOW-K DELAMINATION SENSOR
- Publication number 20090246892
- Publication date Oct 1, 2009
- John J. Maloney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEATPLATES FOR HEATSINK ATTACHMENT FOR SEMICONDUCTOR CHIPS
- Publication number 20090200660
- Publication date Aug 13, 2009
- Elie Awad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QUAD FLAT NO-LEAD CHIP CARRIER WITH STANDOFF
- Publication number 20080265396
- Publication date Oct 30, 2008
- International Business Machines Corporation
- John J. Maloney
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
QUAD FLAT NO-LEAD CHIP CARRIER WITH STAND-OFF
- Publication number 20080203546
- Publication date Aug 28, 2008
- International Business Machines Corporation
- John J. Maloney
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Heatplates for heatsink attachment for semiconductor chips
- Publication number 20080116570
- Publication date May 22, 2008
- International Business Machines Corporation
- Elie Awad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Quad flat no-lead chip carrier with stand-off
- Publication number 20070273017
- Publication date Nov 29, 2007
- International Business Machines Corporation
- John J. Maloney
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Electronic package, heater block and method
- Publication number 20040159931
- Publication date Aug 19, 2004
- International Business Machines Corporation
- Alexander M. Arayata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic package and method
- Publication number 20030183911
- Publication date Oct 2, 2003
- International Business Machines Corporation
- Alexander M. Arayata
- H01 - BASIC ELECTRIC ELEMENTS

John J. Maloney

Person

Patents Grantslast 30 patents

Quad flat no-lead chip carrier with standoff

Heatplates for heatsink attachment for semiconductor chips

Sensor, method, and design structure for a low-k delamination sensor

Heatplates for heatsink attachment for semiconductor chips

Quad flat no-lead chip carrier with stand-off

Optimized electronic package

Patents Applicationslast 30 patents

SENSOR, METHOD, AND DESIGN STRUCTURE FOR A LOW-K DELAMINATION SENSOR

HEATPLATES FOR HEATSINK ATTACHMENT FOR SEMICONDUCTOR CHIPS

QUAD FLAT NO-LEAD CHIP CARRIER WITH STANDOFF

QUAD FLAT NO-LEAD CHIP CARRIER WITH STAND-OFF

Heatplates for heatsink attachment for semiconductor chips

Quad flat no-lead chip carrier with stand-off

Electronic package, heater block and method

Electronic package and method