John Lee COLBERT

Person

Byron, MN, US

People

Patents Grantslast 30 patents

Information Patent Grant
Packaging for eight-socket one-hop SMP topology
- Patent number 9,456,506
- Issue date Sep 27, 2016
- International Business Machines Corporation
- John L. Colbert
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaging for eight-socket one-hop SMP topology
- Patent number 9,445,507
- Issue date Sep 13, 2016
- International Business Machines Corporation
- John L. Colbert
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Implementing heat sink loading having multipoint loading with actua...
- Patent number 9,265,157
- Issue date Feb 16, 2016
- International Business Machines Corporation
- John L. Colbert
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Motherboard assembly for interconnecting and distributing signals a...
- Patent number 8,958,214
- Issue date Feb 17, 2015
- International Business Machines Corporation
- John L. Colbert
- G11 - INFORMATION STORAGE
Information Patent Grant
Implementing connection of two large electronic boards utilizing LG...
- Patent number 8,747,122
- Issue date Jun 10, 2014
- International Business Machines Corporation
- Terry F. Banitt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-chip module system with removable socketed modules
- Patent number 8,680,670
- Issue date Mar 25, 2014
- International Business Machines Corporation
- Jon Alfred Casey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Motherboard assembly for interconnecting and distributing signals a...
- Patent number 8,446,738
- Issue date May 21, 2013
- International Business Machines Corporation
- John L. Colbert
- G11 - INFORMATION STORAGE
Information Patent Grant
Implementing loading and heat removal for hub module assembly
- Patent number 8,363,404
- Issue date Jan 29, 2013
- International Business Machines Corporation
- John L. Colbert
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Alignment structure having a frame structure and bridging connectio...
- Patent number 8,267,701
- Issue date Sep 18, 2012
- International Business Machines Corporation
- Brian S. Beaman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Implementing enhanced connector guide block structures for robust S...
- Patent number 7,985,095
- Issue date Jul 26, 2011
- International Business Machines Corporation
- William L. Brodsky
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounting a heat sink in thermal contact with an electronic component
- Patent number 7,944,698
- Issue date May 17, 2011
- International Business Machines Corporation
- John Lee Colbert
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Cold plate stability
- Patent number 7,903,411
- Issue date Mar 8, 2011
- International Business Machines Corporation
- Levi A. Campbell
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heatsink apparatus for applying a specified compressive force to an...
- Patent number 7,777,329
- Issue date Aug 17, 2010
- International Business Machines Corporation
- John L. Colbert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically connecting two substrates using a resilient wire bundl...
- Patent number 7,765,693
- Issue date Aug 3, 2010
- International Business Machines Corporation
- William Louis Brodsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for configuring tubing for interconnecting in-series multip...
- Patent number 7,751,918
- Issue date Jul 6, 2010
- International Business Machines Corporation
- Levi A. Campbell
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Dual swivel in-line load node lock mechanism
- Patent number 7,731,146
- Issue date Jun 8, 2010
- International Business Machines Corporation
- John Lee Colbert
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic assembly and techniques for installing a heatsink in an...
- Patent number 7,701,720
- Issue date Apr 20, 2010
- International Business Machines Corporation
- John L. Colbert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting a heat sink in thermal contact with an electronic component
- Patent number 7,606,033
- Issue date Oct 20, 2009
- International Business Machines Corporation
- John Lee Colbert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for effecting reliable heat transfer of bare die microele...
- Patent number 7,550,840
- Issue date Jun 23, 2009
- International Business Machines Corporation
- John Lee Colbert
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Customizable backer for achieving consistent loading and engagement...
- Patent number 7,517,230
- Issue date Apr 14, 2009
- International Business Machines Corporation
- John Lee Colbert
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cold plate stability
- Patent number 7,499,279
- Issue date Mar 3, 2009
- International Business Machines Corporation
- Levi A. Campbell
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Mounting a heat sink in thermal contact with an electronic component
- Patent number 7,486,516
- Issue date Feb 3, 2009
- International Business Machines Corporation
- John Lee Colbert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High performance reworkable heatsink and packaging structure with s...
- Patent number 7,435,622
- Issue date Oct 14, 2008
- International Business Machines Corporation
- John Lee Colbert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Customizable backer for achieving consistent loading and engagement...
- Patent number 7,399,185
- Issue date Jul 15, 2008
- International Business Machines Corporation
- John Lee Colbert
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Non-influencing fastener for mounting a heat sink in contact with a...
- Patent number 7,345,881
- Issue date Mar 18, 2008
- International Business Machines Corporation
- John Lee Colbert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High performance reworkable heatsink and packaging structure with s...
- Patent number 7,342,306
- Issue date Mar 11, 2008
- International Business Machines Corporation
- John Lee Colbert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for effecting reliable heat transfer of bare die microele...
- Patent number 7,339,266
- Issue date Mar 4, 2008
- International Business Machines Corporation
- John Lee Colbert
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method and apparatus for electrically connecting two substrates usi...
- Patent number 7,293,994
- Issue date Nov 13, 2007
- International Business Machines Corporation
- William Louis Brodsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for managing aligning and coupling of a land g...
- Patent number 7,071,720
- Issue date Jul 4, 2006
- International Business Machines Corporation
- John Lee Colbert
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for mounting a heat transfer apparatus upon an...
- Patent number 6,988,533
- Issue date Jan 24, 2006
- International Business Machines Corporation
- John Lee Colbert
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Packaging for Eight-Socket One-Hop SMP Topology
- Publication number 20150271926
- Publication date Sep 24, 2015
- International Business Machines Corporation
- John L. Colbert
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Packaging for Eight-Socket One-Hop SMP Topology
- Publication number 20150177794
- Publication date Jun 25, 2015
- International Business Machines Corporation
- John L. Colbert
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
IMPLEMENTING HEAT SINK LOADING HAVING MULTIPOINT LOADING WITH ACTUA...
- Publication number 20140268575
- Publication date Sep 18, 2014
- International Business Machines Corporation
- John L. Colbert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMPLEMENTING CONNECTION OF TWO LARGE ELECTRONIC BOARDS UTILIZING LG...
- Publication number 20140127915
- Publication date May 8, 2014
- International Business Machines Corporation
- Terry F. Banitt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Motherboard Assembly for Interconnecting and Distributing Signals a...
- Publication number 20130055192
- Publication date Feb 28, 2013
- International Business Machines Corporation
- John L. Colbert
- G11 - INFORMATION STORAGE
Information Patent Application
IMPLEMENTING LOADING AND HEAT REMOVAL FOR HUB MODULE ASSEMBLY
- Publication number 20120147563
- Publication date Jun 14, 2012
- International Business Machines Corporation
- John L. Colbert
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MULTI-CHIP MODULE SYSTEM WITH REMOVABLE SOCKETED MODULES
- Publication number 20120098116
- Publication date Apr 26, 2012
- International Business Machines Corporation
- Jon Alfred Casey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Meeting Calendar Optimization
- Publication number 20110320237
- Publication date Dec 29, 2011
- International Business Machines Corporation
- Brian S. Beaman
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
LARGE SCALE HYBRID SOCKET FOR AN AREA ARRAY DEVICE
- Publication number 20110287638
- Publication date Nov 24, 2011
- International Business Machines Corporation
- Brian S. Beaman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Motherboard Assembly for Interconnecting and Distributing Signals a...
- Publication number 20110085313
- Publication date Apr 14, 2011
- International Business Machines Corporation
- John L. Colbert
- G11 - INFORMATION STORAGE
Information Patent Application
IMPLEMENTING ENHANCED CONNECTOR GUIDE BLOCK STRUCTURES FOR ROBUST S...
- Publication number 20110008994
- Publication date Jan 13, 2011
- International Business Machines Corporation
- William L. Brodsky
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
DUAL SWIVEL IN-LINE LOAD NODE LOCK MECHANISM
- Publication number 20100078397
- Publication date Apr 1, 2010
- International Business Machines Corporation
- John Lee Colbert
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Electronic Assembly and Techniques for Installing a Heatsink in an...
- Publication number 20090083972
- Publication date Apr 2, 2009
- John L. Colbert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR ATTACHING HEATSINKS
- Publication number 20090034198
- Publication date Feb 5, 2009
- International Business Machines Corporation
- John L. Colbert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COLD PLATE STABILITY
- Publication number 20080308260
- Publication date Dec 18, 2008
- International Business Machines Corporation
- Levi A. Campbell
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Electrically Connecting Two Substrates Using a Resilient Wire Bundl...
- Publication number 20080282539
- Publication date Nov 20, 2008
- International Business Machines Corporation
- William Louis Brodsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mounting a Heat Sink in Thermal Contact with an Electronic Component
- Publication number 20080264603
- Publication date Oct 30, 2008
- International Business Machines Corporation
- John Lee Colbert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and Apparatuses for Cold Plate Stability
- Publication number 20080266799
- Publication date Oct 30, 2008
- Levi A. Campbell
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Mounting a Heat Sink in Thermal Contact with an Electronic Component
- Publication number 20080259572
- Publication date Oct 23, 2008
- International Business Machines Corporation
- John Lee Colbert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CUSTOMIZABLE BACKER FOR ACHIEVING CONSISTENT LOADING AND ENGAGEMENT...
- Publication number 20080233771
- Publication date Sep 25, 2008
- International Business Machines Corporation
- John Lee COLBERT
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS FOR CONFIGURING TUBING FOR INTERCONNECTING IN-SERIES MULTIP...
- Publication number 20080163631
- Publication date Jul 10, 2008
- International Business Machines Corporation
- Levi A. CAMPBELL
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HIGH PERFORMANCE REWORKABLE HEATSINK AND PACKAGING STRUCTURE WITH S...
- Publication number 20080044949
- Publication date Feb 21, 2008
- International Business Machines Corporation
- John Lee Colbert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Applying Thermal Interface Material
- Publication number 20080044576
- Publication date Feb 21, 2008
- John L. Colbert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heatsink Apparatus for Applying a Specified Compressive Force to an...
- Publication number 20080024991
- Publication date Jan 31, 2008
- John L. Colbert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Customizable Backer for Achieving Consistent Loading and Engagement...
- Publication number 20080009152
- Publication date Jan 10, 2008
- John Lee Colbert
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Non-Influencing Fastener for Mounting a Heat Sink in Contact with a...
- Publication number 20070247813
- Publication date Oct 25, 2007
- John Lee Colbert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus for Effecting Reliable Heat Transfer of Bare Die Microele...
- Publication number 20070241449
- Publication date Oct 18, 2007
- International Business Machines Corporation
- John Lee Colbert
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Method and Apparatus for Electrically Connecting Two Substrates Usi...
- Publication number 20070227769
- Publication date Oct 4, 2007
- William Louis Brodsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Electrically Connecting Two Substrates Usi...
- Publication number 20070226997
- Publication date Oct 4, 2007
- William Louis Brodsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High performance reworkable heatsink and packaging structure with s...
- Publication number 20070145574
- Publication date Jun 28, 2007
- International Business Machines Corporation
- John Lee Colbert
- H01 - BASIC ELECTRIC ELEMENTS

John Lee COLBERT

Person

Patents Grantslast 30 patents

Packaging for eight-socket one-hop SMP topology

Packaging for eight-socket one-hop SMP topology

Implementing heat sink loading having multipoint loading with actua...

Motherboard assembly for interconnecting and distributing signals a...

Implementing connection of two large electronic boards utilizing LG...

Multi-chip module system with removable socketed modules

Motherboard assembly for interconnecting and distributing signals a...

Implementing loading and heat removal for hub module assembly

Alignment structure having a frame structure and bridging connectio...

Implementing enhanced connector guide block structures for robust S...

Mounting a heat sink in thermal contact with an electronic component

Cold plate stability

Heatsink apparatus for applying a specified compressive force to an...

Electrically connecting two substrates using a resilient wire bundl...

Methods for configuring tubing for interconnecting in-series multip...

Dual swivel in-line load node lock mechanism

Electronic assembly and techniques for installing a heatsink in an...

Mounting a heat sink in thermal contact with an electronic component

Apparatus for effecting reliable heat transfer of bare die microele...

Customizable backer for achieving consistent loading and engagement...

Cold plate stability

Mounting a heat sink in thermal contact with an electronic component

High performance reworkable heatsink and packaging structure with s...

Customizable backer for achieving consistent loading and engagement...

Non-influencing fastener for mounting a heat sink in contact with a...

High performance reworkable heatsink and packaging structure with s...

Apparatus for effecting reliable heat transfer of bare die microele...

Method and apparatus for electrically connecting two substrates usi...

Method and apparatus for managing aligning and coupling of a land g...

Method and apparatus for mounting a heat transfer apparatus upon an...

Patents Applicationslast 30 patents

Packaging for Eight-Socket One-Hop SMP Topology

Packaging for Eight-Socket One-Hop SMP Topology

IMPLEMENTING HEAT SINK LOADING HAVING MULTIPOINT LOADING WITH ACTUA...

IMPLEMENTING CONNECTION OF TWO LARGE ELECTRONIC BOARDS UTILIZING LG...

Motherboard Assembly for Interconnecting and Distributing Signals a...

IMPLEMENTING LOADING AND HEAT REMOVAL FOR HUB MODULE ASSEMBLY

MULTI-CHIP MODULE SYSTEM WITH REMOVABLE SOCKETED MODULES

Meeting Calendar Optimization

LARGE SCALE HYBRID SOCKET FOR AN AREA ARRAY DEVICE

Motherboard Assembly for Interconnecting and Distributing Signals a...

IMPLEMENTING ENHANCED CONNECTOR GUIDE BLOCK STRUCTURES FOR ROBUST S...

DUAL SWIVEL IN-LINE LOAD NODE LOCK MECHANISM

Electronic Assembly and Techniques for Installing a Heatsink in an...

APPARATUS AND METHOD FOR ATTACHING HEATSINKS

COLD PLATE STABILITY

Electrically Connecting Two Substrates Using a Resilient Wire Bundl...

Mounting a Heat Sink in Thermal Contact with an Electronic Component

Methods and Apparatuses for Cold Plate Stability

Mounting a Heat Sink in Thermal Contact with an Electronic Component

CUSTOMIZABLE BACKER FOR ACHIEVING CONSISTENT LOADING AND ENGAGEMENT...

METHODS FOR CONFIGURING TUBING FOR INTERCONNECTING IN-SERIES MULTIP...

HIGH PERFORMANCE REWORKABLE HEATSINK AND PACKAGING STRUCTURE WITH S...

Method and Apparatus for Applying Thermal Interface Material

Heatsink Apparatus for Applying a Specified Compressive Force to an...

Customizable Backer for Achieving Consistent Loading and Engagement...

Non-Influencing Fastener for Mounting a Heat Sink in Contact with a...

Apparatus for Effecting Reliable Heat Transfer of Bare Die Microele...

Method and Apparatus for Electrically Connecting Two Substrates Usi...

Method and Apparatus for Electrically Connecting Two Substrates Usi...

High performance reworkable heatsink and packaging structure with s...