John M. Boyd

Person

Ataseadero, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method and apparatus for wafer electroless plating
- Patent number 9,287,110
- Issue date Mar 15, 2016
- Lam Research Corporation
- William Thie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Controlled ambient system for interface engineering
- Patent number 9,117,860
- Issue date Aug 25, 2015
- Lam Research Corporation
- John Boyd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for the removal of a fluorinated polymer from a substrate
- Patent number 8,926,789
- Issue date Jan 6, 2015
- Lam Research Corporation
- Hyungsuk Alexander Yoon
- B08 - CLEANING
Information Patent Grant
Method for barrier interface preparation of copper interconnect
- Patent number 8,916,232
- Issue date Dec 23, 2014
- Lam Research Corporation
- Hyungsuk Alexander Yoon
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Processes and systems for engineering a copper surface for selectiv...
- Patent number 8,771,804
- Issue date Jul 8, 2014
- Lam Research Corporation
- Yezdi Dordi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Processes and systems for engineering a silicon-type surface for se...
- Patent number 8,747,960
- Issue date Jun 10, 2014
- Lam Research Corporation
- Yezdi Dordi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for removing material from semiconductor wafer and apparatus...
- Patent number 8,691,027
- Issue date Apr 8, 2014
- Lam Research Corporation
- Mikhail Korolik
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Simultaneous electroless plating of two substrates
- Patent number 8,622,020
- Issue date Jan 7, 2014
- Lam Research Corporation
- William Thie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods for atomic layer deposition
- Patent number 8,623,456
- Issue date Jan 7, 2014
- Lam Research Corporation
- Hyungsuk Alexander Yoon
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and apparatus for material deposition
- Patent number 8,490,573
- Issue date Jul 23, 2013
- Lam Research Corporation
- Yezdi Dordi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electroplating head and method for operating the same
- Patent number 8,419,917
- Issue date Apr 16, 2013
- Lam Research Corporation
- Yezdi Dordi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Pre-planarization system and method
- Patent number 8,403,727
- Issue date Mar 26, 2013
- Lam Research Corporation
- Fred C. Redeker
- B24 - GRINDING POLISHING
Information Patent Grant
System method and apparatus for dry-in, dry-out, low defect laser d...
- Patent number 8,330,072
- Issue date Dec 11, 2012
- Lam Research Corporation
- John M. Boyd
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for removing material from semiconductor wafer and apparatus...
- Patent number 8,323,420
- Issue date Dec 4, 2012
- Lam Research Corporation
- Mikhail Korolik
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Processes and systems for engineering a barrier surface for copper...
- Patent number 8,241,701
- Issue date Aug 14, 2012
- Lam Research Corporation
- Yezdi Dordi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods and systems for barrier layer surface passivation
- Patent number 8,133,812
- Issue date Mar 13, 2012
- Lam Research Corporation
- Yezdi Dordi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods and systems for low interfacial oxide contact between barri...
- Patent number 8,053,355
- Issue date Nov 8, 2011
- Lam Research Corporation
- Fritz Redeker
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and apparatus for plating semiconductor wafers
- Patent number 8,048,283
- Issue date Nov 1, 2011
- Lam Research Corporation
- Yezdi Dordi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Interconnect structure and method of manufacturing a damascene stru...
- Patent number 8,026,605
- Issue date Sep 27, 2011
- Lam Research Corporation
- Yezdi Dordi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for depositing and planarizing thin films of s...
- Patent number 7,947,157
- Issue date May 24, 2011
- Lam Research Corporation
- Mike Ravkin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for electroless depositing a material on a surface of a wafer
- Patent number 7,875,554
- Issue date Jan 25, 2011
- Lam Research Corporation
- Yezdi Dordi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Apparatus for plating semiconductor wafers
- Patent number 7,862,693
- Issue date Jan 4, 2011
- Lam Research Corporation
- Yezdi N. Dordi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroless plating method and apparatus
- Patent number 7,829,152
- Issue date Nov 9, 2010
- Lam Research Corporation
- William Thie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate preparation using megasonic coupling fluid meniscus and m...
- Patent number 7,810,513
- Issue date Oct 12, 2010
- Lam Research Corporation
- John M. Boyd
- B08 - CLEANING
Information Patent Grant
Methods and systems for low interfacial oxide contact between barri...
- Patent number 7,749,893
- Issue date Jul 6, 2010
- Lam Research Corporation
- Fritz Redeker
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods for providing a confined liquid for immersion lithography
- Patent number 7,749,689
- Issue date Jul 6, 2010
- Lam Research Corporation
- David Hemker
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method and apparatus for plating semiconductor wafers
- Patent number 7,704,367
- Issue date Apr 27, 2010
- Lam Research Corporation
- Yezdi Dordi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for the removal of a fluorinated polymer from a substrate...
- Patent number 7,691,278
- Issue date Apr 6, 2010
- Lam Research Corporation
- Hyungsuk Alexander Yoon
- B08 - CLEANING
Information Patent Grant
System method and apparatus for dry-in, dry-out, low defect laser d...
- Patent number 7,675,000
- Issue date Mar 9, 2010
- Lam Research Corporation
- John M. Boyd
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for semiconductor wafer electroplanarization
- Patent number 7,648,616
- Issue date Jan 19, 2010
- Lam Research Corporation
- John M. Boyd
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PROCESSES AND SYSTEMS FOR ENGINEERING A BARRIER SURFACE FOR COPPER...
- Publication number 20150214093
- Publication date Jul 30, 2015
- LAM RESEARCH CORPORATION
- Yezdi Dordi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR BARRIER INTERFACE PREPARATION OF COPPER INTERCONNECT
- Publication number 20150132946
- Publication date May 14, 2015
- LAM RESEARCH CORPORATION
- Hyungsuk Alexander Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR BARRIER INTERFACE PREPARATION OF COPPER INTERCONNECT
- Publication number 20150128861
- Publication date May 14, 2015
- LAM RESEARCH CORPORATION
- Hyungsuk Alexander Yoon
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PROCESSES AND SYSTEMS FOR ENGINEERING A COPPER SURFACE FOR SELECTIV...
- Publication number 20140322446
- Publication date Oct 30, 2014
- Yezdi Dordi
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
METHOD FOR REMOVING MATERIAL FROM SEMICONDUCTOR WAFER AND APPARATUS...
- Publication number 20130061887
- Publication date Mar 14, 2013
- Mikhail Korolik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Processes and Systems for Engineering a Barrier Surface for Copper...
- Publication number 20120269987
- Publication date Oct 25, 2012
- LAM RESEARCH CORPORATION
- Yezdi Dordi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
INTERCONNECT STRUCTURE AND METHOD OF MANUFACTURING A DAMASCENE STRU...
- Publication number 20110306203
- Publication date Dec 15, 2011
- LAM RESEARCH CORPORATION
- Yezdi Dordi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR DEPOSITING AND PLANARIZING THIN FILMS OF S...
- Publication number 20110155563
- Publication date Jun 30, 2011
- Lam Research Corp.
- Mike Ravkin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method and Apparatus for Material Deposition
- Publication number 20110081779
- Publication date Apr 7, 2011
- LAM RESEARCH CORPORATION
- Yezdi Dordi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Electroless Plating Method and Apparatus
- Publication number 20110011335
- Publication date Jan 20, 2011
- William Thie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE PREPARATION USING MEGASONIC COUPLING FLUID MENISCUS
- Publication number 20100319726
- Publication date Dec 23, 2010
- John M. Boyd
- B08 - CLEANING
Information Patent Application
METHODS AND SYSTEMS FOR LOW INTERFACIAL OXIDE CONTACT BETWEEN BARRI...
- Publication number 20100267229
- Publication date Oct 21, 2010
- Fritz Redeker
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
APPARATUS FOR THE REMOVAL OF A FLUORINATED POLYMER FROM A SUBSTRATE
- Publication number 20100181025
- Publication date Jul 22, 2010
- Hyungsuk Alexander Yoon
- B08 - CLEANING
Information Patent Application
Method and Apparatus for Plating Semiconductor Wafers
- Publication number 20100170803
- Publication date Jul 8, 2010
- LAM RESEARCH CORPORATION
- Yezdi Dordi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SYSTEM METHOD AND APPARATUS FOR DRY-IN, DRY-OUT, LOW DEFECT LASER D...
- Publication number 20100108652
- Publication date May 6, 2010
- John M. Boyd
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS AND SYSTEMS FOR BARRIER LAYER SURFACE PASSIVATION
- Publication number 20100009535
- Publication date Jan 14, 2010
- Yezdi Dordi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Apparatus for Plating Semiconductor Wafers
- Publication number 20090321250
- Publication date Dec 31, 2009
- Lam Research Corp.
- Yezdi N. Dordi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Self assembled monolayer for improving adhesion between copper and...
- Publication number 20090304914
- Publication date Dec 10, 2009
- LAM RESEARCH CORPORATION
- Praveen Nalla
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Electroplating Head and Method for Operating the Same
- Publication number 20090242413
- Publication date Oct 1, 2009
- LAM RESEARCH CORPORATION
- Yezdi Dordi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Apparatus and method for plating semiconductor wafers
- Publication number 20080271992
- Publication date Nov 6, 2008
- Lam Research Corp.
- Yezdi N. Dordi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Apparatus and Method for Confined Area Planarization
- Publication number 20080227369
- Publication date Sep 18, 2008
- LAM RESEARCH CORPORATION
- John M. Boyd
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Methods for Providing a Confined Liquid for Immersion Lithography
- Publication number 20080171292
- Publication date Jul 17, 2008
- Lam Research Corp.
- David Hemker
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
ENHANCED WAFER CLEANING METHOD
- Publication number 20080169008
- Publication date Jul 17, 2008
- Seokmin Yun
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method and Apparatus for Semiconductor Wafer Planarization
- Publication number 20080166885
- Publication date Jul 10, 2008
- LAM RESEARCH CORPORATION
- Fred C. Redeker
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Self-limiting plating method
- Publication number 20080152823
- Publication date Jun 26, 2008
- Lam Research Corporation
- John Boyd
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method and Apparatus for Material Deposition
- Publication number 20080153291
- Publication date Jun 26, 2008
- LAM RESEARCH CORPORATION
- Yezdi Dordi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Methods and systems for low interfacial oxide contact between barri...
- Publication number 20080142972
- Publication date Jun 19, 2008
- Fritz Redeker
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Methods and systems for barrier layer surface passivation
- Publication number 20080146025
- Publication date Jun 19, 2008
- Yezdi Dordi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Interconnect structure and method of manufacturing a damascene stru...
- Publication number 20080142971
- Publication date Jun 19, 2008
- LAM RESEARCH CORPORATION
- Yezdi Dordi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of proximity head brushing
- Publication number 20080105277
- Publication date May 8, 2008
- LAM RESEARCH CORPORATION
- John M. Boyd
- H01 - BASIC ELECTRIC ELEMENTS

John M. Boyd

Person

Patents Grantslast 30 patents

Method and apparatus for wafer electroless plating

Controlled ambient system for interface engineering

Apparatus for the removal of a fluorinated polymer from a substrate

Method for barrier interface preparation of copper interconnect

Processes and systems for engineering a copper surface for selectiv...

Processes and systems for engineering a silicon-type surface for se...

Method for removing material from semiconductor wafer and apparatus...

Simultaneous electroless plating of two substrates

Methods for atomic layer deposition

Method and apparatus for material deposition

Electroplating head and method for operating the same

Pre-planarization system and method

System method and apparatus for dry-in, dry-out, low defect laser d...

Method for removing material from semiconductor wafer and apparatus...

Processes and systems for engineering a barrier surface for copper...

Methods and systems for barrier layer surface passivation

Methods and systems for low interfacial oxide contact between barri...

Method and apparatus for plating semiconductor wafers

Interconnect structure and method of manufacturing a damascene stru...

Apparatus and method for depositing and planarizing thin films of s...

Method for electroless depositing a material on a surface of a wafer

Apparatus for plating semiconductor wafers

Electroless plating method and apparatus

Substrate preparation using megasonic coupling fluid meniscus and m...

Methods and systems for low interfacial oxide contact between barri...

Methods for providing a confined liquid for immersion lithography

Method and apparatus for plating semiconductor wafers

Apparatus for the removal of a fluorinated polymer from a substrate...

System method and apparatus for dry-in, dry-out, low defect laser d...

Apparatus and method for semiconductor wafer electroplanarization

Patents Applicationslast 30 patents

PROCESSES AND SYSTEMS FOR ENGINEERING A BARRIER SURFACE FOR COPPER...

METHODS FOR BARRIER INTERFACE PREPARATION OF COPPER INTERCONNECT

APPARATUS FOR BARRIER INTERFACE PREPARATION OF COPPER INTERCONNECT

PROCESSES AND SYSTEMS FOR ENGINEERING A COPPER SURFACE FOR SELECTIV...

METHOD FOR REMOVING MATERIAL FROM SEMICONDUCTOR WAFER AND APPARATUS...

Processes and Systems for Engineering a Barrier Surface for Copper...

INTERCONNECT STRUCTURE AND METHOD OF MANUFACTURING A DAMASCENE STRU...

APPARATUS AND METHOD FOR DEPOSITING AND PLANARIZING THIN FILMS OF S...

Method and Apparatus for Material Deposition

Electroless Plating Method and Apparatus

SUBSTRATE PREPARATION USING MEGASONIC COUPLING FLUID MENISCUS

METHODS AND SYSTEMS FOR LOW INTERFACIAL OXIDE CONTACT BETWEEN BARRI...

APPARATUS FOR THE REMOVAL OF A FLUORINATED POLYMER FROM A SUBSTRATE

Method and Apparatus for Plating Semiconductor Wafers

SYSTEM METHOD AND APPARATUS FOR DRY-IN, DRY-OUT, LOW DEFECT LASER D...

METHODS AND SYSTEMS FOR BARRIER LAYER SURFACE PASSIVATION

Apparatus for Plating Semiconductor Wafers

Self assembled monolayer for improving adhesion between copper and...

Electroplating Head and Method for Operating the Same

Apparatus and method for plating semiconductor wafers

Apparatus and Method for Confined Area Planarization

Methods for Providing a Confined Liquid for Immersion Lithography

ENHANCED WAFER CLEANING METHOD

Method and Apparatus for Semiconductor Wafer Planarization

Self-limiting plating method

Method and Apparatus for Material Deposition

Methods and systems for low interfacial oxide contact between barri...

Methods and systems for barrier layer surface passivation

Interconnect structure and method of manufacturing a damascene stru...

Methods of proximity head brushing