John M. Boyd

Person

Ottawa, CA

People

Patents Grantslast 30 patents

Information Patent Grant
Apparatus and method for atomic layer deposition
- Patent number 9,359,673
- Issue date Jun 7, 2016
- Lam Research Corporation
- Hyungsuk Alexander Yoon
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Fluid handling system for wafer electroless plating and associated...
- Patent number 8,844,461
- Issue date Sep 30, 2014
- Lam Research Corporation
- William Thie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods and apparatuses for three dimensional integrated circuits
- Patent number 8,673,769
- Issue date Mar 18, 2014
- Lam Research Corporation
- John Boyd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device with post-contact back end of line through-hole via integration
- Patent number 8,519,461
- Issue date Aug 27, 2013
- Lam Research Corporation
- John Boyd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for wafer electroless plating
- Patent number 8,485,120
- Issue date Jul 16, 2013
- Lam Research Corporation
- William Thie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods and systems for three-dimensional integrated circuit throug...
- Patent number 8,323,460
- Issue date Dec 4, 2012
- Lam Research Corporation
- John Boyd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer electroless plating system and associated methods
- Patent number 8,314,027
- Issue date Nov 20, 2012
- Lam Research Corporation
- William Thie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Apparatus and method for atomic layer deposition
- Patent number 8,287,647
- Issue date Oct 16, 2012
- Lam Research Corporation
- Hyungsuk Alexander Yoon
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods of post-contact back end of line through-hole via integration
- Patent number 8,187,968
- Issue date May 29, 2012
- Lam Research Corporation
- John Boyd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer electroless plating system and associated methods
- Patent number 8,069,813
- Issue date Dec 6, 2011
- Lam Research Corporation
- William Thie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Megasonic cleaning efficiency using auto-tuning of a RF generator a...
- Patent number 7,909,934
- Issue date Mar 22, 2011
- Lam Research Corporation
- John Boyd
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Grant
Thermal methods for cleaning post-CMP wafers
- Patent number 7,884,017
- Issue date Feb 8, 2011
- Lam Research Corporation
- Zhonghui Alex Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for applying a plating solution for electroless deposition
- Patent number 7,752,996
- Issue date Jul 13, 2010
- Lam Research Corporation
- Yezdi Dordi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Thermal methods for cleaning post-CMP wafers
- Patent number 7,709,400
- Issue date May 4, 2010
- Lam Research Corporation
- Zhonghui Alex Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of post-contact back end of the line through-hole via integ...
- Patent number 7,615,480
- Issue date Nov 10, 2009
- Lam Research Corporation
- John Boyd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for integrated surface treatment and depositio...
- Patent number 7,615,486
- Issue date Nov 10, 2009
- Lam Research Corporation
- Hyungsuk Alexander Yoon
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Integrated circuit structure and method of fabrication thereof
- Patent number 5,773,871
- Issue date Jun 30, 1998
- Northern Telecom Limited
- John M. Boyd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming integrated circuit structure
- Patent number 5,726,084
- Issue date Mar 10, 1998
- Northern Telecom Limited
- John M. Boyd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Buried layer contact for an integrated circuit structure
- Patent number 5,614,750
- Issue date Mar 25, 1997
- Northern Telecom Limited
- Joseph P. Ellul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a transistor
- Patent number 5,516,710
- Issue date May 14, 1996
- Northern Telecom Limited
- John M. Boyd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench capacitor structure
- Patent number 5,394,000
- Issue date Feb 28, 1995
- Northern Telecom Limited
- Joseph P. Ellul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making integrated circuits
- Patent number 5,362,669
- Issue date Nov 8, 1994
- Northern Telecom Limited
- John M. Boyd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench resistors for integrated circuits
- Patent number 5,352,923
- Issue date Oct 4, 1994
- Northern Telecom Limited
- John M. Boyd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming resistors for intergrated circuits
- Patent number 5,316,978
- Issue date May 31, 1994
- Northern Telecom Limited
- John M. Boyd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming electrodes for trench capacitors
- Patent number 5,275,974
- Issue date Jan 4, 1994
- Northern Telecom Limited
- Joseph P. Ellul
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS AND APPARATUSES FOR THREE DIMENSIONAL INTEGRATED CIRCUITS
- Publication number 20140145334
- Publication date May 29, 2014
- John BOYD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Wafer Electroless Plating
- Publication number 20130280917
- Publication date Oct 24, 2013
- William Thie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS FOR THREE-DIMENSIONAL INTEGRATED CIRCUIT THROUGH HOLE VIA G...
- Publication number 20130171820
- Publication date Jul 4, 2013
- LAM RESEARCH CORPORATION
- John Boyd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR ATOMIC LAYER DEPOSITION
- Publication number 20130040460
- Publication date Feb 14, 2013
- LAM RESEARCH CORPORATION
- Hyungsuk Alexander Yoon
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
APPARATUS AND METHOD FOR ATOMIC LAYER DEPOSITION
- Publication number 20120248219
- Publication date Oct 4, 2012
- LAM RESEARCH CORPORATION
- Hyungsuk Alexander Yoon
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DEVICE WITH POST-CONTACT BACK END OF LINE THROUGH-HOLE VIA INTEGRATION
- Publication number 20120205807
- Publication date Aug 16, 2012
- John Boyd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Electroless Plating System and Associated Methods
- Publication number 20120045897
- Publication date Feb 23, 2012
- LAM RESEARCH CORPORATION
- William Thie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Apparatus for Applying a Plating Solution for Electroless Deposition
- Publication number 20100239767
- Publication date Sep 23, 2010
- Yezdi Dordi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
THERMAL METHODS FOR CLEANING POST-CMP WAFERS
- Publication number 20100136788
- Publication date Jun 3, 2010
- LAM RESEARCH CORPORATION
- Zhonghui Alex Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF POST-CONTACT BACK END OF LINE THROUGH-HOLE VIA INTEGRATION
- Publication number 20100044867
- Publication date Feb 25, 2010
- John Boyd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR INTEGRATED SURFACE TREATMENT AND DEPOSITION FOR COPPE...
- Publication number 20090320749
- Publication date Dec 31, 2009
- Hyungsuk Alexander Yoon
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Methods of post-contact back end of line through-hole via integration
- Publication number 20080315418
- Publication date Dec 25, 2008
- John Boyd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and apparatuses for three dimensional integrated circuits
- Publication number 20080315422
- Publication date Dec 25, 2008
- John Boyd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and systems for three-dimensional integrated circuit throug...
- Publication number 20080314756
- Publication date Dec 25, 2008
- John Boyd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal methods for cleaning post-CMP wafers
- Publication number 20080280456
- Publication date Nov 13, 2008
- Lam Research Corporation
- Zhonghui Alex Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR INTEGRATED SURFACE TREATMENT AND DEPOSITIO...
- Publication number 20080260940
- Publication date Oct 23, 2008
- Hyungsuk Alexander Yoon
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
APPARATUS AND METHOD FOR ATOMIC LAYER DEPOSITION
- Publication number 20080261412
- Publication date Oct 23, 2008
- Hyungsuk Alexander Yoon
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
APPARATUS AND METHOD FOR INTEGRATED SURFACE TREATMENT AND FILM DEPO...
- Publication number 20080260967
- Publication date Oct 23, 2008
- Hyungsuk Alexander Yoon
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
APPARATUS AND METHOD FOR PRE AND POST TREATMENT OF ATOMIC LAYER DEP...
- Publication number 20080260963
- Publication date Oct 23, 2008
- Hyungsuk Alexander Yoon
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Fluid Handling System for Wafer Electroless Plating and Associated...
- Publication number 20080251148
- Publication date Oct 16, 2008
- LAM RESEARCH CORPORATION
- William Thie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Wafer Electroless Plating System and Associated Methods
- Publication number 20080254621
- Publication date Oct 16, 2008
- LAM RESEARCH CORPORATION
- William Thie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method and Apparatus for Wafer Electroless Plating
- Publication number 20080254225
- Publication date Oct 16, 2008
- LAM RESEARCH CORPORATION
- William Thie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

John M. Boyd

Person

Patents Grantslast 30 patents

Apparatus and method for atomic layer deposition

Fluid handling system for wafer electroless plating and associated...

Methods and apparatuses for three dimensional integrated circuits

Device with post-contact back end of line through-hole via integration

Method and apparatus for wafer electroless plating

Methods and systems for three-dimensional integrated circuit throug...

Wafer electroless plating system and associated methods

Apparatus and method for atomic layer deposition

Methods of post-contact back end of line through-hole via integration

Wafer electroless plating system and associated methods

Megasonic cleaning efficiency using auto-tuning of a RF generator a...

Thermal methods for cleaning post-CMP wafers

Apparatus for applying a plating solution for electroless deposition

Thermal methods for cleaning post-CMP wafers

Methods of post-contact back end of the line through-hole via integ...

Apparatus and method for integrated surface treatment and depositio...

Integrated circuit structure and method of fabrication thereof

Method for forming integrated circuit structure

Buried layer contact for an integrated circuit structure

Method of forming a transistor

Trench capacitor structure

Method of making integrated circuits

Trench resistors for integrated circuits

Forming resistors for intergrated circuits

Method of forming electrodes for trench capacitors

Patents Applicationslast 30 patents

METHODS AND APPARATUSES FOR THREE DIMENSIONAL INTEGRATED CIRCUITS

Method and Apparatus for Wafer Electroless Plating

METHODS FOR THREE-DIMENSIONAL INTEGRATED CIRCUIT THROUGH HOLE VIA G...

METHODS FOR ATOMIC LAYER DEPOSITION

APPARATUS AND METHOD FOR ATOMIC LAYER DEPOSITION

DEVICE WITH POST-CONTACT BACK END OF LINE THROUGH-HOLE VIA INTEGRATION

Wafer Electroless Plating System and Associated Methods

Apparatus for Applying a Plating Solution for Electroless Deposition

THERMAL METHODS FOR CLEANING POST-CMP WAFERS

METHODS OF POST-CONTACT BACK END OF LINE THROUGH-HOLE VIA INTEGRATION

APPARATUS FOR INTEGRATED SURFACE TREATMENT AND DEPOSITION FOR COPPE...

Methods of post-contact back end of line through-hole via integration

Methods and apparatuses for three dimensional integrated circuits

Methods and systems for three-dimensional integrated circuit throug...

Thermal methods for cleaning post-CMP wafers

APPARATUS AND METHOD FOR INTEGRATED SURFACE TREATMENT AND DEPOSITIO...

APPARATUS AND METHOD FOR ATOMIC LAYER DEPOSITION

APPARATUS AND METHOD FOR INTEGRATED SURFACE TREATMENT AND FILM DEPO...

APPARATUS AND METHOD FOR PRE AND POST TREATMENT OF ATOMIC LAYER DEP...

Fluid Handling System for Wafer Electroless Plating and Associated...

Wafer Electroless Plating System and Associated Methods

Method and Apparatus for Wafer Electroless Plating