John M. Cotte

Person

New Fairfield, CT, US

People

Patents Grantslast 30 patents

Information Patent Grant
Downstop and bump bonds formation on substrates
- Patent number 12,150,390
- Issue date Nov 19, 2024
- International Business Machines Corporation
- David Abraham
Information Patent Grant
Create a protected layer for interconnects and devices in a package...
- Patent number 12,033,981
- Issue date Jul 9, 2024
- International Business Machines Corporation
- David Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer chips and enclosures for quantum circuits
- Patent number 11,908,756
- Issue date Feb 20, 2024
- International Business Machines Corporation
- David Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Combined backing plate and housing for use in bump bonded chip asse...
- Patent number 11,804,442
- Issue date Oct 31, 2023
- International Business Machines Corporation
- David Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Combined backing plate and housing for use in bump bonded chip asse...
- Patent number 11,676,903
- Issue date Jun 13, 2023
- International Business Machines Corporation
- David Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Superconducting airbridge crossover using superconducting sacrifici...
- Patent number 11,380,974
- Issue date Jul 5, 2022
- International Business Machines Corporation
- Josephine B. Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Use of a reactive, or reducing gas as a method to increase contact...
- Patent number 11,111,136
- Issue date Sep 7, 2021
- International Business Machines Corporation
- John M. Cotte
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device including superconducting metal through-silico...
- Patent number 10,833,016
- Issue date Nov 10, 2020
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump bonded cryogenic chip carrier
- Patent number 10,734,567
- Issue date Aug 4, 2020
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump bonded cryogenic chip carrier
- Patent number 10,727,391
- Issue date Jul 28, 2020
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple sized bump bonds
- Patent number 10,727,192
- Issue date Jul 28, 2020
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-destructive testing of integrated circuit chips
- Patent number 10,651,099
- Issue date May 12, 2020
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Two-component bump metallization
- Patent number 10,629,797
- Issue date Apr 21, 2020
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Two-component bump metallization
- Patent number 10,608,158
- Issue date Mar 31, 2020
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including superconducting metal through-silico...
- Patent number 10,504,842
- Issue date Dec 10, 2019
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-substrate-vias with self-aligned solder bumps
- Patent number 10,347,600
- Issue date Jul 9, 2019
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-substrate-vias with self-aligned solder bumps
- Patent number 10,325,870
- Issue date Jun 18, 2019
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Use of a reactive, or reducing gas as a method to increase contact...
- Patent number 10,308,506
- Issue date Jun 4, 2019
- International Business Machines Corporation
- John M. Cotte
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for fabricating a photovoltaic device by uniform plating on...
- Patent number 10,199,516
- Issue date Feb 5, 2019
- International Business Machines Corporation
- Brett Caroline Baker-O'Neal
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Superconducting airbridge crossover using superconducting sacrifici...
- Patent number 10,170,817
- Issue date Jan 1, 2019
- International Business Machines Corporation
- Josephine B. Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device including superconducting metal through-silico...
- Patent number 10,157,842
- Issue date Dec 18, 2018
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a photovoltaic device by uniform plating on...
- Patent number 9,716,192
- Issue date Jul 25, 2017
- International Business Machines Corporation
- Brett Caroline Baker-O'Neal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Superconducting airbridge crossover using superconducting sacrifici...
- Patent number 9,614,270
- Issue date Apr 4, 2017
- International Business Machines Corporation
- Josephine B. Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for constructing semiconductor chip packages...
- Patent number 9,159,602
- Issue date Oct 13, 2015
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Implantless dopant segregation for silicide contacts
- Patent number 8,889,537
- Issue date Nov 18, 2014
- International Business Machines Corporation
- Cryil Cabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ta—TaN selective removal process for integrated device fabrication
- Patent number 8,865,597
- Issue date Oct 21, 2014
- International Business Machines Corporation
- John M. Cotte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for the rapid thermal control of a work piece...
- Patent number 8,828,143
- Issue date Sep 9, 2014
- International Business Machines Corporation
- John P. Simons
- B08 - CLEANING
Information Patent Grant
Electrodeposition under illumination without electrical contacts
- Patent number 8,795,502
- Issue date Aug 5, 2014
- International Business Machines Corporation
- John M. Cotte
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Through substrate vias
- Patent number 8,796,138
- Issue date Aug 5, 2014
- International Business Machiness Corporation
- John Michael Cotte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to evaluate effectiveness of substrate cleanness and quantit...
- Patent number 8,604,337
- Issue date Dec 10, 2013
- International Business Machines Corporation
- John M. Cotte
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Patents Applicationslast 30 patents

Information Patent Application
INTERCONNECT CHIP AND L-COUPLER FOR MODULAR QUANTUM LINKS
- Publication number 20240412090
- Publication date Dec 12, 2024
- International Business Machines Corporation
- Neereja Sundaresan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRONIC APPARATUS MINIMIZING DIFFERENTIAL THERMAL CONTRACTION FO...
- Publication number 20240155759
- Publication date May 9, 2024
- International Business Machines Corporation
- Shawn Anthony Hall
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EDGE CAPACITIVE COUPLING FOR QUANTUM CHIPS
- Publication number 20240104414
- Publication date Mar 28, 2024
- International Business Machines Corporation
- Muir Kumph
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DOWNSTOP AND BUMP BONDS FORMATION ON SUBSTRATES
- Publication number 20230363295
- Publication date Nov 9, 2023
- International Business Machines Corporation
- David Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULAR QUANTUM CHIP DESIGN WITH OVERLAPPING CONNECTION
- Publication number 20230359917
- Publication date Nov 9, 2023
- International Business Machines Corporation
- David Abraham
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRICAL CONNECTIONS BETWEEN DISSIMILAR MATERIALS AT CRYOGENIC TE...
- Publication number 20230363294
- Publication date Nov 9, 2023
- International Business Machines Corporation
- David Abraham
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
COMBINED BACKING PLATE AND HOUSING FOR USE IN BUMP BONDED CHIP ASSE...
- Publication number 20230230927
- Publication date Jul 20, 2023
- International Business Machines Corporation
- David Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER CHIPS AND ENCLOSURES FOR QUANTUM CIRCUITS
- Publication number 20230197539
- Publication date Jun 22, 2023
- International Business Machines Corporation
- David Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYERED PACKAGING FOR SUPERCONDUCTING QUANTUM CIRCUITS
- Publication number 20220199507
- Publication date Jun 23, 2022
- International Business Machines Corporation
- David Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CREATE A PROTECTED LAYER FOR INTERCONNECTS AND DEVICES IN A PACKAGE...
- Publication number 20220189922
- Publication date Jun 16, 2022
- International Business Machines Corporation
- David Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMBINED BACKING PLATE AND HOUSING FOR USE IN BUMP BONDED CHIP ASSE...
- Publication number 20220059465
- Publication date Feb 24, 2022
- International Business Machines Corporation
- David Abraham
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING SUPERCONDUCTING METAL THROUGH-SILICO...
- Publication number 20200251419
- Publication date Aug 6, 2020
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE SIZED BUMP BONDS
- Publication number 20200035585
- Publication date Jan 30, 2020
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE SIZED BUMP BONDS
- Publication number 20190198474
- Publication date Jun 27, 2019
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TWO-COMPONENT BUMP METALLIZATION
- Publication number 20190131510
- Publication date May 2, 2019
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP BONDED CRYOGENIC CHIP CARRIER
- Publication number 20190131509
- Publication date May 2, 2019
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP BONDED CRYOGENIC CHIP CARRIER
- Publication number 20190103541
- Publication date Apr 4, 2019
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TWO-COMPONENT BUMP METALLIZATION
- Publication number 20190103542
- Publication date Apr 4, 2019
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPERCONDUCTING AIRBRIDGE CROSSOVER USING SUPERCONDUCTING SACRIFICI...
- Publication number 20190067787
- Publication date Feb 28, 2019
- International Business Machines Corporation
- Josephine B. CHANG
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
NON-DESTRUCTIVE TESTING OF INTEGRATED CIRCUIT CHIPS
- Publication number 20190013252
- Publication date Jan 10, 2019
- International Business Machines Corporation
- David W. Abraham
- G01 - MEASURING TESTING
Information Patent Application
NON-DESTRUCTIVE TESTING OF INTEGRATED CIRCUIT CHIPS
- Publication number 20190013251
- Publication date Jan 10, 2019
- International Business Machines Corporation
- David W. Abraham
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING SUPERCONDUCTING METAL THROUGH-SILICO...
- Publication number 20180350749
- Publication date Dec 6, 2018
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-SUBSTRATE-VIAS WITH SELF-ALIGNED SOLDER BUMPS
- Publication number 20180331058
- Publication date Nov 15, 2018
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-SUBSTRATE-VIAS WITH SELF-ALIGNED SOLDER BUMPS
- Publication number 20180331057
- Publication date Nov 15, 2018
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
USE OF A REACTIVE, OR REDUCING GAS AS A METHOD TO INCREASE CONTACT...
- Publication number 20180009657
- Publication date Jan 11, 2018
- International Business Machines Corporation
- John M. Cotte
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
THROUGH-SILICON VIA WITH INSULATOR FILL
- Publication number 20180005954
- Publication date Jan 4, 2018
- International Business Machines Corporation
- DAVID W. ABRAHAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-SILICON VIA WITH INJECTION MOLDED FILL
- Publication number 20180005887
- Publication date Jan 4, 2018
- International Business Machines Corporation
- DAVID W. ABRAHAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROWAVE CONNECTORS FOR SEMICONDUCTOR WAFERS
- Publication number 20170365574
- Publication date Dec 21, 2017
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE PREPARATION AND UNIFORM PLATING ON THROUGH WAFER VIAS AND I...
- Publication number 20170309760
- Publication date Oct 26, 2017
- International Business Machines Corporation
- Brett Caroline Baker-O'Neal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
USE OF A REACTIVE, OR REDUCING GAS AS A METHOD TO INCREASE CONTACT...
- Publication number 20170210620
- Publication date Jul 27, 2017
- International Business Machines Corporation
- John M. Cotte M. Cotte Cotte
- B81 - MICRO-STRUCTURAL TECHNOLOGY

John M. Cotte

Person

Patents Grantslast 30 patents

Downstop and bump bonds formation on substrates

Create a protected layer for interconnects and devices in a package...

Interposer chips and enclosures for quantum circuits

Combined backing plate and housing for use in bump bonded chip asse...

Combined backing plate and housing for use in bump bonded chip asse...

Superconducting airbridge crossover using superconducting sacrifici...

Use of a reactive, or reducing gas as a method to increase contact...

Semiconductor device including superconducting metal through-silico...

Bump bonded cryogenic chip carrier

Bump bonded cryogenic chip carrier

Multiple sized bump bonds

Non-destructive testing of integrated circuit chips

Two-component bump metallization

Two-component bump metallization

Semiconductor device including superconducting metal through-silico...

Through-substrate-vias with self-aligned solder bumps

Through-substrate-vias with self-aligned solder bumps

Use of a reactive, or reducing gas as a method to increase contact...

Method for fabricating a photovoltaic device by uniform plating on...

Superconducting airbridge crossover using superconducting sacrifici...

Semiconductor device including superconducting metal through-silico...

Method for fabricating a photovoltaic device by uniform plating on...

Superconducting airbridge crossover using superconducting sacrifici...

Apparatus and methods for constructing semiconductor chip packages...

Implantless dopant segregation for silicide contacts

Ta—TaN selective removal process for integrated device fabrication

Apparatus and method for the rapid thermal control of a work piece...

Electrodeposition under illumination without electrical contacts

Through substrate vias

Method to evaluate effectiveness of substrate cleanness and quantit...

Patents Applicationslast 30 patents

INTERCONNECT CHIP AND L-COUPLER FOR MODULAR QUANTUM LINKS

ELECTRONIC APPARATUS MINIMIZING DIFFERENTIAL THERMAL CONTRACTION FO...

EDGE CAPACITIVE COUPLING FOR QUANTUM CHIPS

DOWNSTOP AND BUMP BONDS FORMATION ON SUBSTRATES

MODULAR QUANTUM CHIP DESIGN WITH OVERLAPPING CONNECTION

ELECTRICAL CONNECTIONS BETWEEN DISSIMILAR MATERIALS AT CRYOGENIC TE...

COMBINED BACKING PLATE AND HOUSING FOR USE IN BUMP BONDED CHIP ASSE...

INTERPOSER CHIPS AND ENCLOSURES FOR QUANTUM CIRCUITS

MULTI-LAYERED PACKAGING FOR SUPERCONDUCTING QUANTUM CIRCUITS

CREATE A PROTECTED LAYER FOR INTERCONNECTS AND DEVICES IN A PACKAGE...

COMBINED BACKING PLATE AND HOUSING FOR USE IN BUMP BONDED CHIP ASSE...

SEMICONDUCTOR DEVICE INCLUDING SUPERCONDUCTING METAL THROUGH-SILICO...

MULTIPLE SIZED BUMP BONDS

MULTIPLE SIZED BUMP BONDS

TWO-COMPONENT BUMP METALLIZATION

BUMP BONDED CRYOGENIC CHIP CARRIER

BUMP BONDED CRYOGENIC CHIP CARRIER

TWO-COMPONENT BUMP METALLIZATION

SUPERCONDUCTING AIRBRIDGE CROSSOVER USING SUPERCONDUCTING SACRIFICI...

NON-DESTRUCTIVE TESTING OF INTEGRATED CIRCUIT CHIPS

NON-DESTRUCTIVE TESTING OF INTEGRATED CIRCUIT CHIPS

SEMICONDUCTOR DEVICE INCLUDING SUPERCONDUCTING METAL THROUGH-SILICO...

THROUGH-SUBSTRATE-VIAS WITH SELF-ALIGNED SOLDER BUMPS

THROUGH-SUBSTRATE-VIAS WITH SELF-ALIGNED SOLDER BUMPS

USE OF A REACTIVE, OR REDUCING GAS AS A METHOD TO INCREASE CONTACT...

THROUGH-SILICON VIA WITH INSULATOR FILL

THROUGH-SILICON VIA WITH INJECTION MOLDED FILL

MICROWAVE CONNECTORS FOR SEMICONDUCTOR WAFERS

SURFACE PREPARATION AND UNIFORM PLATING ON THROUGH WAFER VIAS AND I...

USE OF A REACTIVE, OR REDUCING GAS AS A METHOD TO INCREASE CONTACT...