John M. DeLucca

Person

Wayne, PA, US

People

Patents Grantslast 30 patents

Information Patent Grant
System and method for providing an electron blocking layer with dop...
- Patent number 10,014,439
- Issue date Jul 3, 2018
- Avago Technologies General IP (Singapore) Pte. Ltd.
- Joseph M. Freund
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for providing an electron blocking layer with dop...
- Patent number 9,425,050
- Issue date Aug 23, 2016
- Avago Technologies General IP (Singapore) Pte. Ltd.
- Joseph M. Freund
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Moisture barrier for a wire bond
- Patent number 9,136,245
- Issue date Sep 15, 2015
- Avago Technologies General IP (Singapore) Pte. Ltd.
- John M. DeLucca
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Moisture barrier for a wire bond
- Patent number 8,766,436
- Issue date Jul 1, 2014
- LSI Corporation
- John M. DeLucca
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced mobile device having multiple housing configurations
- Patent number 8,744,529
- Issue date Jun 3, 2014
- LSI Corporation
- Joseph M. Freund
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Allotropic or morphologic change in silicon induced by electromagne...
- Patent number 8,610,215
- Issue date Dec 17, 2013
- Agere Systems LLC
- Frank A. Baiocchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric etching
- Patent number 8,318,606
- Issue date Nov 27, 2012
- LSI Corporation
- Frank Baiocchi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Soldering method and related device for improved resistance to brit...
- Patent number 8,242,378
- Issue date Aug 14, 2012
- Agere Systems Inc.
- Ahmed Amin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Aluminum bond pads with enhanced wire bond stability
- Patent number 8,101,871
- Issue date Jan 24, 2012
- LSI Corporation
- Frank A. Baiocchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Material removing processes in device formation and the devices for...
- Patent number 7,972,873
- Issue date Jul 5, 2011
- Agere Systems Inc.
- Frank A. Baiocchi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of making electronic entities
- Patent number 7,724,359
- Issue date May 25, 2010
- Agere Systems Inc.
- Ahmed Nur Amin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Calibration standard for transmission electron microscopy
- Patent number 7,291,849
- Issue date Nov 6, 2007
- Agere Systems Inc.
- Frank A. Baiocchi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SYSTEM AND METHOD FOR PROVIDING AN ELECTRON BLOCKING LAYER WITH DOP...
- Publication number 20160329463
- Publication date Nov 10, 2016
- Avago Technologies General IP (Singapore) PTE. LTD.
- Joseph M. Freund
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR PROVIDING AN ELECTRON BLOCKING LAYER WITH DOP...
- Publication number 20150048310
- Publication date Feb 19, 2015
- LSI Corporation
- Joseph M. Freund
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOISTURE BARRIER FOR A WIRE BOND
- Publication number 20140349475
- Publication date Nov 27, 2014
- LSI Corporation
- John M. DeLucca
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED MOBILE DEVICE HAVING MULTIPLE HOUSING CONFIGURATIONS
- Publication number 20140057682
- Publication date Feb 27, 2014
- LSI Corporation
- Joseph M. Freund
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL DISC PLAYER WITH IMPROVED CONTENT PLAYBACK
- Publication number 20130094838
- Publication date Apr 18, 2013
- Joseph M. Freund
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SOLDERING METHOD AND RELATED DEVICE FOR IMPROVED RESISTANCE TO BRIT...
- Publication number 20120280023
- Publication date Nov 8, 2012
- LSI Corporation
- Ahmed Amin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MOISTURE BARRIER FOR A WIRE BOND
- Publication number 20120223432
- Publication date Sep 6, 2012
- LSI Corporation
- JOHN M. DELUCCA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALLOTROPIC CHANGES IN SI AND USE IN FABRICATING MATERIALS FOR SOLAR...
- Publication number 20120204941
- Publication date Aug 16, 2012
- James T. Cargo
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
ALUMINUM BOND PADS WITH ENHANCED WIRE BOND STABILITY
- Publication number 20120111927
- Publication date May 10, 2012
- LSI Corporation
- Frank A. Baiocchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODIFICATION OF LOGIC BY MORPHOLOGICAL MANIPULATION OF A SEMICONDUC...
- Publication number 20120033479
- Publication date Feb 9, 2012
- LSI Corporation
- John M. DeLucca
- G11 - INFORMATION STORAGE
Information Patent Application
MODIFICATION OF SEMICONDUCTOR OPTICAL PATHS BY MORPHOLOGICAL MANIPU...
- Publication number 20120033925
- Publication date Feb 9, 2012
- LSI Corporation
- John DeLucca
- G02 - OPTICS
Information Patent Application
ALLOTROPIC OR MORPHOLOGIC CHANGE IN SILICON INDUCED BY ELECTROMAGNE...
- Publication number 20110163419
- Publication date Jul 7, 2011
- Agere Systems Inc.
- Frank A. Baiocchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dielectric Etching
- Publication number 20110053378
- Publication date Mar 3, 2011
- LSI CORPORATION
- Frank Baiocchi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INHIBITION OF COPPER DISSOLUTION FOR LEAD-FREE SOLDERING
- Publication number 20100319967
- Publication date Dec 23, 2010
- Agere Systems Inc.
- Ahmed Amin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ALUMINUM BOND PADS WITH ENHANCED WIRE BOND STABILITY
- Publication number 20100300741
- Publication date Dec 2, 2010
- LSI Corporation
- Frank A. Baiocchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Soldering Method and Related Device for Improved Resistance to Brit...
- Publication number 20100243300
- Publication date Sep 30, 2010
- Ahmed Amin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Material removing processes in device formation and the devices for...
- Publication number 20100102398
- Publication date Apr 29, 2010
- Frank A. Baiocchi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method of making electronic entities
- Publication number 20090298286
- Publication date Dec 3, 2009
- Ahmed Nur Amin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of fabricating an electronic device
- Publication number 20090029490
- Publication date Jan 29, 2009
- Frank A. Baiocchi
- H01 - BASIC ELECTRIC ELEMENTS

John M. DeLucca

Person

Patents Grantslast 30 patents

System and method for providing an electron blocking layer with dop...

System and method for providing an electron blocking layer with dop...

Moisture barrier for a wire bond

Moisture barrier for a wire bond

Enhanced mobile device having multiple housing configurations

Allotropic or morphologic change in silicon induced by electromagne...

Dielectric etching

Soldering method and related device for improved resistance to brit...

Aluminum bond pads with enhanced wire bond stability

Material removing processes in device formation and the devices for...

Method of making electronic entities

Calibration standard for transmission electron microscopy

Patents Applicationslast 30 patents

SYSTEM AND METHOD FOR PROVIDING AN ELECTRON BLOCKING LAYER WITH DOP...

SYSTEM AND METHOD FOR PROVIDING AN ELECTRON BLOCKING LAYER WITH DOP...

MOISTURE BARRIER FOR A WIRE BOND

ENHANCED MOBILE DEVICE HAVING MULTIPLE HOUSING CONFIGURATIONS

OPTICAL DISC PLAYER WITH IMPROVED CONTENT PLAYBACK

SOLDERING METHOD AND RELATED DEVICE FOR IMPROVED RESISTANCE TO BRIT...

MOISTURE BARRIER FOR A WIRE BOND

ALLOTROPIC CHANGES IN SI AND USE IN FABRICATING MATERIALS FOR SOLAR...

ALUMINUM BOND PADS WITH ENHANCED WIRE BOND STABILITY

MODIFICATION OF LOGIC BY MORPHOLOGICAL MANIPULATION OF A SEMICONDUC...

MODIFICATION OF SEMICONDUCTOR OPTICAL PATHS BY MORPHOLOGICAL MANIPU...

ALLOTROPIC OR MORPHOLOGIC CHANGE IN SILICON INDUCED BY ELECTROMAGNE...

Dielectric Etching

INHIBITION OF COPPER DISSOLUTION FOR LEAD-FREE SOLDERING

ALUMINUM BOND PADS WITH ENHANCED WIRE BOND STABILITY

Soldering Method and Related Device for Improved Resistance to Brit...

Material removing processes in device formation and the devices for...

Method of making electronic entities

Method of fabricating an electronic device