John Mark Meldrim

Person

Boise, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Microelectronic devices with a polysilicon structure above a stairc...
- Patent number 12,218,081
- Issue date Feb 4, 2025
- Lodestar Licensing Group LLC
- Jivaan Kishore Jhothiraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memories having vertically stacked conductive filled structures
- Patent number 12,114,492
- Issue date Oct 8, 2024
- Micron Technology, Inc.
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assemblies which include wordlines having a first metal-containing...
- Patent number 12,034,057
- Issue date Jul 9, 2024
- Micron Technology, Inc.
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assemblies having conductive structures with three or more differen...
- Patent number 11,990,528
- Issue date May 21, 2024
- David Ross Economy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive interconnects suitable for utilization in integrated ass...
- Patent number 11,818,968
- Issue date Nov 14, 2023
- Micron Technology, Inc.
- Jordan D. Greenlee
- G11 - INFORMATION STORAGE
Information Patent Grant
Microelectronic devices with a polysilicon structure adjacent a sta...
- Patent number 11,710,710
- Issue date Jul 25, 2023
- Jivaan Kishore Jhothiraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assemblies having conductive structures with three or more differen...
- Patent number 11,705,500
- Issue date Jul 18, 2023
- Micron Technology, Inc.
- David Ross Economy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming tungsten structures
- Patent number 11,646,206
- Issue date May 9, 2023
- Micron Technology, Inc.
- David Ross Economy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods used in forming integrated circuitry comprising a stack com...
- Patent number 11,647,633
- Issue date May 9, 2023
- Micron Technology, Inc.
- Jivaan Kishore Jhothiraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive structures, assemblies having vertically-stacked memory...
- Patent number 11,177,276
- Issue date Nov 16, 2021
- Micron Technology, Inc.
- Nancy M. Lomeli
- G11 - INFORMATION STORAGE
Information Patent Grant
Assemblies which include wordlines having a first metal-containing...
- Patent number 11,158,718
- Issue date Oct 26, 2021
- Micron Technology, Inc.
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive interconnects suitable for utilization in integrated ass...
- Patent number 11,127,899
- Issue date Sep 21, 2021
- Micron Technology, Inc.
- Jordan D. Greenlee
- G11 - INFORMATION STORAGE
Information Patent Grant
Microelectronic devices with polysilicon fill material between oppo...
- Patent number 11,088,088
- Issue date Aug 10, 2021
- Micron Technology, Inc.
- Jivaan Kishore Jhothiraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatuses including electrodes having a conductive barrier materi...
- Patent number 11,081,644
- Issue date Aug 3, 2021
- Micron Technology, Inc.
- Swapnil A. Lengade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods used in forming an array of elevationally-extending transis...
- Patent number 11,031,417
- Issue date Jun 8, 2021
- Micron Technology, Inc.
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ohmic contacts for semiconductor structures
- Patent number 10,998,481
- Issue date May 4, 2021
- Micron Technology, Inc.
- Yongjun Jeff Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assemblies having conductive structures with three or more differen...
- Patent number 10,957,775
- Issue date Mar 23, 2021
- Micron Technology, Inc.
- David Ross Economy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatuses including electrodes having a conductive barrier materi...
- Patent number 10,957,855
- Issue date Mar 23, 2021
- Micron Technology, Inc.
- Swapnil A. Lengade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatuses including electrodes having a conductive barrier materi...
- Patent number 10,950,791
- Issue date Mar 16, 2021
- Micron Technology, Inc.
- Swapnil A. Lengade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of fabricating integrated structures
- Patent number 10,943,920
- Issue date Mar 9, 2021
- Micron Technology, Inc.
- John M. Meldrim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming integrated assemblies
- Patent number 10,943,921
- Issue date Mar 9, 2021
- Micron Technology, Inc.
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assemblies having vertically-extending structures, and methods of f...
- Patent number 10,916,564
- Issue date Feb 9, 2021
- Micron Technology, Inc.
- David Ross Economy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming tungsten structures
- Patent number 10,847,367
- Issue date Nov 24, 2020
- Micron Technology, Inc.
- David R. Economy
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods of filling openings with conductive material, and assemblie...
- Patent number 10,840,255
- Issue date Nov 17, 2020
- Micron Technology, Inc.
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate stacks
- Patent number 10,777,651
- Issue date Sep 15, 2020
- Micron Technology, Inc.
- Yushi Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Source material for electronic device applications
- Patent number 10,731,273
- Issue date Aug 4, 2020
- Micron Technology, Inc.
- John Mark Meldrim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods used in forming an array of elevationally-extending transis...
- Patent number 10,727,250
- Issue date Jul 28, 2020
- Micron Technology, Inc.
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assemblies having vertically-extending structures, and methods of f...
- Patent number 10,700,091
- Issue date Jun 30, 2020
- Micron Technology, Inc.
- David Ross Economy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatuses including electrodes having a conductive barrier materi...
- Patent number 10,651,381
- Issue date May 12, 2020
- Micron Technology, Inc.
- Swapnil A. Lengade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of filling horizontally-extending openings of integrated as...
- Patent number 10,573,661
- Issue date Feb 25, 2020
- Micron Technology, Inc.
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
OHMIC CONTACTS FOR SEMICONDUCTOR STRUCTURES
- Publication number 20250015245
- Publication date Jan 9, 2025
- Micron Technology, Inc.
- Yongjun Jeff Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Filling Openings with Conductive Material, and Assemblie...
- Publication number 20240407160
- Publication date Dec 5, 2024
- Micron Technology, Inc.
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED MICROELECTR...
- Publication number 20240071919
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Mohad Baboli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES INCLUDING STACK STRUCTURES HAVING DOPED INT...
- Publication number 20230387229
- Publication date Nov 30, 2023
- Everett A. McTeer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES WITH A POLYSILICON STRUCTURE ABOVE A STAIRC...
- Publication number 20230361053
- Publication date Nov 9, 2023
- Lodestar Licensing Group, LLC
- Jivaan Kishore Jhothiraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuitry, Memory Arrays Comprising Strings Of Memory Ce...
- Publication number 20230255030
- Publication date Aug 10, 2023
- Micron Technology, Inc.
- Jivaan Kishore Jhothiraman
Information Patent Application
Memory Arrays Comprising Strings Of Memory Cells And Methods Used I...
- Publication number 20230164985
- Publication date May 25, 2023
- Micron Technology, Inc.
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Assemblies Having Conductive Structures with Three or More Differen...
- Publication number 20230121315
- Publication date Apr 20, 2023
- Micron Technology, Inc.
- David Ross Economy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive Structures, Assemblies Having Vertically-Stacked Memory...
- Publication number 20220037358
- Publication date Feb 3, 2022
- Micron Technology, Inc.
- Nancy M. Lomeli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Assemblies Which Include Wordlines Having a First Metal-Containing...
- Publication number 20220028996
- Publication date Jan 27, 2022
- Micron Technology, Inc.
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuitry, Memory Arrays Comprising Strings Of Memory Ce...
- Publication number 20220013530
- Publication date Jan 13, 2022
- Micron Technology, Inc.
- Jivaan Kishore Jhothiraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive Interconnects Suitable for Utilization in Integrated Ass...
- Publication number 20210384422
- Publication date Dec 9, 2021
- Micron Technology, Inc.
- Jordan D. Greenlee
- G11 - INFORMATION STORAGE
Information Patent Application
MICROELECTRONIC DEVICES WITH A POLYSILICON STRUCTURE ADJACENT A STA...
- Publication number 20210358868
- Publication date Nov 18, 2021
- Micron Technology, Inc.
- Jivaan Kishore Jhothiraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OHMIC CONTACTS FOR SEMICONDUCTOR STRUCTURES
- Publication number 20210257526
- Publication date Aug 19, 2021
- Micron Technology, Inc.
- Yongjun Jeff Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Assemblies Having Conductive Structures with Three or More Differen...
- Publication number 20210202710
- Publication date Jul 1, 2021
- Micron Technology, Inc.
- David Ross Economy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING TUNGSTEN STRUCTURES
- Publication number 20210183651
- Publication date Jun 17, 2021
- Micron Technology, Inc.
- David Ross Economy
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MICROELECTRONIC DEVICES WITH POLYSILICON FILL MATERIAL BETWEEN OPPO...
- Publication number 20210134736
- Publication date May 6, 2021
- Micron Technology, Inc.
- Jivaan Kishore Jhothiraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies Having Barrier Material Between Silicon-Conta...
- Publication number 20210091009
- Publication date Mar 25, 2021
- Micron Technology, Inc.
- Devesh Kumar Datta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Filling Openings with Conductive Material, and Assemblie...
- Publication number 20210066332
- Publication date Mar 4, 2021
- Micron Technology, Inc.
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Assemblies Having Conductive Structures with Three or More Differen...
- Publication number 20210005732
- Publication date Jan 7, 2021
- Micron Technology, Inc.
- David Ross Economy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Assemblies Which Include Wordlines Having a First Metal-Containing...
- Publication number 20200328284
- Publication date Oct 15, 2020
- Micron Technology, Inc.
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive Interconnects Suitable for Utilization in Integrated Ass...
- Publication number 20200328348
- Publication date Oct 15, 2020
- Micron Technology, Inc.
- Jordan D. Greenlee
- G11 - INFORMATION STORAGE
Information Patent Application
Methods Used In Forming An Array Of Elevationally-Extending Transis...
- Publication number 20200312880
- Publication date Oct 1, 2020
- Micron Technology, Inc.
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Assemblies Having Vertically-Extending Structures, and Methods of F...
- Publication number 20200266210
- Publication date Aug 20, 2020
- Micron Technology, Inc.
- David Ross Economy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING TUNGSTEN STRUCTURES
- Publication number 20200211843
- Publication date Jul 2, 2020
- Micron Technology, Inc.
- David Ross Economy
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Methods of Forming Integrated Assemblies
- Publication number 20200161332
- Publication date May 21, 2020
- Micron Technology, Inc.
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Fabricating Integrated Structures
- Publication number 20200152658
- Publication date May 14, 2020
- Micron Technology, Inc.
- John M. Meldrim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Filling Openings with Conductive Material, and Assemblie...
- Publication number 20200152651
- Publication date May 14, 2020
- Micron Technology, Inc.
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive Structures, Assemblies Having Vertically-Stacked Memory...
- Publication number 20200075620
- Publication date Mar 5, 2020
- Micron Technology, Inc.
- Nancy M. Lomeli
- G11 - INFORMATION STORAGE
Information Patent Application
OHMIC CONTACTS FOR SEMICONDUCTOR STRUCTURES
- Publication number 20200035891
- Publication date Jan 30, 2020
- Micron Technology, Inc.
- Yongjun Jeff Hu
- H01 - BASIC ELECTRIC ELEMENTS

John Mark Meldrim

Person

Patents Grantslast 30 patents

Microelectronic devices with a polysilicon structure above a stairc...

Memories having vertically stacked conductive filled structures

Assemblies which include wordlines having a first metal-containing...

Assemblies having conductive structures with three or more differen...

Conductive interconnects suitable for utilization in integrated ass...

Microelectronic devices with a polysilicon structure adjacent a sta...

Assemblies having conductive structures with three or more differen...

Methods of forming tungsten structures

Methods used in forming integrated circuitry comprising a stack com...

Conductive structures, assemblies having vertically-stacked memory...

Assemblies which include wordlines having a first metal-containing...

Conductive interconnects suitable for utilization in integrated ass...

Microelectronic devices with polysilicon fill material between oppo...

Apparatuses including electrodes having a conductive barrier materi...

Methods used in forming an array of elevationally-extending transis...

Ohmic contacts for semiconductor structures

Assemblies having conductive structures with three or more differen...

Apparatuses including electrodes having a conductive barrier materi...

Apparatuses including electrodes having a conductive barrier materi...

Methods of fabricating integrated structures

Methods of forming integrated assemblies

Assemblies having vertically-extending structures, and methods of f...

Methods of forming tungsten structures

Methods of filling openings with conductive material, and assemblie...

Gate stacks

Source material for electronic device applications

Methods used in forming an array of elevationally-extending transis...

Assemblies having vertically-extending structures, and methods of f...

Apparatuses including electrodes having a conductive barrier materi...

Methods of filling horizontally-extending openings of integrated as...

Patents Applicationslast 30 patents

OHMIC CONTACTS FOR SEMICONDUCTOR STRUCTURES

Methods of Filling Openings with Conductive Material, and Assemblie...

METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED MICROELECTR...

MICROELECTRONIC DEVICES INCLUDING STACK STRUCTURES HAVING DOPED INT...

MICROELECTRONIC DEVICES WITH A POLYSILICON STRUCTURE ABOVE A STAIRC...

Integrated Circuitry, Memory Arrays Comprising Strings Of Memory Ce...

Memory Arrays Comprising Strings Of Memory Cells And Methods Used I...

Assemblies Having Conductive Structures with Three or More Differen...

Conductive Structures, Assemblies Having Vertically-Stacked Memory...

Assemblies Which Include Wordlines Having a First Metal-Containing...

Integrated Circuitry, Memory Arrays Comprising Strings Of Memory Ce...

Conductive Interconnects Suitable for Utilization in Integrated Ass...

MICROELECTRONIC DEVICES WITH A POLYSILICON STRUCTURE ADJACENT A STA...

OHMIC CONTACTS FOR SEMICONDUCTOR STRUCTURES

Assemblies Having Conductive Structures with Three or More Differen...

METHODS OF FORMING TUNGSTEN STRUCTURES

MICROELECTRONIC DEVICES WITH POLYSILICON FILL MATERIAL BETWEEN OPPO...

Integrated Assemblies Having Barrier Material Between Silicon-Conta...

Methods of Filling Openings with Conductive Material, and Assemblie...

Assemblies Having Conductive Structures with Three or More Differen...

Assemblies Which Include Wordlines Having a First Metal-Containing...

Conductive Interconnects Suitable for Utilization in Integrated Ass...

Methods Used In Forming An Array Of Elevationally-Extending Transis...

Assemblies Having Vertically-Extending Structures, and Methods of F...

METHODS OF FORMING TUNGSTEN STRUCTURES

Methods of Forming Integrated Assemblies

Methods of Fabricating Integrated Structures

Methods of Filling Openings with Conductive Material, and Assemblie...

Conductive Structures, Assemblies Having Vertically-Stacked Memory...

OHMIC CONTACTS FOR SEMICONDUCTOR STRUCTURES