John McCoy

Person

San Carlos, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor wafer alignment using backside illumination
- Patent number 6,376,329
- Issue date Apr 23, 2002
- Nikon Corporation
- Michael R. Sogard
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Proximity effect correction method through uniform removal of fract...
- Patent number 6,316,164
- Issue date Nov 13, 2001
- N. William Parker
- B82 - NANO-TECHNOLOGY
Information Patent Grant
High throughput electron beam lithography system
- Patent number 6,014,200
- Issue date Jan 11, 2000
- Nikon Corporation
- Michael R. Sogard
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Thin film detection method and apparatus
- Patent number 5,936,254
- Issue date Aug 10, 1999
- Nikon Research Corporation of America
- Arun A. Aiyer
- G01 - MEASURING TESTING
Information Patent Grant
Direct reticle to wafer alignment using fluorescence for integrated...
- Patent number 5,838,450
- Issue date Nov 17, 1998
- Nikon Precision Inc.
- John H. McCoy
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Wafer inspection method and apparatus using diffracted light
- Patent number 5,777,729
- Issue date Jul 7, 1998
- Nikon Corporation
- Arun A. Aiyer
- G01 - MEASURING TESTING
Information Patent Grant
Atomic force microscope measurement process for dense photoresist p...
- Patent number 5,741,614
- Issue date Apr 21, 1998
- Nikon Corporation
- John H. McCoy
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Alignment system with large area search for wafer edge and global m...
- Patent number 5,648,854
- Issue date Jul 15, 1997
- Nikon Corporation
- John H. McCoy
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Multiple reticle stitching for scanning exposure system
- Patent number 5,437,946
- Issue date Aug 1, 1995
- Nikon Precision Inc.
- John H. McCoy
- G02 - OPTICS

Person

Patents Grantslast 30 patents

Semiconductor wafer alignment using backside illumination

Proximity effect correction method through uniform removal of fract...

High throughput electron beam lithography system

Thin film detection method and apparatus

Direct reticle to wafer alignment using fluorescence for integrated...

Wafer inspection method and apparatus using diffracted light

Atomic force microscope measurement process for dense photoresist p...

Alignment system with large area search for wafer edge and global m...

Multiple reticle stitching for scanning exposure system