John R. Slack

Follow

Person

Vestal, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Free standing, three dimensional, multi-chip, carrier package with...
- Patent number 6,256,203
- Issue date Jul 3, 2001
- International Business Machines Corporation
- Anthony P. Ingraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated, multi-chip, thermally conductive packaging device and m...
- Patent number 6,075,287
- Issue date Jun 13, 2000
- International Business Machines Corporation
- Anthony P. Ingraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Free standing, three dimensional, multi-chip, carrier package with...
- Patent number 6,061,245
- Issue date May 9, 2000
- International Business Machines Corporation
- Anthony P. Ingraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package with heat transfer means
- Patent number 6,037,658
- Issue date Mar 14, 2000
- International Business Machines Corporation
- William Louis Brodsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertically integrated multi-chip circuit package with heat-sink sup...
- Patent number 5,926,369
- Issue date Jul 20, 1999
- International Business Machines Corporation
- Anthony P. Ingraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly for mounting components to flexible cables
- Patent number 5,669,775
- Issue date Sep 23, 1997
- International Business Machines Corporation
- Jeffrey Scott Campbell
- H01 - BASIC ELECTRIC ELEMENTS