John Tellkamp

Person

Rockwall, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Inverted leads for packaged isolation devices
- Patent number 12,336,231
- Issue date Jun 17, 2025
- Texas Instruments Incorporated
- John Paul Tellkamp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Edge bend for isolation packages
- Patent number 12,293,953
- Issue date May 6, 2025
- Texas Instruments Incorporated
- John Paul Tellkamp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inverted leads for packaged isolation devices
- Patent number 11,658,243
- Issue date May 23, 2023
- Texas Instruments Incorporated
- John Paul Tellkamp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-function bond pad
- Patent number 11,574,884
- Issue date Feb 7, 2023
- Texas Instruments Incorporated
- Suvadip Banerjee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframes with folded conductor portion and devices therefrom
- Patent number 11,569,153
- Issue date Jan 31, 2023
- Texas Instruments Incorporated
- Enis Tuncer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hall-effect sensor package with added current path
- Patent number 11,557,722
- Issue date Jan 17, 2023
- Texas Instruments Incorporated
- Ming Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hall-effect sensor package with added current path
- Patent number 10,892,405
- Issue date Jan 12, 2021
- Texas Instruments Incorporated
- Ming Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inverted leads for packaged isolation devices
- Patent number 10,439,065
- Issue date Oct 8, 2019
- Texas Instruments Incorporated
- John Paul Tellkamp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Testing of integrated circuits with external clearance requirements
- Patent number 9,239,353
- Issue date Jan 19, 2016
- Texas Instruments Incorporated
- John Paul Tellkamp
- G01 - MEASURING TESTING
Information Patent Grant
Grown carbon nanotube die attach structures, articles, devices, and...
- Patent number 8,753,924
- Issue date Jun 17, 2014
- Texas Instruments Incorporated
- James Cooper Wainerdi
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Interleaf for leadframe identification
- Patent number 8,377,747
- Issue date Feb 19, 2013
- Texas Instruments Incorporated
- John Paul Tellkamp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged electronic device having metal comprising self-healing die...
- Patent number 8,378,506
- Issue date Feb 19, 2013
- Texas Instruments Incorporated
- James C Wainerdi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having grooved leads to confine solder wicking
- Patent number 8,129,227
- Issue date Mar 6, 2012
- Texas Instruments Incorporated
- John P Tellkamp
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaged electronic device having metal comprising self-healing die...
- Patent number 7,972,905
- Issue date Jul 5, 2011
- Texas Instruments Incorporated
- James C. Wainerdi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having grooved leads to confine solder wicking
- Patent number 7,821,111
- Issue date Oct 26, 2010
- Texas Instruments Incorporated
- John Tellkamp
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Composite metal column for mounting semiconductor device
- Patent number 7,550,852
- Issue date Jun 23, 2009
- Texas Instruments Incorporated
- John P Tellkamp
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Leadframes for improved moisture reliability and enhanced solderabi...
- Patent number 7,413,934
- Issue date Aug 19, 2008
- Texas Instruments Incorporated
- John P. Tellkamp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframes for improved moisture reliability and enhanced solderabi...
- Patent number 7,256,481
- Issue date Aug 14, 2007
- Texas Instruments Incorporated
- John P. Tellkamp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for evaluating and modifying solder attach design for integr...
- Patent number 7,256,117
- Issue date Aug 14, 2007
- Texas Instruments Incorporated
- John Paul Tellkamp
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for evaluating and modifying solder attach design for integr...
- Patent number 7,166,481
- Issue date Jan 23, 2007
- Texas Instruments Incorporated
- John Paul Tellkamp
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Composite metal column for mounting semiconductor device
- Patent number 7,125,789
- Issue date Oct 24, 2006
- Texas Instruments Incorporated
- John P. Tellkamp
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metallic strain-absorbing layer for improved fatigue resistance of...
- Patent number 7,095,121
- Issue date Aug 22, 2006
- Texas Instrument Incorporated
- John P. Tellkamp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anti-corrosion overcoat cover tape
- Patent number 7,044,304
- Issue date May 16, 2006
- Texas Instruments Incorporated
- John P. Tellkamp
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metallic strain-absorbing layer for improved fatigue resistance of...
- Patent number 7,012,018
- Issue date Mar 14, 2006
- Texas Instruments Incorporated
- John P. Tellkamp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal testing method for integrated circuit chips and packages
- Patent number 6,946,856
- Issue date Sep 20, 2005
- Texas Instruments Incorporated
- John Paul Tellkamp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aluminum leadframes for semiconductor devices and method of fabrica...
- Patent number 6,933,177
- Issue date Aug 23, 2005
- Texas Instruments Incorporated
- John P. Tellkamp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aluminum leadframes with two nickel layers
- Patent number 6,747,343
- Issue date Jun 8, 2004
- Texas Instruments Incorporated
- John P. Tellkamp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sacrificial anode for corrosion protection of semiconductor metalli...
- Patent number 6,692,633
- Issue date Feb 17, 2004
- Texas Instruments Incorporated
- John P. Tellkamp
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Plated aluminum leadframes for semiconductor devices, including two...
- Patent number 6,518,647
- Issue date Feb 11, 2003
- Texas Instruments Incorporated
- John P. Tellkamp
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INVERTED LEADS FOR PACKAGED ISOLATION DEVICES
- Publication number 20230299201
- Publication date Sep 21, 2023
- TEXAS INSTRUMENTS INCORPORATED
- JOHN PAUL TELLKAMP
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-FUNCTION BOND PAD
- Publication number 20220246566
- Publication date Aug 4, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Suvadip Banerjee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA CLEANING FOR PACKAGING ELECTRONIC DEVICES
- Publication number 20210305024
- Publication date Sep 30, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Enis Tuncer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAMES WITH FOLDED CONDUCTOR PORTION AND DEVICES THEREFROM
- Publication number 20210287970
- Publication date Sep 16, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Enis Tuncer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HALL-EFFECT SENSOR PACKAGE WITH ADDED CURRENT PATH
- Publication number 20210159403
- Publication date May 27, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Ming Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HALL-EFFECT SENSOR PACKAGE WITH ADDED CURRENT PATH
- Publication number 20200357987
- Publication date Nov 12, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Ming Li
- G01 - MEASURING TESTING
Information Patent Application
Edge Bend for Isolation Packages
- Publication number 20200118899
- Publication date Apr 16, 2020
- TEXAS INSTRUMENTS INCORPORATED
- John Paul Tellkamp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INVERTED LEADS FOR PACKAGED ISOLATION DEVICES
- Publication number 20200006562
- Publication date Jan 2, 2020
- TEXAS INSTRUMENTS INCORPORATED
- JOHN PAUL TELLKAMP
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INVERTED LEADS FOR PACKAGED ISOLATION DEVICES
- Publication number 20190109233
- Publication date Apr 11, 2019
- TEXAS INSTRUMENTS INCORPORATED
- JOHN PAUL TELLKAMP
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Edge Bend for Isolation Packages
- Publication number 20190109061
- Publication date Apr 11, 2019
- TEXAS INSTRUMENTS INCORPORATED
- John Paul Tellkamp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TESTING OF INTEGRATED CIRCUITS WITH EXTERNAL CLEARANCE REQUIREMENTS
- Publication number 20140375350
- Publication date Dec 25, 2014
- John Paul Tellkamp
- G01 - MEASURING TESTING
Information Patent Application
Lead Frame Strip with Half (1/2) Thickness Pull Out Tab
- Publication number 20140131086
- Publication date May 15, 2014
- John Paul Tellkamp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GROWN CARBON NANOTUBE DIE ATTACH STRUCTURES, ARTICLES, DEVICES, AND...
- Publication number 20130234313
- Publication date Sep 12, 2013
- TEXAS INSTRUMENTS INCORPORATED
- James Cooper Wainerdi
- B82 - NANO-TECHNOLOGY
Information Patent Application
Interleaf for Leadframe Identification
- Publication number 20130130411
- Publication date May 23, 2013
- TEXAS INSTRUMENTS INCORPORATED
- John Paul Tellkamp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME STRIP WITH IMPROVED PACKAGE SEPARABILITY
- Publication number 20130056261
- Publication date Mar 7, 2013
- TEXAS INSTRUMENTS INCORPORATED
- John Paul Tellkamp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Attachment Layer Having Traverse-Aligned Conductive Filler Par...
- Publication number 20120107552
- Publication date May 3, 2012
- TEXAS INSTRUMENTS INCORPORATED
- John P. TELLKAMP
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
INTERLEAF FOR LEADFRAME IDENTIFICATION
- Publication number 20110263051
- Publication date Oct 27, 2011
- TEXAS INSTRUMENTS INCORPORATED
- John Paul Tellkamp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged Electronic Device Having Metal Comprising Self-Healing Die...
- Publication number 20110227233
- Publication date Sep 22, 2011
- TEXAS INSTRUMENTS INCORPORATED
- JAMES C. WAINERDI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Having Grooved Leads to Confine Solder Wicking
- Publication number 20110008936
- Publication date Jan 13, 2011
- TEXAS INSTRUMENTS INCORPORATED
- John Tellkamp
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
PACKAGED ELECTRONIC DEVICE HAVING METAL COMPRISING SELF-HEALING...
- Publication number 20100264553
- Publication date Oct 21, 2010
- TEXAS INSTRUMENTS INCORPORATED
- JAMES C. WAINERDI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Having Grooved Leads to Confine Solder Wicking
- Publication number 20090091007
- Publication date Apr 9, 2009
- TEXAS INSTRUMENTS INCORPORATED
- John Tellkamp
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SEMICONDUCTOR LEADFRAME FOR UNIFORM MOLD COMPOUND FLOW
- Publication number 20080067646
- Publication date Mar 20, 2008
- TEXAS INSTRUMENTS INCORPORATED
- John Paul Tellkamp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leadframes for Improved Moisture Reliability and Enhanced Solderabi...
- Publication number 20080014757
- Publication date Jan 17, 2008
- TEXAS INSTRUMENTS INCORPORATED
- John P. Tellkamp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leadframes for improved moisture reliability and enhanced solderabi...
- Publication number 20070120233
- Publication date May 31, 2007
- John P. Tellkamp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Evaluating and Modifying Solder Attach Design for Integr...
- Publication number 20070092999
- Publication date Apr 26, 2007
- TEXAS INSTRUMENTS INCORPORATED
- John Paul Tellkamp
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Composite metal column for mounting semiconductor device
- Publication number 20070018304
- Publication date Jan 25, 2007
- TEXAS INSTRUMENTS INCORPORATED
- John P. Tellkamp
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for the thermal testing of a thermal path to an integrated c...
- Publication number 20060156080
- Publication date Jul 13, 2006
- TEXAS INSTRUMENTS INCORPORATED
- John P. Tellkamp
- G01 - MEASURING TESTING
Information Patent Application
Method for evaluating and modifying solder attach design for integr...
- Publication number 20060019418
- Publication date Jan 26, 2006
- John Paul Tellkamp
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Aluminum leadframes for semiconductor devices and method of fabrica...
- Publication number 20040188810
- Publication date Sep 30, 2004
- John P. Tellkamp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metallic strain-absorbing layer for improved fatigue resistance of...
- Publication number 20040164421
- Publication date Aug 26, 2004
- John P. Tellkamp
- H01 - BASIC ELECTRIC ELEMENTS

John Tellkamp

Person

Patents Grantslast 30 patents

Inverted leads for packaged isolation devices

Edge bend for isolation packages

Inverted leads for packaged isolation devices

Multi-function bond pad

Leadframes with folded conductor portion and devices therefrom

Hall-effect sensor package with added current path

Hall-effect sensor package with added current path

Inverted leads for packaged isolation devices

Testing of integrated circuits with external clearance requirements

Grown carbon nanotube die attach structures, articles, devices, and...

Interleaf for leadframe identification

Packaged electronic device having metal comprising self-healing die...

Semiconductor device having grooved leads to confine solder wicking

Packaged electronic device having metal comprising self-healing die...

Semiconductor device having grooved leads to confine solder wicking

Composite metal column for mounting semiconductor device

Leadframes for improved moisture reliability and enhanced solderabi...

Leadframes for improved moisture reliability and enhanced solderabi...

Method for evaluating and modifying solder attach design for integr...

Method for evaluating and modifying solder attach design for integr...

Composite metal column for mounting semiconductor device

Metallic strain-absorbing layer for improved fatigue resistance of...

Anti-corrosion overcoat cover tape

Metallic strain-absorbing layer for improved fatigue resistance of...

Thermal testing method for integrated circuit chips and packages

Aluminum leadframes for semiconductor devices and method of fabrica...

Aluminum leadframes with two nickel layers

Sacrificial anode for corrosion protection of semiconductor metalli...

Plated aluminum leadframes for semiconductor devices, including two...

Patents Applicationslast 30 patents

INVERTED LEADS FOR PACKAGED ISOLATION DEVICES

MULTI-FUNCTION BOND PAD

PLASMA CLEANING FOR PACKAGING ELECTRONIC DEVICES

LEADFRAMES WITH FOLDED CONDUCTOR PORTION AND DEVICES THEREFROM

HALL-EFFECT SENSOR PACKAGE WITH ADDED CURRENT PATH

HALL-EFFECT SENSOR PACKAGE WITH ADDED CURRENT PATH

Edge Bend for Isolation Packages

INVERTED LEADS FOR PACKAGED ISOLATION DEVICES

INVERTED LEADS FOR PACKAGED ISOLATION DEVICES

Edge Bend for Isolation Packages

TESTING OF INTEGRATED CIRCUITS WITH EXTERNAL CLEARANCE REQUIREMENTS

Lead Frame Strip with Half (1/2) Thickness Pull Out Tab

GROWN CARBON NANOTUBE DIE ATTACH STRUCTURES, ARTICLES, DEVICES, AND...

Interleaf for Leadframe Identification

LEAD FRAME STRIP WITH IMPROVED PACKAGE SEPARABILITY

Chip Attachment Layer Having Traverse-Aligned Conductive Filler Par...

INTERLEAF FOR LEADFRAME IDENTIFICATION

Packaged Electronic Device Having Metal Comprising Self-Healing Die...

Semiconductor Device Having Grooved Leads to Confine Solder Wicking

PACKAGED ELECTRONIC DEVICE HAVING METAL COMPRISING SELF-HEALING...

Semiconductor Device Having Grooved Leads to Confine Solder Wicking

SEMICONDUCTOR LEADFRAME FOR UNIFORM MOLD COMPOUND FLOW

Leadframes for Improved Moisture Reliability and Enhanced Solderabi...

Leadframes for improved moisture reliability and enhanced solderabi...

Method for Evaluating and Modifying Solder Attach Design for Integr...

Composite metal column for mounting semiconductor device

Method for the thermal testing of a thermal path to an integrated c...

Method for evaluating and modifying solder attach design for integr...

Aluminum leadframes for semiconductor devices and method of fabrica...

Metallic strain-absorbing layer for improved fatigue resistance of...