John U. Knickerbocker

Person

Monroe, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic substrate stacking
- Patent number 12,170,252
- Issue date Dec 17, 2024
- International Business Machines Corporation
- Lei Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-sensor platform for health monitoring
- Patent number 12,014,816
- Issue date Jun 18, 2024
- International Business Machines Corporation
- John Knickerbocker
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
High density interconnection and wiring layers, package structures,...
- Patent number 12,015,003
- Issue date Jun 18, 2024
- International Business Machines Corporation
- John Knickerbocker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple die assembly
- Patent number 11,973,058
- Issue date Apr 30, 2024
- International Business Machines Corporation
- Katsuyuki Sakuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon handler with laser-release layers
- Patent number 11,908,723
- Issue date Feb 20, 2024
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wearable multiplatform sensor
- Patent number 11,903,734
- Issue date Feb 20, 2024
- International Business Machines Corporation
- Rajeev Narayanan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Thin film battery stacking
- Patent number 11,876,233
- Issue date Jan 16, 2024
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon interposer sandwich structure for ESD, EMC, and EMC shieldi...
- Patent number 11,810,893
- Issue date Nov 7, 2023
- International Business Machines Corporation
- William Emmett Bernier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molten solder injection head with vacuum filter and differential ga...
- Patent number 11,766,729
- Issue date Sep 26, 2023
- International Business Machines Corporation
- Jae-Woong Nah
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Precision thin electronics handling integration
- Patent number 11,710,669
- Issue date Jul 25, 2023
- International Business Machines Corporation
- John Knickerbocker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming thin die stack assemblies
- Patent number 11,587,860
- Issue date Feb 21, 2023
- International Business Machines Corporation
- John Knickerbocker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermoplastic temporary adhesive for silicon handler with infra-red...
- Patent number 11,574,835
- Issue date Feb 7, 2023
- International Business Machines Corporation
- Bing Dang
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Miniaturized electronics package with patterned thin film solid sta...
- Patent number 11,539,081
- Issue date Dec 27, 2022
- International Business Machines Corporation
- Qianwen Chen
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Ultra-thin microbattery packaging and handling
- Patent number 11,539,088
- Issue date Dec 27, 2022
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Miniaturized electronics package with patterned thin film solid sta...
- Patent number 11,539,080
- Issue date Dec 27, 2022
- International Business Machines Corporation
- Qianwen Chen
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Hermetic packaging of a micro-battery device
- Patent number 11,522,243
- Issue date Dec 6, 2022
- International Business Machines Corporation
- Qianwen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Handler bonding and debonding for semiconductor dies
- Patent number 11,424,152
- Issue date Aug 23, 2022
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Simplified hermetic packaging of a micro-battery
- Patent number 11,411,272
- Issue date Aug 9, 2022
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Simplified hermetic packaging of a micro-battery
- Patent number 11,362,382
- Issue date Jun 14, 2022
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IR assisted fan-out wafer level packaging using silicon handler
- Patent number 11,348,833
- Issue date May 31, 2022
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High bandwidth multichip module
- Patent number 11,315,902
- Issue date Apr 26, 2022
- International Business Machines Corporation
- John Knickerbocker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Accurate colorimetric based test strip reader system
- Patent number 11,307,147
- Issue date Apr 19, 2022
- International Business Machines Corporation
- Minhua Lu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Strain gauge structure for a sensor
- Patent number 11,268,867
- Issue date Mar 8, 2022
- International Business Machines Corporation
- John U. Knickerbocker
- G01 - MEASURING TESTING
Information Patent Grant
High speed handling of ultra-small chips by selective laser bonding...
- Patent number 11,222,862
- Issue date Jan 11, 2022
- International Business Machines Corporation
- Qianwen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level integration including design/co-design, structure proce...
- Patent number 11,201,138
- Issue date Dec 14, 2021
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film solid-state microbattery packaging
- Patent number 11,171,374
- Issue date Nov 9, 2021
- International Business Machines Corporation
- Qianwen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Saccade and vergence tracking for distance auto focus adjustment
- Patent number 11,169,399
- Issue date Nov 9, 2021
- International Business Machines Corporation
- Emily R. Kinser
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Handler bonding and debonding for semiconductor dies
- Patent number 11,121,005
- Issue date Sep 14, 2021
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film battery packaging
- Patent number 11,101,513
- Issue date Aug 24, 2021
- International Business Machines Corporation
- Qianwen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronics miniaturization platform for medication verification an...
- Patent number 11,094,407
- Issue date Aug 17, 2021
- International Business Machines Corporation
- John Knickerbocker
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE

Patents Applicationslast 30 patents

Information Patent Application
CO-PACKAGE OPTICS ASSEMBLY
- Publication number 20240264392
- Publication date Aug 8, 2024
- International Business Machines Corporation
- John Knickerbocker
- G02 - OPTICS
Information Patent Application
INFRARED DEBOND DAMAGE MITIGATION BY COPPER FILL PATTERN
- Publication number 20240170288
- Publication date May 23, 2024
- International Business Machines Corporation
- Mukta Ghate Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON HANDLER WITH LASER-RELEASE LAYERS
- Publication number 20230178404
- Publication date Jun 8, 2023
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE DIE ASSEMBLY
- Publication number 20230163100
- Publication date May 25, 2023
- International Business Machines Corporation
- Katsuyuki Sakuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC SUBSTRATE STACKING
- Publication number 20230098054
- Publication date Mar 30, 2023
- International Business Machines Corporation
- Lei Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY INTERCONNECTION AND WIRING LAYERS, PACKAGE STRUCTURES,...
- Publication number 20230100769
- Publication date Mar 30, 2023
- International Business Machines Corporation
- John Knickerbocker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER WAFER WITH MULTIPLE ANTIREFLECTIVE COATING LAYERS
- Publication number 20230087366
- Publication date Mar 23, 2023
- International Business Machines Corporation
- Qianwen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Sensor Platform for Health Monitoring
- Publication number 20220199235
- Publication date Jun 23, 2022
- International Business Machines Corporation
- John Knickerbocker
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HERMETIC PACKAGING OF A MICRO-BATTERY DEVICE
- Publication number 20220200086
- Publication date Jun 23, 2022
- International Business Machines Corporation
- Qianwen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRECISION THIN ELECTRONICS HANDLING INTEGRATION
- Publication number 20210366789
- Publication date Nov 25, 2021
- International Business Machines Corporation
- John Knickerbocker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Silicon Interposer Sandwich Structure for ESD, EMC, and EMC Shieldi...
- Publication number 20210288022
- Publication date Sep 16, 2021
- International Business Machines Corporation
- William EMMETT BERNIER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ultra-Thin Microbattery Packaging and Handling
- Publication number 20210280834
- Publication date Sep 9, 2021
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM BATTERY STACKING
- Publication number 20210265606
- Publication date Aug 26, 2021
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH BANDWIDTH MULTICHIP MODULE
- Publication number 20210249381
- Publication date Aug 12, 2021
- International Business Machines Corporation
- John Knickerbocker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronics Miniaturization Platform for Medication Verification an...
- Publication number 20200395115
- Publication date Dec 17, 2020
- International Business Machines Corporation
- John Knickerbocker
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
HEALTH & FITNESS TRACKING
- Publication number 20200288991
- Publication date Sep 17, 2020
- International Business Machines Corporation
- JOHN KNICKERBOCKER
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
HERMETIAL VIA SEAL FOR THIN FILM BATTERY
- Publication number 20200274113
- Publication date Aug 27, 2020
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THINNED DIE STACK
- Publication number 20200211947
- Publication date Jul 2, 2020
- International Business Machines Corporation
- John Knickerbocker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WEARABLE MULTIPLATFORM SENSOR
- Publication number 20200205735
- Publication date Jul 2, 2020
- International Business Machines Corporation
- Rajeev Narayanan
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
Accurate Colorimetric Based Test Strip Reader System
- Publication number 20200191722
- Publication date Jun 18, 2020
- International Business Machines Corporation
- Minhua Lu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MINIATURIZED ELECTRONICS PACKAGE WITH PATTERNED THIN FILM SOLID STA...
- Publication number 20200194841
- Publication date Jun 18, 2020
- International Business Machines Corporation
- Qianwen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MINIATURIZED ELECTRONICS PACKAGE WITH PATTERNED THIN FILM SOLID STA...
- Publication number 20200185781
- Publication date Jun 11, 2020
- International Business Machines Corporation
- Qianwen Chen
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
HANDLER BONDING AND DEBONDING FOR SEMICONDUCTOR DIES
- Publication number 20200176297
- Publication date Jun 4, 2020
- International Business Machines Corporation
- Paul S. ANDRY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HANDLER BONDING AND DEBONDING FOR SEMICONDUCTOR DIES
- Publication number 20200168475
- Publication date May 28, 2020
- INTERNATIONAL BUSINESS MACHINES CORPORATION
- Paul S. ANDRY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THINNED DIE STACK
- Publication number 20200161230
- Publication date May 21, 2020
- International Business Machines Corporation
- John Knickerbocker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL INTEGRATION INCLUDING DESIGN/CO-DESIGN, STRUCTURE PROCE...
- Publication number 20200126951
- Publication date Apr 23, 2020
- International Business Machines Corporation
- Bing DANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IR ASSISTED FAN-OUT WAFER LEVEL PACKAGING USING SILICON HANDLER
- Publication number 20200098638
- Publication date Mar 26, 2020
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOPLASTIC TEMPORARY ADHESIVE FOR SILICON HANDLER WITH INFRA-RED...
- Publication number 20200083082
- Publication date Mar 12, 2020
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM BATTERY PACKAGING
- Publication number 20200075906
- Publication date Mar 5, 2020
- International Business Machines Corporation
- Qianwen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Speed Handling of Ultra-Small Chips by Selective Laser Bonding...
- Publication number 20200051948
- Publication date Feb 13, 2020
- International Business Machines Corporation
- Qianwen Chen
- H01 - BASIC ELECTRIC ELEMENTS

John U. Knickerbocker

Person

Patents Grantslast 30 patents

Electronic substrate stacking

Multi-sensor platform for health monitoring

High density interconnection and wiring layers, package structures,...

Multiple die assembly

Silicon handler with laser-release layers

Wearable multiplatform sensor

Thin film battery stacking

Silicon interposer sandwich structure for ESD, EMC, and EMC shieldi...

Molten solder injection head with vacuum filter and differential ga...

Precision thin electronics handling integration

Method of forming thin die stack assemblies

Thermoplastic temporary adhesive for silicon handler with infra-red...

Miniaturized electronics package with patterned thin film solid sta...

Ultra-thin microbattery packaging and handling

Miniaturized electronics package with patterned thin film solid sta...

Hermetic packaging of a micro-battery device

Handler bonding and debonding for semiconductor dies

Simplified hermetic packaging of a micro-battery

Simplified hermetic packaging of a micro-battery

IR assisted fan-out wafer level packaging using silicon handler

High bandwidth multichip module

Accurate colorimetric based test strip reader system

Strain gauge structure for a sensor

High speed handling of ultra-small chips by selective laser bonding...

Wafer level integration including design/co-design, structure proce...

Thin film solid-state microbattery packaging

Saccade and vergence tracking for distance auto focus adjustment

Handler bonding and debonding for semiconductor dies

Thin film battery packaging

Electronics miniaturization platform for medication verification an...

Patents Applicationslast 30 patents

CO-PACKAGE OPTICS ASSEMBLY

INFRARED DEBOND DAMAGE MITIGATION BY COPPER FILL PATTERN

SILICON HANDLER WITH LASER-RELEASE LAYERS

MULTIPLE DIE ASSEMBLY

ELECTRONIC SUBSTRATE STACKING

HIGH DENSITY INTERCONNECTION AND WIRING LAYERS, PACKAGE STRUCTURES,...

CARRIER WAFER WITH MULTIPLE ANTIREFLECTIVE COATING LAYERS

Multi-Sensor Platform for Health Monitoring

HERMETIC PACKAGING OF A MICRO-BATTERY DEVICE

PRECISION THIN ELECTRONICS HANDLING INTEGRATION

Silicon Interposer Sandwich Structure for ESD, EMC, and EMC Shieldi...

Ultra-Thin Microbattery Packaging and Handling

THIN FILM BATTERY STACKING

HIGH BANDWIDTH MULTICHIP MODULE

Electronics Miniaturization Platform for Medication Verification an...

HEALTH & FITNESS TRACKING

HERMETIAL VIA SEAL FOR THIN FILM BATTERY

THINNED DIE STACK

WEARABLE MULTIPLATFORM SENSOR

Accurate Colorimetric Based Test Strip Reader System

MINIATURIZED ELECTRONICS PACKAGE WITH PATTERNED THIN FILM SOLID STA...

MINIATURIZED ELECTRONICS PACKAGE WITH PATTERNED THIN FILM SOLID STA...

HANDLER BONDING AND DEBONDING FOR SEMICONDUCTOR DIES

HANDLER BONDING AND DEBONDING FOR SEMICONDUCTOR DIES

THINNED DIE STACK

WAFER LEVEL INTEGRATION INCLUDING DESIGN/CO-DESIGN, STRUCTURE PROCE...

IR ASSISTED FAN-OUT WAFER LEVEL PACKAGING USING SILICON HANDLER

THERMOPLASTIC TEMPORARY ADHESIVE FOR SILICON HANDLER WITH INFRA-RED...

THIN FILM BATTERY PACKAGING

High Speed Handling of Ultra-Small Chips by Selective Laser Bonding...