John Valliant

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Santa Cruz, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Method and apparatus for global die thinning and polishing of flip-...
- Patent number 6,939,209
- Issue date Sep 6, 2005
- Credence Systems Corporation
- Chun-Cheng Tsao
- B24 - GRINDING POLISHING
Information Patent Grant
Method for global die thinning and polishing of flip-chip packaged...
- Patent number 6,672,947
- Issue date Jan 6, 2004
- NPTest, LLC
- Chun-Cheng Tsao
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
Method and apparatus for global die thinning and polishing of flip-...
- Publication number 20040106358
- Publication date Jun 3, 2004
- Chun-Cheng Tsao
- B24 - GRINDING POLISHING
Information Patent Application
Method for backside die thinning and polishing of packaged integrat...
- Publication number 20040014401
- Publication date Jan 22, 2004
- Chun-Cheng Tsao
- B24 - GRINDING POLISHING
Information Patent Application
Method for global die thinning and polishing of flip-chip packaged...
- Publication number 20030022603
- Publication date Jan 30, 2003
- Schlumberger Technologies, Inc.
- Chun-Cheng Tsao
- B24 - GRINDING POLISHING