John Wuu

Person

Ft Collins, CO, US

People

Patents Grantslast 30 patents

Information Patent Grant
System and method for SEU detection and correction
- Patent number 12,346,226
- Issue date Jul 1, 2025
- Xilinx, Inc.
- Kumar Rahul
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Arrangement and thermal management of 3D stacked dies
- Patent number 12,266,585
- Issue date Apr 1, 2025
- Advanced Micro Devices, Inc.
- John Wuu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
ECC optimization
- Patent number 12,212,337
- Issue date Jan 28, 2025
- Xilinx, Inc.
- Kumar Rahul
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
SRAM power savings and write assist
- Patent number 12,165,700
- Issue date Dec 10, 2024
- Advanced Micro Devices, Inc.
- Russell J. Schreiber
- G11 - INFORMATION STORAGE
Information Patent Grant
Through-silicon via layout for multi-die integrated circuits
- Patent number 12,107,076
- Issue date Oct 1, 2024
- Advanced Micro Devices, Inc.
- Wonjun Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual read port latch array bitcell
- Patent number 12,073,919
- Issue date Aug 27, 2024
- Advanced Micro Devices, Inc.
- Arijit Banerjee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Single event upset tolerant memory device
- Patent number 12,045,469
- Issue date Jul 23, 2024
- Xilinx, Inc.
- Kumar Rahul
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Split read port latch array bit cell
- Patent number 12,033,721
- Issue date Jul 9, 2024
- Advanced Micro Devices, Inc.
- Arijit Banerjee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Stacked die circuit routing system and method
- Patent number 11,869,874
- Issue date Jan 9, 2024
- Advanced Micro Devices, Inc.
- John Wuu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low power cache
- Patent number 11,822,484
- Issue date Nov 21, 2023
- Advanced Micro Devices, Inc.
- Vydhyanathan Kalyanasundharam
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Scheme for enabling die reuse in 3D stacked products
- Patent number 11,804,479
- Issue date Oct 31, 2023
- Advanced Micro Devices, Inc.
- John J. Wuu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Latch bit cells
- Patent number 11,715,514
- Issue date Aug 1, 2023
- Advanced Micro Devices, Inc.
- Russell J. Schreiber
- G11 - INFORMATION STORAGE
Information Patent Grant
Dual-track bitline scheme for 6T SRAM cells
- Patent number 11,710,698
- Issue date Jul 25, 2023
- Advanced Micro Devices, Inc.
- John J. Wuu
- G11 - INFORMATION STORAGE
Information Patent Grant
Memory with expandable row width
- Patent number 11,676,659
- Issue date Jun 13, 2023
- Advanced Micro Devices, Inc.
- John Wuu
- G11 - INFORMATION STORAGE
Information Patent Grant
Write masked latch bit cell
- Patent number 11,610,627
- Issue date Mar 21, 2023
- Advanced Micro Devices, Inc.
- Russell J. Schreiber
- G11 - INFORMATION STORAGE
Information Patent Grant
Hybrid library latch array
- Patent number 11,527,270
- Issue date Dec 13, 2022
- Advanced Micro Devices, Inc.
- John J. Wuu
- G11 - INFORMATION STORAGE
Information Patent Grant
Folded cell layout for 6T SRAM cell
- Patent number 11,437,316
- Issue date Sep 6, 2022
- Advanced Micro Devices, Inc.
- Richard T. Schultz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
In memory logic functions using memory arrays
- Patent number 11,233,510
- Issue date Jan 25, 2022
- Advanced Micro Devices, Inc.
- John J. Wuu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Memory with expandable row width
- Patent number 11,205,477
- Issue date Dec 21, 2021
- Advanced Micro Devices, Inc.
- John Wuu
- G11 - INFORMATION STORAGE
Information Patent Grant
Arrangement and thermal management of 3D stacked dies
- Patent number 11,189,540
- Issue date Nov 30, 2021
- Advanced Micro Devices, Inc.
- John Wuu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Arrangement and thermal management of 3D stacked dies
- Patent number 11,164,807
- Issue date Nov 2, 2021
- Advanced Micro Devices, Inc.
- John Wuu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Timer for use dual voltage supplies
- Patent number 10,839,875
- Issue date Nov 17, 2020
- Advanced Micro Devices, Inc.
- Srinivas R. Sathu
- G11 - INFORMATION STORAGE
Information Patent Grant
Memory with expandable row width
- Patent number 10,783,953
- Issue date Sep 22, 2020
- Advanced Micro Devices, Inc.
- John Wuu
- G11 - INFORMATION STORAGE
Information Patent Grant
Flexibile interfaces using through-silicon via technology
- Patent number 10,644,826
- Issue date May 5, 2020
- Advanced Micro Devices, Inc.
- John Wuu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Configuration of multi-die modules with through-silicon vias
- Patent number 10,509,752
- Issue date Dec 17, 2019
- Advanced Micro Devices, Inc.
- Russell Schreiber
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Arrangement and thermal management of 3D stacked dies
- Patent number 10,431,517
- Issue date Oct 1, 2019
- Advanced Micro Devices, Inc.
- John Wuu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Programmable write word line boost for low voltage memory operation
- Patent number 10,366,734
- Issue date Jul 30, 2019
- Advanced Micro Devices, Inc.
- Alexander W. Schaefer
- G11 - INFORMATION STORAGE
Information Patent Grant
Memory including side-car arrays with irregular sized entries
- Patent number 10,311,191
- Issue date Jun 4, 2019
- Advanced Micro Devices, Inc.
- John J. Wuu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Swizzling in 3D stacked memory
- Patent number 10,303,398
- Issue date May 28, 2019
- Advanced Micro Devices, Inc.
- John Wuu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
VSS bitcell sleep scheme involving modified bitcell for terminating...
- Patent number 10,043,572
- Issue date Aug 7, 2018
- Advanced Micro Devices, Inc.
- Russell Schreiber
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
Chip Self-Repair for Interconnect Short Faults
- Publication number 20250216456
- Publication date Jul 3, 2025
- ADVANCED MICRO DEVICES, INC.
- Nehal R. Patel
- G01 - MEASURING TESTING
Information Patent Application
APPARATUS, SYSTEM, AND METHOD FOR UNIQUELY IDENTIFYING INDIVIDUAL D...
- Publication number 20250210538
- Publication date Jun 26, 2025
- ADVANCED MICRO DEVICES, INC.
- Richard Martin Born
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR POWER CONTROL IN 3D STACKED DIE
- Publication number 20250210497
- Publication date Jun 26, 2025
- ADVANCED MICRO DEVICES, INC.
- Stephen Dussinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT PITCH REALIGNMENT FROM BOND PAD METAL PITCH
- Publication number 20250210557
- Publication date Jun 26, 2025
- ADVANCED MICRO DEVICES, INC.
- Darryl Prudich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS, SYSTEM, AND METHOD FOR BALANCING TIMING CLOSURE
- Publication number 20250210591
- Publication date Jun 26, 2025
- ADVANCED MICRO DEVICES, INC.
- Russell Schreiber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS, SYSTEM, AND METHOD FOR DISTRIBUTING DIE-SPECIFIC SIGNALS...
- Publication number 20250199068
- Publication date Jun 19, 2025
- ADVANCED MICRO DEVICES, INC.
- Russell Schreiber
- G11 - INFORMATION STORAGE
Information Patent Application
DEVICES AND METHODS FOR TESTING DIES WITH OFF-DIE CLOCKS
- Publication number 20250201637
- Publication date Jun 19, 2025
- ADVANCED MICRO DEVICES, INC.
- Russell Schreiber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND SYSTEMS INCLUDING STACKED LOGIC DIES
- Publication number 20250183226
- Publication date Jun 5, 2025
- ADVANCED MICRO DEVICES, INC.
- Russell Schreiber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS, SYSTEM, AND METHOD FOR REDUCING THE FOOTPRINTS OF CIRCUI...
- Publication number 20250174985
- Publication date May 29, 2025
- ADVANCED MICRO DEVICES, INC.
- Stephen Dussinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES AND SYSTEMS FOR FLYING BITLINE WITH JUMPER CELL
- Publication number 20250176154
- Publication date May 29, 2025
- ADVANCED MICRO DEVICES, INC.
- Sahilpreet Singh
- G11 - INFORMATION STORAGE
Information Patent Application
SYSTEM AND METHOD FOR SEU DETECTION AND CORRECTION
- Publication number 20250117298
- Publication date Apr 10, 2025
- Xilinx, Inc.
- Kumar RAHUL
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CHIP-ON-WAFER FACE-TO-BACK HYBRID BONDING WITHOUT SUPPORT CARRIER
- Publication number 20250112047
- Publication date Apr 3, 2025
- ADVANCED MICRO DEVICES, INC.
- Chandra Sekhar Mandalapu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ECC OPTIMIZATION
- Publication number 20240333307
- Publication date Oct 3, 2024
- Xilinx, Inc.
- Kumar RAHUL
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
DIE PAIR DEVICE PARTITIONING
- Publication number 20240324247
- Publication date Sep 26, 2024
- ADVANCED MICRO DEVICES, INC.
- Samuel Naffziger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADVANCED PROCESS IN PROCESS PAIR WITHOUT FUSES
- Publication number 20240324248
- Publication date Sep 26, 2024
- ADVANCED MICRO DEVICES, INC.
- John Wuu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPERATURE SENSORS IN DIE PAIR TOPOLOGY
- Publication number 20240321668
- Publication date Sep 26, 2024
- ADVANCED MICRO DEVICES, INC.
- Thomas D. Burd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE POWER
- Publication number 20240321702
- Publication date Sep 26, 2024
- ADVANCED MICRO DEVICES, INC.
- Yan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY AWARE STACKING TOPOLOGY
- Publication number 20240321827
- Publication date Sep 26, 2024
- ADVANCED MICRO DEVICES, INC.
- Omar Zia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK END OF LINE OPTIMIZED TO FUNCTION IN A 3D STACK CONFIGURATION
- Publication number 20240321706
- Publication date Sep 26, 2024
- ADVANCED MICRO DEVICES, INC.
- William George En
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGLE EVENT UPSET TOLERANT MEMORY DEVICE
- Publication number 20240201863
- Publication date Jun 20, 2024
- Xilinx, Inc.
- Kumar RAHUL
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
BACKSIDE POWER DELIVERY AND POWER GRID PATTERN TO SUPPORT 3D DIE ST...
- Publication number 20240105675
- Publication date Mar 28, 2024
- ADVANCED MICRO DEVICES, INC.
- Richard T. Schultz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SCHEME FOR ENABLING DIE REUSE IN 3D STACKED PRODUCTS
- Publication number 20240063206
- Publication date Feb 22, 2024
- ADVANCED MICRO DEVICES, INC.
- John J. Wuu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKING SEMICONDUCTOR DEVICES BY BONDING FRONT SURFACES OF DIFFERE...
- Publication number 20230268319
- Publication date Aug 24, 2023
- ADVANCED MICRO DEVICES, INC.
- RAHUL AGARWAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-SILICON VIA LAYOUT FOR MULTI-DIE INTEGRATED CIRCUITS
- Publication number 20230207527
- Publication date Jun 29, 2023
- ADVANCED MICRO DEVICES, INC.
- Wonjun JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW POWER CACHE
- Publication number 20230195642
- Publication date Jun 22, 2023
- ADVANCED MICRO DEVICES, INC.
- Vydhyanathan Kalyanasundharam
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DYNAMIC SETUP AND HOLD TIMES ADJUSTMENT FOR MEMORIES
- Publication number 20230112432
- Publication date Apr 13, 2023
- ADVANCED MICRO DEVICES, INC.
- John J. Wuu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SRAM POWER SAVINGS AND WRITE ASSIST
- Publication number 20230100607
- Publication date Mar 30, 2023
- ADVANCED MICRO DEVICES, INC.
- Russell J. Schreiber
- G11 - INFORMATION STORAGE
Information Patent Application
MULTI-DIE COMMUNICATIONS COUPLINGS USING A SINGLE BRIDGE DIE
- Publication number 20230069294
- Publication date Mar 2, 2023
- ADVANCED MICRO DEVICES, INC.
- RAHUL AGARWAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL READ PORT LATCH ARRAY BITCELL
- Publication number 20220415377
- Publication date Dec 29, 2022
- ADVANCED MICRO DEVICES, INC.
- Arijit Banerjee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SPLIT READ PORT LATCH ARRAY BIT CELL
- Publication number 20220415378
- Publication date Dec 29, 2022
- ADVANCED MICRO DEVICES, INC.
- Arijit Banerjee
- G06 - COMPUTING CALCULATING COUNTING

Person

Patents Grantslast 30 patents

System and method for SEU detection and correction

Arrangement and thermal management of 3D stacked dies

ECC optimization

SRAM power savings and write assist

Through-silicon via layout for multi-die integrated circuits

Dual read port latch array bitcell

Single event upset tolerant memory device

Split read port latch array bit cell

Stacked die circuit routing system and method

Low power cache

Scheme for enabling die reuse in 3D stacked products

Latch bit cells

Dual-track bitline scheme for 6T SRAM cells

Memory with expandable row width

Write masked latch bit cell

Hybrid library latch array

Folded cell layout for 6T SRAM cell

In memory logic functions using memory arrays

Memory with expandable row width

Arrangement and thermal management of 3D stacked dies

Arrangement and thermal management of 3D stacked dies

Timer for use dual voltage supplies

Memory with expandable row width

Flexibile interfaces using through-silicon via technology

Configuration of multi-die modules with through-silicon vias

Arrangement and thermal management of 3D stacked dies

Programmable write word line boost for low voltage memory operation

Memory including side-car arrays with irregular sized entries

Swizzling in 3D stacked memory

VSS bitcell sleep scheme involving modified bitcell for terminating...

Patents Applicationslast 30 patents

Chip Self-Repair for Interconnect Short Faults

APPARATUS, SYSTEM, AND METHOD FOR UNIQUELY IDENTIFYING INDIVIDUAL D...

SYSTEMS AND METHODS FOR POWER CONTROL IN 3D STACKED DIE

COMPONENT PITCH REALIGNMENT FROM BOND PAD METAL PITCH

APPARATUS, SYSTEM, AND METHOD FOR BALANCING TIMING CLOSURE

APPARATUS, SYSTEM, AND METHOD FOR DISTRIBUTING DIE-SPECIFIC SIGNALS...

DEVICES AND METHODS FOR TESTING DIES WITH OFF-DIE CLOCKS

SEMICONDUCTOR DEVICES AND SYSTEMS INCLUDING STACKED LOGIC DIES

APPARATUS, SYSTEM, AND METHOD FOR REDUCING THE FOOTPRINTS OF CIRCUI...

DEVICES AND SYSTEMS FOR FLYING BITLINE WITH JUMPER CELL

SYSTEM AND METHOD FOR SEU DETECTION AND CORRECTION

CHIP-ON-WAFER FACE-TO-BACK HYBRID BONDING WITHOUT SUPPORT CARRIER

ECC OPTIMIZATION

DIE PAIR DEVICE PARTITIONING

ADVANCED PROCESS IN PROCESS PAIR WITHOUT FUSES

TEMPERATURE SENSORS IN DIE PAIR TOPOLOGY

BACKSIDE POWER

THERMALLY AWARE STACKING TOPOLOGY

BACK END OF LINE OPTIMIZED TO FUNCTION IN A 3D STACK CONFIGURATION

SINGLE EVENT UPSET TOLERANT MEMORY DEVICE

BACKSIDE POWER DELIVERY AND POWER GRID PATTERN TO SUPPORT 3D DIE ST...

SCHEME FOR ENABLING DIE REUSE IN 3D STACKED PRODUCTS

STACKING SEMICONDUCTOR DEVICES BY BONDING FRONT SURFACES OF DIFFERE...

THROUGH-SILICON VIA LAYOUT FOR MULTI-DIE INTEGRATED CIRCUITS

LOW POWER CACHE

DYNAMIC SETUP AND HOLD TIMES ADJUSTMENT FOR MEMORIES

SRAM POWER SAVINGS AND WRITE ASSIST

MULTI-DIE COMMUNICATIONS COUPLINGS USING A SINGLE BRIDGE DIE

DUAL READ PORT LATCH ARRAY BITCELL

SPLIT READ PORT LATCH ARRAY BIT CELL