Jonghae Kim

Person

San Diego, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated device and integrated passive device comprising magnetic...
- Patent number 12,354,948
- Issue date Jul 8, 2025
- QUALCOMM Incorporated
- Kai Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate comprising acoustic resonators configured as at least one...
- Patent number 12,334,903
- Issue date Jun 17, 2025
- QUALCOMM Incorporated
- Jonghae Kim
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Integrated circuit assembly with hybrid bonding
- Patent number 12,300,655
- Issue date May 13, 2025
- QUALCOMM Incorporated
- Jonghae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D inductor design using bundle substrate vias
- Patent number 12,283,607
- Issue date Apr 22, 2025
- QUALCOMM Incorporated
- Jonghae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wideband filter with resonators and inductors
- Patent number 12,273,095
- Issue date Apr 8, 2025
- QUALCOMM Incorporated
- Kai Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna modules employing three-dimensional (3D) build-up on mold p...
- Patent number 12,255,381
- Issue date Mar 18, 2025
- QUALCOMM Incorporated
- Ranadeep Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit (IC) packages employing a capacitor-embedded, re...
- Patent number 12,218,041
- Issue date Feb 4, 2025
- QUALCOMM Incorporated
- Jihong Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency oscillator with ceramic resonator and surface-mount...
- Patent number 12,206,155
- Issue date Jan 21, 2025
- QUALCOMM Incorporated
- Kai Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backend and acoustic process integration for high-Q filter
- Patent number 12,155,373
- Issue date Nov 26, 2024
- QUALCOMM Incorporated
- Kai Liu
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Integrated device and integrated passive device comprising magnetic...
- Patent number 12,142,561
- Issue date Nov 12, 2024
- QUALCOMM Incorporated
- Kai Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid reconstituted substrate for electronic packaging
- Patent number 12,046,545
- Issue date Jul 23, 2024
- QUALCOMM Incorporated
- Jonghae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal bridge interposer structure
- Patent number 12,046,530
- Issue date Jul 23, 2024
- QUALCOMM Incorporated
- Je-Hsiung Lan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film resistor (TFR) device structure for high performance radi...
- Patent number 12,040,268
- Issue date Jul 16, 2024
- QUALCOMM Incorporated
- Je-Hsiung Lan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface acoustic wave (SAW) filter packages employing an enhanced t...
- Patent number 11,984,874
- Issue date May 14, 2024
- QUALCOMM Incorporated
- Ranadeep Dutta
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Trench capacitor assembly for high capacitance density
- Patent number 11,894,366
- Issue date Feb 6, 2024
- QUALCOMM Incorporated
- Jonghae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with a substrate comprising an embedded capacitor with side...
- Patent number 11,876,085
- Issue date Jan 16, 2024
- QUALCOMM Incorporated
- Abinash Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
ESL-less AC resistor for high frequency applications
- Patent number 11,862,367
- Issue date Jan 2, 2024
- QUALCOMM Incorporated
- Jonghae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package comprising integrated devices and bridge coupling top sides...
- Patent number 11,830,819
- Issue date Nov 28, 2023
- QUALCOMM Incorporated
- Bharani Chava
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal mitigation die using back side etch
- Patent number 11,817,365
- Issue date Nov 14, 2023
- QUALCOMM Incorporated
- Aniket Patil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate comprising an inductor and a capacitor located in an enca...
- Patent number 11,817,379
- Issue date Nov 14, 2023
- QUALCOMM Incorporated
- Jonghae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device on ceramic substrate
- Patent number 11,791,226
- Issue date Oct 17, 2023
- QUALCOMM Incorporated
- Je-Hsiung Lan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit (IC) with reconstituted die interposer for impro...
- Patent number 11,769,732
- Issue date Sep 26, 2023
- QUALCOMM Incorporated
- Jonghae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency front end (RFFE) hetero-integration
- Patent number 11,749,746
- Issue date Sep 5, 2023
- QUALCOMM Incorporated
- Ranadeep Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package comprising stacked filters with a shared substrate cap
- Patent number 11,689,181
- Issue date Jun 27, 2023
- QUALCOMM Incorporated
- Jonghae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit assembly with hybrid bonding
- Patent number 11,670,614
- Issue date Jun 6, 2023
- QUALCOMM Incorporated
- Jonghae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor interposer layer (CIL) chiplet design with conformal die...
- Patent number 11,658,103
- Issue date May 23, 2023
- QUALCOMM Incorporated
- Je-Hsiung Lan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High performance tunable filter
- Patent number 11,652,468
- Issue date May 16, 2023
- QUALCOMM Incorporated
- Je-Hsiung Lan
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Integrated device with electromagnetic shield
- Patent number 11,652,064
- Issue date May 16, 2023
- QUALCOMM Incorporated
- Jonghae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench capacitor assembly for high capacitance density
- Patent number 11,652,101
- Issue date May 16, 2023
- QUALCOMM Incorporated
- Jonghae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MIM capacitor with adjustable capacitance via electronic fuses
- Patent number 11,631,614
- Issue date Apr 18, 2023
- QUALCOMM Incorporated
- Jonghae Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT DEVICE INCLUDING IMPEDANCE ADAPTER
- Publication number 20250226365
- Publication date Jul 10, 2025
- QUALCOMM Incorporated
- Je-Hsiung LAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER HAVING INTEGRATED OPTICAL WAVEGUIDE
- Publication number 20250216623
- Publication date Jul 3, 2025
- QUALCOMM Incorporated
- Ranadeep DUTTA
- G02 - OPTICS
Information Patent Application
WIDEBAND FILTER WITH RESONATORS AND INDUCTORS
- Publication number 20250219618
- Publication date Jul 3, 2025
- QUALCOMM Incorporated
- Kai LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA MODULES EMPLOYING THREE-DIMENSIONAL (3D) BUILD-UP ON MOLD P...
- Publication number 20250210852
- Publication date Jun 26, 2025
- QUALCOMM Incorporated
- Ranadeep DUTTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE INCLUDING THERMAL INTERPOSER LAYER
- Publication number 20250201662
- Publication date Jun 19, 2025
- QUALCOMM Incorporated
- Je-Hsiung LAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING A CAPACITOR-EMBEDDED, RE...
- Publication number 20250118645
- Publication date Apr 10, 2025
- QUALCOMM Incorporated
- Jihong Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE AND INTEGRATED PASSIVE DEVICE COMPRISING INDUCTIV...
- Publication number 20250105145
- Publication date Mar 27, 2025
- QUALCOMM Incorporated
- Kai LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE COMPRISING SILICON SUBSTRATE WITH POROUS PORTION
- Publication number 20250096090
- Publication date Mar 20, 2025
- QUALCOMM Incorporated
- Ranadeep DUTTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTOR PERFORMANCE ENHANCEMENT USING AN OUTER, PERIPHERAL PATTERN...
- Publication number 20250096116
- Publication date Mar 20, 2025
- QUALCOMM Incorporated
- Jonghae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICES COUPLED TO INTERPOSER COMPRISING POROUS PORTION
- Publication number 20250096093
- Publication date Mar 20, 2025
- QUALCOMM Incorporated
- Ranadeep DUTTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACOUSTIC DEVICES WITH INTEGRATED CIRCUIT ELEMENTS AND RELATED FABRI...
- Publication number 20250047262
- Publication date Feb 6, 2025
- QUALCOMM Incorporated
- Je-Hsiung LAN
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
PACKAGE COMPRISING A SUBSTRATE WITH INDUCTORS AND A MAGNETIC LAYER
- Publication number 20250037923
- Publication date Jan 30, 2025
- QUALCOMM Incorporated
- Kai LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE COMPRISING STACKED THROUGH ENCAPSULATION VIA INTERCONNECTS
- Publication number 20250022858
- Publication date Jan 16, 2025
- QUALCOMM Incorporated
- Kai LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED INDUCTOR INCLUDING MAGNETIC LAYER
- Publication number 20250006631
- Publication date Jan 2, 2025
- QUALCOMM Incorporated
- Jui-Yi CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES INCLUDING THROUGH-SUBSTRATE VIAS (TSVs) FOR BACKSIDE INTERC...
- Publication number 20240421790
- Publication date Dec 19, 2024
- QUALCOMM Incorporated
- Je-Hsiung LAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTIVE DEVICE
- Publication number 20240387092
- Publication date Nov 21, 2024
- QUALCOMM Incorporated
- Kai LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA MODULE AS A RADIO-FREQUENCY (RF) INTEGRATED CIRCUIT (IC) DI...
- Publication number 20240347913
- Publication date Oct 17, 2024
- QUALCOMM Incorporated
- Ranadeep DUTTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO FREQUENCY OSCILLATOR WITH CERAMIC RESONATOR AND SURFACE-MOUNT...
- Publication number 20240322417
- Publication date Sep 26, 2024
- QUALCOMM Incorporated
- Kai LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL (3D) INDUCTOR WITH TWO-SIDE BONDING WIRES
- Publication number 20240321507
- Publication date Sep 26, 2024
- QUALCOMM Incorporated
- Kai LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MONOLITHIC-INTEGRATED BULK ACOUSTIC WAVE (BAW) RESONATOR
- Publication number 20240322791
- Publication date Sep 26, 2024
- QUALCOMM Incorporated
- Abhijeet PAUL
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
ANTENNA ON GLASS WITH THROUGH GLASS VIA SIDEWALL SHIELDING STRUCTURE
- Publication number 20240313405
- Publication date Sep 19, 2024
- QUALCOMM Incorporated
- Je-Hsiung LAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COUPLED INDUCTORS THROUGH SUBSTRATE-ASSEMBLY PROCESS AND/OR WAFER-L...
- Publication number 20240304545
- Publication date Sep 12, 2024
- QUALCOMM Incorporated
- Kai LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE COMPRISING PLATE INTERCONNECTS AND A MAGNETIC MAT...
- Publication number 20240258363
- Publication date Aug 1, 2024
- QUALCOMM Incorporated
- Kai LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPACT HYBRID ACOUSTIC WAVE FILTER STRUCTURE
- Publication number 20240258995
- Publication date Aug 1, 2024
- QUALCOMM Incorporated
- Je-Hsiung LAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAVITY-EMBEDDED TUNABLE FILTER
- Publication number 20240243036
- Publication date Jul 18, 2024
- QUALCOMM Incorporated
- Je-Hsiung LAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE HAVING AN IN-SUBSTRATE INDUCTOR AND METHOD FOR MAKING THE IN...
- Publication number 20240204039
- Publication date Jun 20, 2024
- QUALCOMM Incorporated
- Kai LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH MOLDING CONTACT ENABLED EMI SHIELDING
- Publication number 20240203895
- Publication date Jun 20, 2024
- QUALCOMM Incorporated
- Je-Hsiung LAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR DEVICES WITH DOUBLE-SIDE CONTACTS AND STANDARD CELL
- Publication number 20240105728
- Publication date Mar 28, 2024
- QUALCOMM Incorporated
- Qingqing LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTIVE DEVICE STRUCTURE AND PROCESS METHOD
- Publication number 20240105760
- Publication date Mar 28, 2024
- QUALCOMM Incorporated
- Je-Hsiung LAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR DEVICES WITH DOUBLE-SIDE CONTACTS
- Publication number 20240105797
- Publication date Mar 28, 2024
- QUALCOMM Incorporated
- Qingqing LIANG
- H01 - BASIC ELECTRIC ELEMENTS

Jonghae Kim

Person

Patents Grantslast 30 patents

Integrated device and integrated passive device comprising magnetic...

Substrate comprising acoustic resonators configured as at least one...

Integrated circuit assembly with hybrid bonding

3D inductor design using bundle substrate vias

Wideband filter with resonators and inductors

Antenna modules employing three-dimensional (3D) build-up on mold p...

Integrated circuit (IC) packages employing a capacitor-embedded, re...

Radio frequency oscillator with ceramic resonator and surface-mount...

Backend and acoustic process integration for high-Q filter

Integrated device and integrated passive device comprising magnetic...

Hybrid reconstituted substrate for electronic packaging

Thermal bridge interposer structure

Thin film resistor (TFR) device structure for high performance radi...

Surface acoustic wave (SAW) filter packages employing an enhanced t...

Trench capacitor assembly for high capacitance density

Package with a substrate comprising an embedded capacitor with side...

ESL-less AC resistor for high frequency applications

Package comprising integrated devices and bridge coupling top sides...

Thermal mitigation die using back side etch

Substrate comprising an inductor and a capacitor located in an enca...

Device on ceramic substrate

Integrated circuit (IC) with reconstituted die interposer for impro...

Radio frequency front end (RFFE) hetero-integration

Package comprising stacked filters with a shared substrate cap

Integrated circuit assembly with hybrid bonding

Capacitor interposer layer (CIL) chiplet design with conformal die...

High performance tunable filter

Integrated device with electromagnetic shield

Trench capacitor assembly for high capacitance density

MIM capacitor with adjustable capacitance via electronic fuses

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT DEVICE INCLUDING IMPEDANCE ADAPTER

INTERPOSER HAVING INTEGRATED OPTICAL WAVEGUIDE

WIDEBAND FILTER WITH RESONATORS AND INDUCTORS

ANTENNA MODULES EMPLOYING THREE-DIMENSIONAL (3D) BUILD-UP ON MOLD P...

INTEGRATED CIRCUIT DEVICE INCLUDING THERMAL INTERPOSER LAYER

INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING A CAPACITOR-EMBEDDED, RE...

INTEGRATED DEVICE AND INTEGRATED PASSIVE DEVICE COMPRISING INDUCTIV...

INTEGRATED DEVICE COMPRISING SILICON SUBSTRATE WITH POROUS PORTION

INDUCTOR PERFORMANCE ENHANCEMENT USING AN OUTER, PERIPHERAL PATTERN...

INTEGRATED DEVICES COUPLED TO INTERPOSER COMPRISING POROUS PORTION

ACOUSTIC DEVICES WITH INTEGRATED CIRCUIT ELEMENTS AND RELATED FABRI...

PACKAGE COMPRISING A SUBSTRATE WITH INDUCTORS AND A MAGNETIC LAYER

DEVICE COMPRISING STACKED THROUGH ENCAPSULATION VIA INTERCONNECTS

INTEGRATED INDUCTOR INCLUDING MAGNETIC LAYER

DEVICES INCLUDING THROUGH-SUBSTRATE VIAS (TSVs) FOR BACKSIDE INTERC...

INDUCTIVE DEVICE

ANTENNA MODULE AS A RADIO-FREQUENCY (RF) INTEGRATED CIRCUIT (IC) DI...

RADIO FREQUENCY OSCILLATOR WITH CERAMIC RESONATOR AND SURFACE-MOUNT...

THREE-DIMENSIONAL (3D) INDUCTOR WITH TWO-SIDE BONDING WIRES

MONOLITHIC-INTEGRATED BULK ACOUSTIC WAVE (BAW) RESONATOR

ANTENNA ON GLASS WITH THROUGH GLASS VIA SIDEWALL SHIELDING STRUCTURE

COUPLED INDUCTORS THROUGH SUBSTRATE-ASSEMBLY PROCESS AND/OR WAFER-L...

INTEGRATED DEVICE COMPRISING PLATE INTERCONNECTS AND A MAGNETIC MAT...

COMPACT HYBRID ACOUSTIC WAVE FILTER STRUCTURE

CAVITY-EMBEDDED TUNABLE FILTER

DEVICE HAVING AN IN-SUBSTRATE INDUCTOR AND METHOD FOR MAKING THE IN...

THROUGH MOLDING CONTACT ENABLED EMI SHIELDING

TRANSISTOR DEVICES WITH DOUBLE-SIDE CONTACTS AND STANDARD CELL

INDUCTIVE DEVICE STRUCTURE AND PROCESS METHOD

TRANSISTOR DEVICES WITH DOUBLE-SIDE CONTACTS