Joong-hyun Baek

Person

Suwon-city, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Apparatus for amplifying nucleic acids
- Patent number 9,023,639
- Issue date May 5, 2015
- Samsung Electronics Co., Ltd.
- Jae-Young Kim
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Package on package having improved thermal characteristics
- Patent number 8,796,835
- Issue date Aug 5, 2014
- Samsung Electronics Co., Ltd.
- Yoon-Hoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages having redistribution structures
- Patent number 8,791,580
- Issue date Jul 29, 2014
- Samsung Electronics Co., Ltd.
- Chul Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor package
- Patent number 8,524,539
- Issue date Sep 3, 2013
- SAMASUNG Electronics Co., Ltd.
- Hee-Jin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and an electronic system including the same
- Patent number 8,456,000
- Issue date Jun 4, 2013
- Stanzione & Kim, LLP
- Joong-Hyun Baek
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Light emitting device
- Patent number 8,344,601
- Issue date Jan 1, 2013
- Samsung Electronics Co., Ltd.
- Joong-Hyun Baek
- G02 - OPTICS
Information Patent Grant
Wafer stacked package waving bertical heat emission path and method...
- Patent number 8,310,046
- Issue date Nov 13, 2012
- Samsung Electronics Co., Ltd.
- Joong-Hyun Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 8,184,439
- Issue date May 22, 2012
- Samsung Electronics Co., Ltd.
- Joong-hyun Baek
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer stacked package waving bertical heat emission path and method...
- Patent number 8,049,329
- Issue date Nov 1, 2011
- Samsung Electronics Co., Ltd.
- Joong-Hyun Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and integrated circuit module
- Patent number 7,880,291
- Issue date Feb 1, 2011
- Samsung Electronics Co., Ltd.
- Sang-Wook Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory module having an oblique memory chip
- Patent number 7,812,445
- Issue date Oct 12, 2010
- Samsung Electronics Co., Ltd.
- Joong-Hyun Baek
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device including thermally dissipating dummy pads
- Patent number 7,800,138
- Issue date Sep 21, 2010
- Samsung Electronics Co., Ltd.
- Joong-Hyun Baek
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Cooling apparatus for memory module
- Patent number 7,705,449
- Issue date Apr 27, 2010
- Samsung Electronics Co., Ltd.
- Joong Hyun Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer stacked package having vertical heat emission path and method...
- Patent number 7,626,261
- Issue date Dec 1, 2009
- Samsung Electronics Co., Ltd.
- Joong-Hyun Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory module, socket and mounting method providing improved heat d...
- Patent number 7,485,006
- Issue date Feb 3, 2009
- Samsung Electronics Co. Ltd.
- Sang-Wook Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor stack package and memory module with improved heat di...
- Patent number 7,473,993
- Issue date Jan 6, 2009
- Samsung Electronics Co., Ltd.
- Joong-Hyun Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module with heat sink and method thereof
- Patent number 7,345,882
- Issue date Mar 18, 2008
- Samsung Electronics Co., Ltd.
- Hae-Hyung Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor chip package with thermoelectric cooler
- Patent number 7,301,233
- Issue date Nov 27, 2007
- Samsung Electronics Co., Ltd.
- Hae-Hyung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having thermal interface material (TIM)
- Patent number 7,081,375
- Issue date Jul 25, 2006
- Samsung Electronics Co., Ltd.
- Joong-Hyun Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module with vertically mounted semiconductor chip pac...
- Patent number 7,050,303
- Issue date May 23, 2006
- Samsung Electronics Co., Ltd.
- Sang-Wook Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Underfill system for semiconductor package
- Patent number 6,895,666
- Issue date May 24, 2005
- Samsung Electronics Co., Ltd.
- Seong-Jae Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor module and method of manufacturing the same
- Patent number 6,835,598
- Issue date Dec 28, 2004
- Samsung Electronics Co., Ltd.
- Joong-hyun Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package having improved heat spread characteristics and...
- Patent number 6,781,849
- Issue date Aug 24, 2004
- Samsung Electronics Co., Ltd.
- Joong-hyun Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having thermal interface material (TIM)
- Patent number 6,756,668
- Issue date Jun 29, 2004
- Samsung Electronics Co., Ltd.
- Joong-Hyun Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink with cooling fins for semiconductor package
- Patent number 6,498,395
- Issue date Dec 24, 2002
- Samsung Electronics Co., Ltd.
- Joong-hyun Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module with improved solder joint reliability
- Patent number 6,498,388
- Issue date Dec 24, 2002
- Samsung Electronics Co., Ltd.
- Min-Ha Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical semiconductor device package having printed circuit board...
- Patent number 6,326,686
- Issue date Dec 4, 2001
- Samsung Electronics Co., Ltd.
- Joong Hyun Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mold having projections for inhibiting the formation of air pockets
- Patent number 5,897,883
- Issue date Apr 27, 1999
- Samsung Electronics Co., Ltd.
- Chang Ho Cho
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGES HAVING REDISTRIBUTION STRUCTURES
- Publication number 20130168842
- Publication date Jul 4, 2013
- Chul PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE
- Publication number 20120045871
- Publication date Feb 23, 2012
- Samsung Electronics Co., Ltd.
- Hee-Jin LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER STACKED PACKAGE WAVING BERTICAL HEAT EMISSION PATH AND METHOD...
- Publication number 20120001348
- Publication date Jan 5, 2012
- Samsung Electronics Co., Ltd.
- Joong-Hyun BAEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package On Package Having Improved Thermal Characteristics
- Publication number 20110304035
- Publication date Dec 15, 2011
- Samsung Electronics Co., Ltd.
- Yoon-hoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20110032679
- Publication date Feb 10, 2011
- Joong-hyun Baek
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIGHT EMITTING DEVICE
- Publication number 20100181887
- Publication date Jul 22, 2010
- Samsung Electronics Co., Ltd.
- Joong-Hyun BAEK
- G02 - OPTICS
Information Patent Application
MEMORY MODULE
- Publication number 20100079966
- Publication date Apr 1, 2010
- Samsung Electronics Co., Ltd.
- Joong-Hyun BAEK
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR MODULE AND AN ELECTRONIC SYSTEM INCLUDING THE SAME
- Publication number 20100059880
- Publication date Mar 11, 2010
- Samsung Electronics Co., Ltd.
- Joong-Hyun BAEK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER STACKED PACKAGE WAVING BERTICAL HEAT EMISSION PATH AND METHOD...
- Publication number 20100038769
- Publication date Feb 18, 2010
- Samsung Electronics Co., Ltd.
- Joong-Hyun BAEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit package and integrated circuit module
- Publication number 20090273905
- Publication date Nov 5, 2009
- Sang-Wook Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR AMPLIFYING NUCLEIC ACIDS
- Publication number 20090186404
- Publication date Jul 23, 2009
- Samsung Electronics Co., Ltd.
- Jae-Young KIM
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
Memory module, socket and mounting method providing improved heat d...
- Publication number 20090130908
- Publication date May 21, 2009
- Sang-Wook Park
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Heat sink for semiconductor device and semiconductor module assembl...
- Publication number 20090129026
- Publication date May 21, 2009
- SAMSUNG ELECTRONICS CO., LTD.
- Joong-hyun Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, STACKED MODULE, CARD,...
- Publication number 20090057880
- Publication date Mar 5, 2009
- Samsung Electronics Co., Ltd.
- Joong-Hyun BAEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor plating system for plating semiconductor object
- Publication number 20080141933
- Publication date Jun 19, 2008
- SAMSUNG ELECTRONICS CO., LTD.
- Cha-jea Jo
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Semiconductor module with heat sink and method thereof
- Publication number 20080144292
- Publication date Jun 19, 2008
- Hae-Hyung Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER STACKED PACKAGE HAVING VERTICAL HEAT EMISSION PATH AND METHOD...
- Publication number 20080099909
- Publication date May 1, 2008
- Samsung Electronics Co., Ltd.
- Joong-Hyun BAEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURES HAVING HEAT DISSIPATIVE ELEMENT DI...
- Publication number 20070252257
- Publication date Nov 1, 2007
- Samsung Electronics Co., Ltd.
- Joong-Hyun BAEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY MODULE HAVING AN OBLIQUE MEMORY CHIP
- Publication number 20070252271
- Publication date Nov 1, 2007
- Samsung Electronics Co., Ltd.
- Joong-Hyun BAEK
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Cooling apparatus for memory module
- Publication number 20070170580
- Publication date Jul 26, 2007
- SAMSUNG ELECTRONICS CO., LTD.
- Joong Hyun Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package, method of manufacturing the same, stacked se...
- Publication number 20070069396
- Publication date Mar 29, 2007
- SAMSUNG ELECTRONICS CO., LTD.
- Hyung-Gil Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit package and integrated circuit module
- Publication number 20060284309
- Publication date Dec 21, 2006
- SAMSUNG ELECTRONICS CO., LTD.
- Sang-Wook Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat pipe and heat pipe structure
- Publication number 20060090884
- Publication date May 4, 2006
- Sang-wook Park
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Multi-chip package having heat dissipating path
- Publication number 20060006517
- Publication date Jan 12, 2006
- Jin-Yang Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor chip package with thermoelectric cooler
- Publication number 20060001140
- Publication date Jan 5, 2006
- Hae-Hyung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory module, socket and mounting method providing improved heat d...
- Publication number 20050245137
- Publication date Nov 3, 2005
- Sang-Wook Park
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Semiconductor stack package and memory module with improved heat di...
- Publication number 20050199992
- Publication date Sep 15, 2005
- Joong-Hyun Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor module with heat sink and method thereof
- Publication number 20050201063
- Publication date Sep 15, 2005
- Hae-Hyung Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Stack package with improved heat radiation and module having the st...
- Publication number 20050133897
- Publication date Jun 23, 2005
- Joong-Hyun Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor module with vertically mounted semiconductor chip pac...
- Publication number 20050135067
- Publication date Jun 23, 2005
- Sang-Wook Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Joong-hyun Baek

Person

Patents Grantslast 30 patents

Apparatus for amplifying nucleic acids

Package on package having improved thermal characteristics

Integrated circuit packages having redistribution structures

Method of manufacturing semiconductor package

Semiconductor module and an electronic system including the same

Light emitting device

Wafer stacked package waving bertical heat emission path and method...

Semiconductor module

Wafer stacked package waving bertical heat emission path and method...

Integrated circuit package and integrated circuit module

Semiconductor memory module having an oblique memory chip

Semiconductor device including thermally dissipating dummy pads

Cooling apparatus for memory module

Wafer stacked package having vertical heat emission path and method...

Memory module, socket and mounting method providing improved heat d...

Semiconductor stack package and memory module with improved heat di...

Semiconductor module with heat sink and method thereof

Semiconductor chip package with thermoelectric cooler

Semiconductor package having thermal interface material (TIM)

Semiconductor module with vertically mounted semiconductor chip pac...

Underfill system for semiconductor package

Stacked semiconductor module and method of manufacturing the same

Multi-chip package having improved heat spread characteristics and...

Semiconductor package having thermal interface material (TIM)

Heat sink with cooling fins for semiconductor package

Semiconductor module with improved solder joint reliability

Vertical semiconductor device package having printed circuit board...

Mold having projections for inhibiting the formation of air pockets

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT PACKAGES HAVING REDISTRIBUTION STRUCTURES

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE

WAFER STACKED PACKAGE WAVING BERTICAL HEAT EMISSION PATH AND METHOD...

Package On Package Having Improved Thermal Characteristics

SEMICONDUCTOR MODULE

LIGHT EMITTING DEVICE

MEMORY MODULE

SEMICONDUCTOR MODULE AND AN ELECTRONIC SYSTEM INCLUDING THE SAME

WAFER STACKED PACKAGE WAVING BERTICAL HEAT EMISSION PATH AND METHOD...

Integrated circuit package and integrated circuit module

APPARATUS FOR AMPLIFYING NUCLEIC ACIDS

Memory module, socket and mounting method providing improved heat d...

Heat sink for semiconductor device and semiconductor module assembl...

SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, STACKED MODULE, CARD,...

Semiconductor plating system for plating semiconductor object

Semiconductor module with heat sink and method thereof

WAFER STACKED PACKAGE HAVING VERTICAL HEAT EMISSION PATH AND METHOD...

SEMICONDUCTOR PACKAGE STRUCTURES HAVING HEAT DISSIPATIVE ELEMENT DI...

SEMICONDUCTOR MEMORY MODULE HAVING AN OBLIQUE MEMORY CHIP

Cooling apparatus for memory module

Semiconductor package, method of manufacturing the same, stacked se...

Integrated circuit package and integrated circuit module

Heat pipe and heat pipe structure

Multi-chip package having heat dissipating path

Semiconductor chip package with thermoelectric cooler

Memory module, socket and mounting method providing improved heat d...

Semiconductor stack package and memory module with improved heat di...

Semiconductor module with heat sink and method thereof

Stack package with improved heat radiation and module having the st...

Semiconductor module with vertically mounted semiconductor chip pac...