Jose Ricardo Paniagua

Person

Newmarket, NH, US

People

Patents Grantslast 30 patents

Information Patent Grant
Backplane footprint for high speed, high density electrical connectors
- Patent number 12,207,395
- Issue date Jan 21, 2025
- Amphenol Corporation
- Marc Robert Charbonneau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backplane footprint for high speed, high density electrical connectors
- Patent number 11,805,595
- Issue date Oct 31, 2023
- Amphenol Corporation
- Marc Robert Charbonneau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backplane footprint for high speed, high density electrical connectors
- Patent number 11,765,813
- Issue date Sep 19, 2023
- Amphenol Corporation
- Marc Robert Charbonneau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Backplane footprint for high speed, high density electrical connectors
- Patent number 11,553,589
- Issue date Jan 10, 2023
- Amphenol Corporation
- Marc Robert Charbonneau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backplane footprint for high speed, high density electrical connectors
- Patent number 11,096,270
- Issue date Aug 17, 2021
- Amphenol Corporation
- Marc Robert Charbonneau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Backplane footprint for high speed, high density electrical connectors
- Patent number 10,993,314
- Issue date Apr 27, 2021
- Amphenol Corporation
- Marc Robert Charbonneau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backplane footprint for high speed, high density electrical connectors
- Patent number 10,638,599
- Issue date Apr 28, 2020
- Amphenol Corporation
- Marc Robert Charbonneau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Backplane footprint for high speed, high density electrical connectors
- Patent number 10,485,097
- Issue date Nov 19, 2019
- Amphenol Corporation
- Marc Robert Charbonneau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backplane footprint for high speed, high density electrical connectors
- Patent number 10,201,074
- Issue date Feb 5, 2019
- Amphenol Corporation
- Marc Robert Charbonneau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Backplane footprint for high speed, high density electrical connectors
- Patent number 10,187,972
- Issue date Jan 22, 2019
- Amphenol Corporation
- Marc Robert Charbonneau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connector with hybrid shield
- Patent number 9,660,384
- Issue date May 23, 2017
- Amphenol Corporation
- Jose Ricardo Paniagua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connector with hybrid shield
- Patent number 9,004,942
- Issue date Apr 14, 2015
- Amphenol Corporation
- Jose Ricardo Paniagua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adjacent plated through holes with staggered couplings for crosstal...
- Patent number 8,481,866
- Issue date Jul 9, 2013
- Amphenol Corporation
- Jason Edward Chan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adjacent plated through holes with staggered couplings for crosstal...
- Patent number 7,999,192
- Issue date Aug 16, 2011
- Amphenol Corporation
- Jason Edward Chan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
BACKPLANE FOOTPRINT FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTORS
- Publication number 20240023232
- Publication date Jan 18, 2024
- Amphenol Corporation
- Marc Robert Charbonneau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKPLANE FOOTPRINT FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTORS
- Publication number 20220361320
- Publication date Nov 10, 2022
- Amphenol Corporation
- Marc Robert Charbonneau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKPLANE FOOTPRINT FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTORS
- Publication number 20210329775
- Publication date Oct 21, 2021
- Amphenol Corporation
- Marc Robert Charbonneau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BACKPLANE FOOTPRINT FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTORS
- Publication number 20210219420
- Publication date Jul 15, 2021
- Amphenol Corporation
- Marc Robert Charbonneau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKPLANE FOOTPRINT FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTORS
- Publication number 20200229299
- Publication date Jul 16, 2020
- Amphenol Corporation
- Marc Robert Charbonneau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BACKPLANE FOOTPRINT FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTORS
- Publication number 20200068705
- Publication date Feb 27, 2020
- Amphenol Corporation
- Marc Robert Charbonneau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BACKPLANE FOOTPRINT FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTORS
- Publication number 20190150273
- Publication date May 16, 2019
- Amphenol Corporation
- Marc Robert Charbonneau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BACKPLANE FOOTPRINT FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTORS
- Publication number 20190110359
- Publication date Apr 11, 2019
- Amphenol Corporation
- Marc Robert Charbonneau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BACKPLANE FOOTPRINT FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTORS
- Publication number 20180070439
- Publication date Mar 8, 2018
- Amphenol Corporation
- Marc Robert Charbonneau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BACKPLANE FOOTPRINT FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTORS
- Publication number 20170265296
- Publication date Sep 14, 2017
- Amphenol Corporation
- Marc Robert Charbonneau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CONNECTOR WITH HYBRID SHIELD
- Publication number 20150255926
- Publication date Sep 10, 2015
- Amphenol Corporation
- Jose Ricardo Paniagua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH PERFORMANCE PRINTED CIRCUIT BOARD
- Publication number 20140326495
- Publication date Nov 6, 2014
- Amphenol Corporation
- Jose Ricardo Paniagua
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ADJACENT PLATED THROUGH HOLES WITH STAGGERED COUPLINGS FOR CROSSTAL...
- Publication number 20120000701
- Publication date Jan 5, 2012
- Amphenol Corporation
- Jason Edward CHAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Adjacent plated through holes with staggered couplings for crosstal...
- Publication number 20080227311
- Publication date Sep 18, 2008
- Jason Edward Chan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Jose Ricardo Paniagua

Person

Patents Grantslast 30 patents

Backplane footprint for high speed, high density electrical connectors

Backplane footprint for high speed, high density electrical connectors

Backplane footprint for high speed, high density electrical connectors

Backplane footprint for high speed, high density electrical connectors

Backplane footprint for high speed, high density electrical connectors

Backplane footprint for high speed, high density electrical connectors

Backplane footprint for high speed, high density electrical connectors

Backplane footprint for high speed, high density electrical connectors

Backplane footprint for high speed, high density electrical connectors

Backplane footprint for high speed, high density electrical connectors

Electrical connector with hybrid shield

Electrical connector with hybrid shield

Adjacent plated through holes with staggered couplings for crosstal...

Adjacent plated through holes with staggered couplings for crosstal...

Patents Applicationslast 30 patents

BACKPLANE FOOTPRINT FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTORS

BACKPLANE FOOTPRINT FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTORS

BACKPLANE FOOTPRINT FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTORS

BACKPLANE FOOTPRINT FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTORS

BACKPLANE FOOTPRINT FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTORS

BACKPLANE FOOTPRINT FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTORS

BACKPLANE FOOTPRINT FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTORS

BACKPLANE FOOTPRINT FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTORS

BACKPLANE FOOTPRINT FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTORS

BACKPLANE FOOTPRINT FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTORS

ELECTRICAL CONNECTOR WITH HYBRID SHIELD

HIGH PERFORMANCE PRINTED CIRCUIT BOARD

ADJACENT PLATED THROUGH HOLES WITH STAGGERED COUPLINGS FOR CROSSTAL...

Adjacent plated through holes with staggered couplings for crosstal...