Joseph A. Abys

Person

Howell, NJ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Process for filling vias in the microelectronics
- Patent number 10,541,140
- Issue date Jan 21, 2020
- MacDermid Enthone Inc.
- Thomas B. Richardson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper filling of through silicon vias
- Patent number 10,221,496
- Issue date Mar 5, 2019
- MacDermid Enthone Inc.
- Thomas B. Richardson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Process for filling vias in the microelectronics
- Patent number 10,103,029
- Issue date Oct 16, 2018
- MacDermid Enthone Inc.
- Thomas B. Richardson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Corrosion protection of bronzes
- Patent number 10,017,863
- Issue date Jul 10, 2018
- Joseph A. Abys
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Silver plating in electronics manufacture
- Patent number 9,730,321
- Issue date Aug 8, 2017
- Yung-Herng Yau
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Adhesion promotion in printed circuit boards
- Patent number 9,338,896
- Issue date May 10, 2016
- Enthone, Inc.
- Abayomi I. Owei
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Electrolytic deposition of metal-based composite coatings comprisin...
- Patent number 9,217,205
- Issue date Dec 22, 2015
- Enthone Inc.
- Joseph A. Abys
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Immersion tin silver plating in electronics manufacture
- Patent number 9,175,400
- Issue date Nov 3, 2015
- Enthone Inc.
- Yung-Herng Yau
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Silver plating in electronics manufacture
- Patent number 8,986,434
- Issue date Mar 24, 2015
- Enthone Inc.
- Yung-Herng Yau
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Composite coatings for whisker reduction
- Patent number 8,906,217
- Issue date Dec 9, 2014
- Enthone Inc.
- Joseph A. Abys
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Metallic surface enhancement
- Patent number 8,741,390
- Issue date Jun 3, 2014
- Enthone Inc.
- Joseph A. Abys
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Anti-tarnish coatings
- Patent number 8,703,243
- Issue date Apr 22, 2014
- Enthone Inc.
- Joseph A. Abys
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Silver plating in electronics manufacture
- Patent number 8,349,393
- Issue date Jan 8, 2013
- Enthone Inc.
- Yung-Herng Yau
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Self assembled molecules on immersion silver coatings
- Patent number 8,323,741
- Issue date Dec 4, 2012
- Joseph A. Abys
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Composite coatings for whisker reduction
- Patent number 8,226,807
- Issue date Jul 24, 2012
- Enthone Inc.
- Joseph A. Abys
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Self assembled molecules on immersion silver coatings
- Patent number 8,216,645
- Issue date Jul 10, 2012
- Enthone Inc.
- Joseph A. Abys
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Surface preparation process for damascene copper deposition
- Patent number 7,998,859
- Issue date Aug 16, 2011
- Enthone Inc.
- Qingyun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anti-tarnish coatings
- Patent number 7,972,655
- Issue date Jul 5, 2011
- Enthone Inc.
- Joseph A. Abys
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Metallic surface enhancement
- Patent number 7,883,738
- Issue date Feb 8, 2011
- Enthone Inc.
- Joseph A. Abys
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Organic solderability preservative comprising high boiling temperat...
- Patent number 7,794,531
- Issue date Sep 14, 2010
- Enthone Inc.
- Joseph A. Abys
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tin-silver solder bumping in electronics manufacture
- Patent number 7,713,859
- Issue date May 11, 2010
- Enthone Inc.
- Thomas B. Richardson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper metallization of through silicon via
- Patent number 7,670,950
- Issue date Mar 2, 2010
- Enthone Inc.
- Thomas B. Richardson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder electroplating bath including brighteners having reduced vol...
- Patent number 6,730,209
- Issue date May 4, 2004
- Lucent Technologies Inc.
- Joseph A. Abys
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of determining the quality of hard gold
- Patent number 6,542,232
- Issue date Apr 1, 2003
- Lucent Technologies Inc.
- Joseph A. Abys
- G01 - MEASURING TESTING
Information Patent Grant
Multi-purpose finish for printed wiring boards and method of manufa...
- Patent number 6,534,192
- Issue date Mar 18, 2003
- Lucent Technologies Inc.
- Joseph A. Abys
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacture of printed wiring boards having multi-purpose...
- Patent number 6,517,893
- Issue date Feb 11, 2003
- Lucent Technologies Inc.
- Joseph A. Abys
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ultra-thin composite surface finish for electronic packaging
- Patent number 6,452,258
- Issue date Sep 17, 2002
- Lucent Technologies Inc.
- Joseph Anthony Abys
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for making gold salt for use in electroplating
- Patent number 6,423,202
- Issue date Jul 23, 2002
- Joseph Anthony Abys
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Conformable nickel coating and process for coating an article with...
- Patent number 6,399,220
- Issue date Jun 4, 2002
- Lucent Technologies Inc.
- Joseph Anthony Abys
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Process for synthesizing a palladium replenisher for electroplating...
- Patent number 6,346,222
- Issue date Feb 12, 2002
- Agere Systems Guardian Corp.
- Joseph Anthony Abys
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
COPPER FILLING OF THROUGH SILICON VIAS
- Publication number 20190003068
- Publication date Jan 3, 2019
- Enthone Inc.
- Thomas B. Richardson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Process for Filling Vias in the Microelectronics
- Publication number 20160254156
- Publication date Sep 1, 2016
- Enthone Inc.
- Thomas B. Richardson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Adhesion Promotion in Printed Circuit Boards
- Publication number 20160234947
- Publication date Aug 11, 2016
- ENTHONE, INC.
- Abayomi I. Owei
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRODEPOSITION OF SILVER WITH FLUOROPOLYMER NANOPARTICLES
- Publication number 20160032479
- Publication date Feb 4, 2016
- Enthone Inc.
- Jingye Li
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SILVER PLATING IN ELECTRONICS MANUFACTURE
- Publication number 20150257264
- Publication date Sep 10, 2015
- Enthone Inc.
- Yung-Herng Yau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESS FOR FILLING VIAS IN THE MICROELECTRONICS
- Publication number 20140120722
- Publication date May 1, 2014
- Enthone Inc.
- Thomas B. Richardson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ADHESION PROMOTION IN PRINTED CIRCUIT BOARDS
- Publication number 20140030425
- Publication date Jan 30, 2014
- Enthone Inc.
- Abayomi I. OWEI
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
COPPER FILLING OF THROUGH SILICON VIAS
- Publication number 20130199935
- Publication date Aug 8, 2013
- Enthone Inc.
- Thomas B. Richardson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SILVER PLATING IN ELECTRONICS MANUFACTURE
- Publication number 20130180768
- Publication date Jul 18, 2013
- Enthone Inc.
- Yung-Herng Yau
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COMPOSITE COATINGS FOR WHISKER REDUCTION
- Publication number 20120285834
- Publication date Nov 15, 2012
- Enthone Inc.
- Joseph A. Abys
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SELF ASSEMBLED MOLECULES ON IMMERSION SILVER COATINGS
- Publication number 20120276409
- Publication date Nov 1, 2012
- Enthone Inc.
- Joseph A. Abys
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ANTI-TARNISH COATINGS
- Publication number 20120175022
- Publication date Jul 12, 2012
- Enthone Inc.
- Joseph A. Abys
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ADHESION PROMOTION OF METAL TO LAMINATE WITH MULTI-FUNCTIONAL MOLEC...
- Publication number 20120168075
- Publication date Jul 5, 2012
- Enthone Inc.
- Joseph A. Abys
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
IMMERSION TIN SILVER PLATING IN ELECTRONICS MANUFACTURE
- Publication number 20110097597
- Publication date Apr 28, 2011
- Enthone Inc.
- Yung-Herng Yau
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CORROSION PROTECTION OF BRONZES
- Publication number 20100319572
- Publication date Dec 23, 2010
- Enthone Inc.
- Joseph A. Abys
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ELECTROLYTIC DEPOSITION OF METAL-BASED COMPOSITE COATINGS COMPRISIN...
- Publication number 20100294669
- Publication date Nov 25, 2010
- Enthone Inc.
- Joseph A. Abys
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ANTI-TARNISH COATINGS
- Publication number 20100291303
- Publication date Nov 18, 2010
- Enthone Inc.
- Joseph A. Abys
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
METALLIC SURFACE ENHANCEMENT
- Publication number 20100151263
- Publication date Jun 17, 2010
- Enthone Inc.
- Joseph A. Abys
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
COMPOSITE COATINGS FOR WHISKER REDUCTION
- Publication number 20090145765
- Publication date Jun 11, 2009
- Enthone Inc.
- Joseph A. Abys
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COMPOSITE COATINGS FOR WHISKER REDUCTION
- Publication number 20090145764
- Publication date Jun 11, 2009
- Enthone Inc.
- Joseph A. Abys
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SELF ASSEMBLED MOLECULES ON IMMERSION SILVER COATINGS
- Publication number 20090121192
- Publication date May 14, 2009
- Enthone Inc.
- Joseph A. Abys
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
COPPER METALLIZATION OF THROUGH SILICON VIA
- Publication number 20090035940
- Publication date Feb 5, 2009
- Enthone Inc.
- Thomas B. Richardson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CORROSION PROTECTION OF BRONZES
- Publication number 20080314283
- Publication date Dec 25, 2008
- Enthone Inc.
- Joseph A. Abys
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METALLIC SURFACE ENHANCEMENT
- Publication number 20080261025
- Publication date Oct 23, 2008
- Enthone Inc.
- Joseph A. Abys
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Preserving Solderability and Inhibiting Whisker Growth in Tin Surfa...
- Publication number 20080261071
- Publication date Oct 23, 2008
- Chen Xu
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ORGANIC SOLDERABILITY PRESERVATIVE COMPRISING HIGH BOILING TEMPERAT...
- Publication number 20080163787
- Publication date Jul 10, 2008
- Enthone Inc.
- Joseph A. Abys
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
TIN-SILVER SOLDER BUMPING IN ELECTRONICS MANUFACTURE
- Publication number 20070037377
- Publication date Feb 15, 2007
- Enthone Inc.
- Thomas B. Richardson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Cobalt self-initiated electroless via fill for stacked memory cells
- Publication number 20060188659
- Publication date Aug 24, 2006
- Enthone Inc.
- Qingyun Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Silver plating in electronics manufacture
- Publication number 20060024430
- Publication date Feb 2, 2006
- Enthone Inc.
- Yung-Herng Yau
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Corrosion resistance enhancement of tin surfaces
- Publication number 20050268991
- Publication date Dec 8, 2005
- Enthone Inc.
- Chonglun Fan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Joseph A. Abys

Person

Patents Grantslast 30 patents

Process for filling vias in the microelectronics

Copper filling of through silicon vias

Process for filling vias in the microelectronics

Corrosion protection of bronzes

Silver plating in electronics manufacture

Adhesion promotion in printed circuit boards

Electrolytic deposition of metal-based composite coatings comprisin...

Immersion tin silver plating in electronics manufacture

Silver plating in electronics manufacture

Composite coatings for whisker reduction

Metallic surface enhancement

Anti-tarnish coatings

Silver plating in electronics manufacture

Self assembled molecules on immersion silver coatings

Composite coatings for whisker reduction

Self assembled molecules on immersion silver coatings

Surface preparation process for damascene copper deposition

Anti-tarnish coatings

Metallic surface enhancement

Organic solderability preservative comprising high boiling temperat...

Tin-silver solder bumping in electronics manufacture

Copper metallization of through silicon via

Solder electroplating bath including brighteners having reduced vol...

Method of determining the quality of hard gold

Multi-purpose finish for printed wiring boards and method of manufa...

Method of manufacture of printed wiring boards having multi-purpose...

Ultra-thin composite surface finish for electronic packaging

Process for making gold salt for use in electroplating

Conformable nickel coating and process for coating an article with...

Process for synthesizing a palladium replenisher for electroplating...

Patents Applicationslast 30 patents

COPPER FILLING OF THROUGH SILICON VIAS

Process for Filling Vias in the Microelectronics

Adhesion Promotion in Printed Circuit Boards

ELECTRODEPOSITION OF SILVER WITH FLUOROPOLYMER NANOPARTICLES

SILVER PLATING IN ELECTRONICS MANUFACTURE

PROCESS FOR FILLING VIAS IN THE MICROELECTRONICS

ADHESION PROMOTION IN PRINTED CIRCUIT BOARDS

COPPER FILLING OF THROUGH SILICON VIAS

SILVER PLATING IN ELECTRONICS MANUFACTURE

COMPOSITE COATINGS FOR WHISKER REDUCTION

SELF ASSEMBLED MOLECULES ON IMMERSION SILVER COATINGS

ANTI-TARNISH COATINGS

ADHESION PROMOTION OF METAL TO LAMINATE WITH MULTI-FUNCTIONAL MOLEC...

IMMERSION TIN SILVER PLATING IN ELECTRONICS MANUFACTURE

CORROSION PROTECTION OF BRONZES

ELECTROLYTIC DEPOSITION OF METAL-BASED COMPOSITE COATINGS COMPRISIN...

ANTI-TARNISH COATINGS

METALLIC SURFACE ENHANCEMENT

COMPOSITE COATINGS FOR WHISKER REDUCTION

COMPOSITE COATINGS FOR WHISKER REDUCTION

SELF ASSEMBLED MOLECULES ON IMMERSION SILVER COATINGS

COPPER METALLIZATION OF THROUGH SILICON VIA

CORROSION PROTECTION OF BRONZES

METALLIC SURFACE ENHANCEMENT

Preserving Solderability and Inhibiting Whisker Growth in Tin Surfa...

ORGANIC SOLDERABILITY PRESERVATIVE COMPRISING HIGH BOILING TEMPERAT...

TIN-SILVER SOLDER BUMPING IN ELECTRONICS MANUFACTURE

Cobalt self-initiated electroless via fill for stacked memory cells

Silver plating in electronics manufacture

Corrosion resistance enhancement of tin surfaces