Joseph A. Benenati

Person

Hopewell Junction, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Thermal enhancement approach using solder compositions in the liqui...
- Patent number 6,656,770
- Issue date Dec 2, 2003
- International Business Machines Corporation
- Eugene R. Atwood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder ball connections and assembly process
- Patent number 6,504,105
- Issue date Jan 7, 2003
- International Business Machines Corporation
- John Acocella
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Rolling ball connector
- Patent number 6,358,627
- Issue date Mar 19, 2002
- International Business Machines Corporation
- Joseph A. Benenati
- G01 - MEASURING TESTING
Information Patent Grant
Thermal enhancement approach using solder compositions in the liqui...
- Patent number 6,281,573
- Issue date Aug 28, 2001
- International Business Machines Corporation
- Eugene R. Atwood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underfill preform interposer for joining chip to substrate
- Patent number 6,258,627
- Issue date Jul 10, 2001
- International Business Machines Corporation
- Joseph A. Benenati
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Zero force heat sink
- Patent number 6,212,070
- Issue date Apr 3, 2001
- International Business Machines Corporation
- Eugene R. Atwood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rolling ball connector
- Patent number 6,177,729
- Issue date Jan 23, 2001
- International Business Machines Corporation
- Joseph A. Benenati
- G01 - MEASURING TESTING
Information Patent Grant
Zero force heat sink
- Patent number 5,805,430
- Issue date Sep 8, 1998
- International Business Machines Corporation
- Eugene R. Atwood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder ball connections and assembly process
- Patent number 5,675,889
- Issue date Oct 14, 1997
- International Business Machines Corporation
- John Acocella
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder ball interconnected assembly
- Patent number 5,591,941
- Issue date Jan 7, 1997
- International Business Machines Corporation
- John Acocella
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for removing a heatsink from an electronic module or package
- Patent number 5,297,618
- Issue date Mar 29, 1994
- International Business Machines Corporation
- John R. Behun
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Thermal enhancement approach using solder compositions in the liqui...
- Publication number 20010026957
- Publication date Oct 4, 2001
- International Business Machines Corporation
- Eugene R. Atwood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Rolling ball connector
- Publication number 20010002330
- Publication date May 31, 2001
- Joseph A. Benenati
- G01 - MEASURING TESTING

Joseph A. Benenati

Person

Patents Grantslast 30 patents

Thermal enhancement approach using solder compositions in the liqui...

Solder ball connections and assembly process

Rolling ball connector

Thermal enhancement approach using solder compositions in the liqui...

Underfill preform interposer for joining chip to substrate

Zero force heat sink

Rolling ball connector

Zero force heat sink

Solder ball connections and assembly process

Solder ball interconnected assembly

Apparatus for removing a heatsink from an electronic module or package

Patents Applicationslast 30 patents

Thermal enhancement approach using solder compositions in the liqui...

Rolling ball connector