Joseph A. Czagas

Person

Palm Bay, FL, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method of forming an integrated circuit having a device wafer with...
- Patent number 7,605,052
- Issue date Oct 20, 2009
- Intersil Corporation
- Joseph A. Czagas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit having a device wafer with a diffused doped back...
- Patent number 7,285,475
- Issue date Oct 23, 2007
- Intersil Americas Inc.
- Joseph A. Czagas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit having a device wafer with a diffused doped back...
- Patent number 6,946,364
- Issue date Sep 20, 2005
- Intersil Americas Inc.
- Joseph A. Czagas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit having a device wafer with a diffused doped back...
- Patent number 6,867,495
- Issue date Mar 15, 2005
- Intersil Americas Inc.
- Joseph A. Czagas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Highly linear integrated resistive contact
- Patent number 6,667,523
- Issue date Dec 23, 2003
- Intersil Americas Inc.
- Dustin A. Woodbury
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Co-patterning thin-film resistors of different compositions with a...
- Patent number 6,441,447
- Issue date Aug 27, 2002
- Intersil Corporation
- Joseph A. Czagas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming resistive contacts on intergrated circuits with m...
- Patent number 6,403,472
- Issue date Jun 11, 2002
- Harris Corporation
- Dustin A. Woodbury
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making a diffused back-side layer on a bonded-wafer with...
- Patent number 6,362,075
- Issue date Mar 26, 2002
- Harris Corporation
- Joseph A. Czagas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit with thin film resistors and a method for co-pat...
- Patent number 5,976,944
- Issue date Nov 2, 1999
- Harris Corporation
- Joseph Andre Czagas
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF FORMING AN INTEGRATED CIRCUIT HAVING A DEVICE WAFER WITH...
- Publication number 20080026595
- Publication date Jan 31, 2008
- Intersil Americas Inc.
- Joseph A. Czagas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit having a device wafer with a diffused doped back...
- Publication number 20060009007
- Publication date Jan 12, 2006
- INTERSIL AMERICAS INC.
- Joseph A. Czagas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit having a device wafer with a diffused doped back...
- Publication number 20040161905
- Publication date Aug 19, 2004
- INTERSIL AMERICAS INC.
- Joseph A. Czagas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Highly linear integrated resistive contact
- Publication number 20020109230
- Publication date Aug 15, 2002
- Dustin A. Woodbury
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit having a device wafer with a diffused doped back...
- Publication number 20020072200
- Publication date Jun 13, 2002
- HARRIS CORPORATION
- Joseph A. Czagas
- H01 - BASIC ELECTRIC ELEMENTS

Joseph A. Czagas

Person

Patents Grantslast 30 patents

Method of forming an integrated circuit having a device wafer with...

Integrated circuit having a device wafer with a diffused doped back...

Integrated circuit having a device wafer with a diffused doped back...

Integrated circuit having a device wafer with a diffused doped back...

Highly linear integrated resistive contact

Co-patterning thin-film resistors of different compositions with a...

Method of forming resistive contacts on intergrated circuits with m...

Method for making a diffused back-side layer on a bonded-wafer with...

Integrated circuit with thin film resistors and a method for co-pat...

Patents Applicationslast 30 patents

METHOD OF FORMING AN INTEGRATED CIRCUIT HAVING A DEVICE WAFER WITH...

Integrated circuit having a device wafer with a diffused doped back...

Integrated circuit having a device wafer with a diffused doped back...

Highly linear integrated resistive contact

Integrated circuit having a device wafer with a diffused doped back...