Joseph A. Kotylo

Person

Binghamton, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method of making a circuitized substrate having a plurality of sold...
- Patent number 7,087,441
- Issue date Aug 8, 2006
- Endicott Interconnect Technologies, Inc.
- John J. Konrad
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating printed circuit board with mixed metallurgy pads
- Patent number 6,931,722
- Issue date Aug 23, 2005
- International Business Machines Corporation
- Edward L. Arrington
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Promoting adhesion between a polymer and a metallic substrate
- Patent number 6,908,684
- Issue date Jun 21, 2005
- International Business Machines Corporation
- Anastasios P. Angelopoulos
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Promoting adhesion between a polymer and a metallic substrate
- Patent number 6,730,409
- Issue date May 4, 2004
- International Business Machines Corporation
- Anastasios P. Angelopoulos
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Printed circuit board with mixed metallurgy pads and method of fabr...
- Patent number 6,586,683
- Issue date Jul 1, 2003
- International Business Machines Corporation
- Edward L. Arrington
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Photoresist develop and strip solvent compositions and method for t...
- Patent number 6,127,097
- Issue date Oct 3, 2000
- International Business Machines Corporation
- Nageshwer Rao Bantu
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method of making a printed circuit board having filled holes
- Patent number 6,009,620
- Issue date Jan 4, 2000
- International Business Machines Corporation
- Ashwinkumar C. Bhatt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for constraining the flow of incapsulant appli...
- Patent number 5,869,356
- Issue date Feb 9, 1999
- International Business Machines Corporation
- James W. Fuller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure for constraining the flow of encapsulant applied to an I/...
- Patent number 5,784,260
- Issue date Jul 21, 1998
- International Business Machines Corporation
- James W. Fuller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photoresist develop and strip solvent compositions and method for t...
- Patent number 5,268,260
- Issue date Dec 7, 1993
- International Business Machines Corporation
- Nageshwer R. Bantu
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY

Patents Applicationslast 30 patents

Information Patent Application
Method of making a circuitized substrate having a plurality of sold...
- Publication number 20060099727
- Publication date May 11, 2006
- Endicott Interconnect Technologies, Inc.
- John J. Konrad
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Promoting adhesion between a polymer and a metallic substrate
- Publication number 20040166438
- Publication date Aug 26, 2004
- International Business Machines Corporation
- Anastasios P. Angelopoulos
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Printed circuit board with mixed metallurgy pads and method of fabr...
- Publication number 20030177635
- Publication date Sep 25, 2003
- Edward L. Arrington
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed circuit board with mixed metallurgy pads and method of fabr...
- Publication number 20020157861
- Publication date Oct 31, 2002
- International Business Machines Corporation
- Edward L. Arrington
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Joseph A. Kotylo

Person

Patents Grantslast 30 patents

Method of making a circuitized substrate having a plurality of sold...

Method of fabricating printed circuit board with mixed metallurgy pads

Promoting adhesion between a polymer and a metallic substrate

Promoting adhesion between a polymer and a metallic substrate

Printed circuit board with mixed metallurgy pads and method of fabr...

Photoresist develop and strip solvent compositions and method for t...

Method of making a printed circuit board having filled holes

Method and structure for constraining the flow of incapsulant appli...

Structure for constraining the flow of encapsulant applied to an I/...

Photoresist develop and strip solvent compositions and method for t...

Patents Applicationslast 30 patents

Method of making a circuitized substrate having a plurality of sold...

Promoting adhesion between a polymer and a metallic substrate

Printed circuit board with mixed metallurgy pads and method of fabr...

Printed circuit board with mixed metallurgy pads and method of fabr...