Joseph F. Walczyk

Person

Tigard, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Stackable photonics die with direct optical interconnect
- Patent number 12,135,460
- Issue date Nov 5, 2024
- Intel Corporation
- Todd R. Coons
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit die packages including a contiguous heat spreader
- Patent number 12,136,577
- Issue date Nov 5, 2024
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid thermal interface material (TIM) with reduced 3D thermal res...
- Patent number 12,087,658
- Issue date Sep 10, 2024
- Intel Corporation
- Pooya Tadayon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Additively manufactured structures for heat dissipation from integr...
- Patent number 12,080,620
- Issue date Sep 3, 2024
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Active optical plug to optically or electrically test a photonics p...
- Patent number 12,061,230
- Issue date Aug 13, 2024
- Intel Corporation
- Todd R. Coons
- G01 - MEASURING TESTING
Information Patent Grant
Dual-sided socket device with corrugation structures and shield str...
- Patent number 12,009,612
- Issue date Jun 11, 2024
- Intel Corporation
- Srikant Nekkanty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid backside thermal structures for enhanced IC packages
- Patent number 11,948,906
- Issue date Apr 2, 2024
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connector with insulated conductive layer
- Patent number 11,935,860
- Issue date Mar 19, 2024
- Intel Corporation
- Morten Jensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-profile gimbal platform for high-resolution in situ co-planarit...
- Patent number 11,674,980
- Issue date Jun 13, 2023
- Intel Corporation
- Paul J. Diglio
- G01 - MEASURING TESTING
Information Patent Grant
Micro-coaxial wire interconnect architecture
- Patent number 11,656,247
- Issue date May 23, 2023
- Intel Corporation
- Ronald Michael Kirby
- G01 - MEASURING TESTING
Information Patent Grant
Massively-parallel micronozzle array for direct write electrodeposi...
- Patent number 11,639,556
- Issue date May 2, 2023
- Intel Corporation
- Joe Walczyk
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Thermal switch for rapid thermal coupling and decoupling of devices...
- Patent number 11,592,472
- Issue date Feb 28, 2023
- Intel Corporation
- Joe F. Walczyk
- G01 - MEASURING TESTING
Information Patent Grant
Cooling apparatuses for microelectronic assemblies
- Patent number 11,581,237
- Issue date Feb 14, 2023
- Intel Corporation
- Joe F. Walczyk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sloped metal features for cooling hotspots in stacked-die packages
- Patent number 11,398,414
- Issue date Jul 26, 2022
- Intel Corporation
- Zhimin Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Slip-plane MEMs probe for high-density and fine pitch interconnects
- Patent number 11,372,023
- Issue date Jun 28, 2022
- Intel Corporation
- Joe Walczyk
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
High density and fine pitch interconnect structures in an electric...
- Patent number 11,249,113
- Issue date Feb 15, 2022
- Intel Corporation
- Pooya Tadayon
- G01 - MEASURING TESTING
Information Patent Grant
Electrical testing apparatus with lateral movement of a probe suppo...
- Patent number 11,073,538
- Issue date Jul 27, 2021
- Intel Corporation
- Paul Diglio
- G01 - MEASURING TESTING
Information Patent Grant
Slip-plane MEMS probe for high-density and fine pitch interconnects
- Patent number 10,935,573
- Issue date Mar 2, 2021
- Intel Corporation
- Joe Walczyk
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
High density and fine pitch interconnect structures in an electric...
- Patent number 10,877,068
- Issue date Dec 29, 2020
- Intel Corporation
- Pooya Tadayon
- G01 - MEASURING TESTING
Information Patent Grant
Low-profile gimbal platform for high-resolution in situ co-planarit...
- Patent number 10,775,414
- Issue date Sep 15, 2020
- Intel Corporation
- Paul J. Diglio
- G01 - MEASURING TESTING
Information Patent Grant
Shielded interconnect array
- Patent number 10,644,458
- Issue date May 5, 2020
- Intel Corporation
- Youngseok Oh
- G01 - MEASURING TESTING
Information Patent Grant
Conformable heat spreader
- Patent number 10,566,263
- Issue date Feb 18, 2020
- Intel Corporation
- Joe Walczyk
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
High density and fine pitch interconnect structures in an electric...
- Patent number 10,488,438
- Issue date Nov 26, 2019
- Intel Corporation
- Pooya Tadayon
- G01 - MEASURING TESTING
Information Patent Grant
Low profile edge clamp socket
- Patent number 10,338,099
- Issue date Jul 2, 2019
- Intel Corporation
- Christopher Del Barga
- G01 - MEASURING TESTING
Information Patent Grant
Package testing system and method with contact alignment
- Patent number 10,324,112
- Issue date Jun 18, 2019
- Intel Corporation
- Mohanraj Prabhugoud
- G01 - MEASURING TESTING
Information Patent Grant
Actuation mechanisms for electrical interconnections
- Patent number 9,674,943
- Issue date Jun 6, 2017
- Intel Corporation
- Youngseok Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Organic space transformer attachment and assembly
- Patent number 9,581,639
- Issue date Feb 28, 2017
- Intel Corporation
- Jin Yang
- G01 - MEASURING TESTING
Information Patent Grant
Interconnects including liquid metal
- Patent number 9,523,713
- Issue date Dec 20, 2016
- Intel Corporation
- Youngseok Oh
- G01 - MEASURING TESTING
Information Patent Grant
Thermal interface material handling for thermal control of an elect...
- Patent number 9,377,486
- Issue date Jun 28, 2016
- Intel Corporation
- David Won-jun Song
- G01 - MEASURING TESTING
Information Patent Grant
Mechanism for facilitating a dynamic electro-mechanical interconnec...
- Patent number 9,128,121
- Issue date Sep 8, 2015
- Intel Corporation
- Evan M. Fledell
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER

Patents Applicationslast 30 patents

Information Patent Application
STACKABLE PHOTONICS DIE WITH DIRECT OPTICAL INTERCONNECT
- Publication number 20250020874
- Publication date Jan 16, 2025
- Intel Corporation
- Todd R. COONS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BACKSIDE THERMAL STRUCTURES FOR ENHANCED IC PACKAGES
- Publication number 20240203926
- Publication date Jun 20, 2024
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR OPTICAL COUPLING TO PHOTONIC INTEGRATED CIRCUITS
- Publication number 20230095039
- Publication date Mar 30, 2023
- Intel Corporation
- Srikant Nekkanty
- G02 - OPTICS
Information Patent Application
ACTIVE OPTICAL PLUG TO OPTICALLY OR ELECTRICALLY TEST A PHOTONICS P...
- Publication number 20220196732
- Publication date Jun 23, 2022
- Intel Corporation
- Todd R. COONS
- G02 - OPTICS
Information Patent Application
PIERCEABLE PROTECTIVE COVER FOR PHOTONIC CONNECTORS
- Publication number 20220196924
- Publication date Jun 23, 2022
- Intel Corporation
- Joe F. WALCZYK
- G02 - OPTICS
Information Patent Application
STACKABLE PHOTONICS DIE WITH DIRECT OPTICAL INTERCONNECT
- Publication number 20220196915
- Publication date Jun 23, 2022
- Intel Corporation
- Todd R. COONS
- G02 - OPTICS
Information Patent Application
MICRO SOCKET ELECTRICAL COUPLINGS FOR DIES
- Publication number 20220200183
- Publication date Jun 23, 2022
- Intel Corporation
- Srikant NEKKANTY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL-SIDED SOCKET DEVICE WITH CORRUGATION STRUCTURES AND SHIELD STR...
- Publication number 20220102892
- Publication date Mar 31, 2022
- Intel Corporation
- Srikant Nekkanty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADDITIVELY MANUFACTURED STRUCTURES FOR HEAT DISSIPATION FROM INTEGR...
- Publication number 20210407884
- Publication date Dec 30, 2021
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DIE PACKAGES INCLUDING A CONTIGUOUS HEAT SPREADER
- Publication number 20210407877
- Publication date Dec 30, 2021
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID THERMAL INTERFACE MATERIAL (TIM) WITH REDUCED 3D THERMAL RES...
- Publication number 20210375716
- Publication date Dec 2, 2021
- Intel Corporation
- Pooya Tadayon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CONNECTOR WITH INSULATED CONDUCTIVE LAYER
- Publication number 20210305196
- Publication date Sep 30, 2021
- Intel Corporation
- Morten JENSEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BACKSIDE THERMAL STRUCTURES FOR ENHANCED IC PACKAGES
- Publication number 20210249375
- Publication date Aug 12, 2021
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SLIP-PLANE MEMS PROBE FOR HIGH-DENSITY AND FINE PITCH INTERCONNECTS
- Publication number 20210239734
- Publication date Aug 5, 2021
- Intel Corporation
- Joe Walczyk
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HIGH DENSITY AND FINE PITCH INTERCONNECT STRUCTURES IN AN ELECTRIC...
- Publication number 20210088554
- Publication date Mar 25, 2021
- Intel Corporation
- Pooya Tadayon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEFLECTED-PILLAR COMPOSITE COMPLIANT ELONGATED MICRO-STRUCTURE THER...
- Publication number 20200411408
- Publication date Dec 31, 2020
- Intel Corporation
- Joe Walczyk
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
LOW-PROFILE GIMBAL PLATFORM FOR HIGH-RESOLUTION IN SITU CO-PLANARIT...
- Publication number 20200371136
- Publication date Nov 26, 2020
- Intel Corporation
- Paul J. Diglio
- G01 - MEASURING TESTING
Information Patent Application
THERMAL SWITCH FOR RAPID THERMAL COUPLING AND DECOUPLING OF DEVICES...
- Publication number 20200371155
- Publication date Nov 26, 2020
- Intel Corporation
- Joe F. Walczyk
- G01 - MEASURING TESTING
Information Patent Application
MICRO-COAXIAL WIRE INTERCONNECT ARCHITECTURE
- Publication number 20200141979
- Publication date May 7, 2020
- Intel Corporation
- Ronald Michael Kirby
- G01 - MEASURING TESTING
Information Patent Application
SLIP-PLANE MEMS PROBE FOR HIGH-DENSITY AND FINE PITCH INTERCONNECTS
- Publication number 20200103440
- Publication date Apr 2, 2020
- Joe Walczyk
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SLOPED METAL FEATURES FOR COOLING HOTSPOTS IN STACKED-DIE PACKAGES
- Publication number 20200098666
- Publication date Mar 26, 2020
- Intel Corporation
- ZHIMIN WAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRA LOW-COST, LOW LEADTIME, AND HIGH DENSITY SPACE TRANSFORMER FO...
- Publication number 20200072871
- Publication date Mar 5, 2020
- Intel Corporation
- Pooya Tadayon
- G01 - MEASURING TESTING
Information Patent Application
HIGH DENSITY AND FINE PITCH INTERCONNECT STRUCTURES IN AN ELECTRIC...
- Publication number 20200025801
- Publication date Jan 23, 2020
- Intel Corporation
- Pooya Tadayon
- G01 - MEASURING TESTING
Information Patent Application
COOLING APPARATUSES FOR MICROELECTRONIC ASSEMBLIES
- Publication number 20190385925
- Publication date Dec 19, 2019
- Intel Corporation
- Joe F. Walczyk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY AND FINE PITCH INTERCONNECT STRUCTURES IN AN ELECTRIC...
- Publication number 20190212366
- Publication date Jul 11, 2019
- Intel Corporation
- Pooya Tadayon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MASSIVELY-PARALLEL MICRONOZZLE ARRAY FOR DIRECT WRITE ELECTRODEPOSI...
- Publication number 20190203370
- Publication date Jul 4, 2019
- Intel Corporation
- Joe Walczyk
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL TESTING APPARATUS WITH LATERAL MOVEMENT OF A PROBE SUPPO...
- Publication number 20190204358
- Publication date Jul 4, 2019
- Paul Diglio
- G01 - MEASURING TESTING
Information Patent Application
LOW-PROFILE GIMBAL PLATFORM FOR HIGH-RESOLUTION IN SITU CO-PLANARIT...
- Publication number 20190101570
- Publication date Apr 4, 2019
- Intel Corporation
- PAUL J. DIGLIO
- G01 - MEASURING TESTING
Information Patent Application
CONFORMABLE HEAT SPREADER
- Publication number 20190096785
- Publication date Mar 28, 2019
- Intel Corporation
- Joe Walczyk
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
LOW PROFILE EDGE CLAMP SOCKET
- Publication number 20180364279
- Publication date Dec 20, 2018
- Christopher Del Barga
- G01 - MEASURING TESTING

Joseph F. Walczyk

Person

Patents Grantslast 30 patents

Stackable photonics die with direct optical interconnect

Integrated circuit die packages including a contiguous heat spreader

Hybrid thermal interface material (TIM) with reduced 3D thermal res...

Additively manufactured structures for heat dissipation from integr...

Active optical plug to optically or electrically test a photonics p...

Dual-sided socket device with corrugation structures and shield str...

Hybrid backside thermal structures for enhanced IC packages

Electrical connector with insulated conductive layer

Low-profile gimbal platform for high-resolution in situ co-planarit...

Micro-coaxial wire interconnect architecture

Massively-parallel micronozzle array for direct write electrodeposi...

Thermal switch for rapid thermal coupling and decoupling of devices...

Cooling apparatuses for microelectronic assemblies

Sloped metal features for cooling hotspots in stacked-die packages

Slip-plane MEMs probe for high-density and fine pitch interconnects

High density and fine pitch interconnect structures in an electric...

Electrical testing apparatus with lateral movement of a probe suppo...

Slip-plane MEMS probe for high-density and fine pitch interconnects

High density and fine pitch interconnect structures in an electric...

Low-profile gimbal platform for high-resolution in situ co-planarit...

Shielded interconnect array

Conformable heat spreader

High density and fine pitch interconnect structures in an electric...

Low profile edge clamp socket

Package testing system and method with contact alignment

Actuation mechanisms for electrical interconnections

Organic space transformer attachment and assembly

Interconnects including liquid metal

Thermal interface material handling for thermal control of an elect...

Mechanism for facilitating a dynamic electro-mechanical interconnec...

Patents Applicationslast 30 patents

STACKABLE PHOTONICS DIE WITH DIRECT OPTICAL INTERCONNECT

HYBRID BACKSIDE THERMAL STRUCTURES FOR ENHANCED IC PACKAGES

TECHNOLOGIES FOR OPTICAL COUPLING TO PHOTONIC INTEGRATED CIRCUITS

ACTIVE OPTICAL PLUG TO OPTICALLY OR ELECTRICALLY TEST A PHOTONICS P...

PIERCEABLE PROTECTIVE COVER FOR PHOTONIC CONNECTORS

STACKABLE PHOTONICS DIE WITH DIRECT OPTICAL INTERCONNECT

MICRO SOCKET ELECTRICAL COUPLINGS FOR DIES

DUAL-SIDED SOCKET DEVICE WITH CORRUGATION STRUCTURES AND SHIELD STR...

ADDITIVELY MANUFACTURED STRUCTURES FOR HEAT DISSIPATION FROM INTEGR...

INTEGRATED CIRCUIT DIE PACKAGES INCLUDING A CONTIGUOUS HEAT SPREADER

HYBRID THERMAL INTERFACE MATERIAL (TIM) WITH REDUCED 3D THERMAL RES...

ELECTRICAL CONNECTOR WITH INSULATED CONDUCTIVE LAYER

HYBRID BACKSIDE THERMAL STRUCTURES FOR ENHANCED IC PACKAGES

SLIP-PLANE MEMS PROBE FOR HIGH-DENSITY AND FINE PITCH INTERCONNECTS

HIGH DENSITY AND FINE PITCH INTERCONNECT STRUCTURES IN AN ELECTRIC...

DEFLECTED-PILLAR COMPOSITE COMPLIANT ELONGATED MICRO-STRUCTURE THER...

LOW-PROFILE GIMBAL PLATFORM FOR HIGH-RESOLUTION IN SITU CO-PLANARIT...

THERMAL SWITCH FOR RAPID THERMAL COUPLING AND DECOUPLING OF DEVICES...

MICRO-COAXIAL WIRE INTERCONNECT ARCHITECTURE

SLIP-PLANE MEMS PROBE FOR HIGH-DENSITY AND FINE PITCH INTERCONNECTS

SLOPED METAL FEATURES FOR COOLING HOTSPOTS IN STACKED-DIE PACKAGES

ULTRA LOW-COST, LOW LEADTIME, AND HIGH DENSITY SPACE TRANSFORMER FO...

HIGH DENSITY AND FINE PITCH INTERCONNECT STRUCTURES IN AN ELECTRIC...

COOLING APPARATUSES FOR MICROELECTRONIC ASSEMBLIES

HIGH DENSITY AND FINE PITCH INTERCONNECT STRUCTURES IN AN ELECTRIC...

MASSIVELY-PARALLEL MICRONOZZLE ARRAY FOR DIRECT WRITE ELECTRODEPOSI...

ELECTRICAL TESTING APPARATUS WITH LATERAL MOVEMENT OF A PROBE SUPPO...

LOW-PROFILE GIMBAL PLATFORM FOR HIGH-RESOLUTION IN SITU CO-PLANARIT...

CONFORMABLE HEAT SPREADER

LOW PROFILE EDGE CLAMP SOCKET