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Joseph K. Fauty
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Mesa, AZ, US
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Patents Grants
last 30 patents
Information
Patent Grant
Electronic package having down-set leads and method
Patent number
8,319,323
Issue date
Nov 27, 2012
Semiconductor Components Industries, LLC
James P. Letterman, Jr.
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
Multi-chip semiconductor connector
Patent number
8,253,239
Issue date
Aug 28, 2012
Semiconductor Components Industries, LLC
Francis J. Carney
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming a molded array package device having an exposed t...
Patent number
7,901,990
Issue date
Mar 8, 2011
Semiconductor Components Industries, LLC
James P. Letterman, Jr.
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-chip semiconductor connector and method
Patent number
7,875,964
Issue date
Jan 25, 2011
Semiconductor Components Industries, LLC
Francis J. Carney
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming a leaded molded array package
Patent number
7,820,528
Issue date
Oct 26, 2010
Semiconductor Components Industries, LLC
William F. Burghout
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Encapsulated chip scale package having flip-chip on lead frame stru...
Patent number
7,656,048
Issue date
Feb 2, 2010
Semiconductor Components Industries, LLC
Joseph K. Fauty
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming a molded array package device having an exposed t...
Patent number
7,602,054
Issue date
Oct 13, 2009
Semiconductor Components Industries, LLC
James P. Letterman, Jr.
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor component and method of manufacture
Patent number
7,598,123
Issue date
Oct 6, 2009
Semiconductor Components Industries, LLC
Jay A. Yoder
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming a leaded molded array package
Patent number
7,588,999
Issue date
Sep 15, 2009
Semiconductor Components Industries, LLC
William F. Burghout
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-chip semiconductor connector assemblies
Patent number
7,508,060
Issue date
Mar 24, 2009
Semiconductor Components Industries, LLC
Francis J. Carney
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-chip semiconductor connector assembly method
Patent number
7,498,195
Issue date
Mar 3, 2009
Semiconductor Components Industries, LLC
Francis J. Carney
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Encapsulated chip scale package having flip-chip on lead frame stru...
Patent number
7,439,100
Issue date
Oct 21, 2008
Semiconductor Components Industries, LLC
Joseph K. Fauty
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-chip semiconductor connector assemblies
Patent number
7,298,034
Issue date
Nov 20, 2007
Semiconductor Components Industries, LLC
Francis J. Carney
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-chip semiconductor connector assembly method
Patent number
7,202,105
Issue date
Apr 10, 2007
Semiconductor Components Industries, LLC
Francis J. Carney
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-chip semiconductor connector and method
Patent number
7,202,106
Issue date
Apr 10, 2007
Semiconductor Components Industries, LLC
Francis J. Carney
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming a semiconductor package and leadframe therefor
Patent number
7,109,064
Issue date
Sep 19, 2006
Semiconductor Components Industries, LLC
Joseph K. Fauty
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and laminated leadframe package
Patent number
6,768,186
Issue date
Jul 27, 2004
Semiconductor Components Industries, LLC
James P. Letterman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic component and method of manufacture
Patent number
6,164,523
Issue date
Dec 26, 2000
Semiconductor Components Industries, LLC
Joseph K. Fauty
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor package consisting of multiple conductive layers
Patent number
6,081,031
Issue date
Jun 27, 2000
Semiconductor Components Industries, LLC
James P. Letterman
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
MULTI-CHIP SEMICONDUCTOR CONNECTOR
Publication number
20110068451
Publication date
Mar 24, 2011
Francis J. Carney
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF FORMING A MOLDED ARRAY PACKAGE DEVICE HAVING AN EXPOSED T...
Publication number
20100019367
Publication date
Jan 28, 2010
James P. Letterman, JR.
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC PACKAGE HAVING DOWN-SET LEADS AND METHOD
Publication number
20100000772
Publication date
Jan 7, 2010
Semiconductor Components Industries, LLC
James P. Letterman, JR.
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF FORMING A LEADED MOLDED ARRAY PACKAGE
Publication number
20090298232
Publication date
Dec 3, 2009
William F. Burghout
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURE
Publication number
20080217765
Publication date
Sep 11, 2008
Jay A. Yoder
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ENCAPSULATED CHIP SCALE PACKAGE HAVING FLIP-CHIP ON LEAD FRAME STRU...
Publication number
20080197459
Publication date
Aug 21, 2008
Joseph K. Fauty
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-CHIP SEMICONDUCTOR CONNECTOR ASSEMBLIES
Publication number
20080006920
Publication date
Jan 10, 2008
Francis J. Carney
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-CHIP SEMICONDUCTOR CONNECTOR AND METHOD
Publication number
20070126106
Publication date
Jun 7, 2007
Francis J. Carney
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-CHIP SEMICONDUCTOR CONNECTOR ASSEMBLY METHOD
Publication number
20070126107
Publication date
Jun 7, 2007
Francis J. Carney
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor component and method of manufacture
Publication number
20070117259
Publication date
May 24, 2007
Semiconductor Components Industries, LLC.
Harold G. Anderson
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of forming a leaded molded array package
Publication number
20070111393
Publication date
May 17, 2007
Semiconductor Components Industries, LLC.
William F. Burghout
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of forming a molded array package device having an exposed t...
Publication number
20070075409
Publication date
Apr 5, 2007
Semiconductor Components Industries, LLC.
James P. Letterman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Encapsulated chip scale package having flip-chip on lead frame stru...
Publication number
20070040283
Publication date
Feb 22, 2007
Semiconductor Components Industries, LLC.
Joseph K. Fauty
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Multi-chip semiconductor connector assemblies
Publication number
20050285249
Publication date
Dec 29, 2005
Semiconductor Components Industries, LLC.
Francis J. Carney
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Multi-chip semiconductor connector assembly method
Publication number
20050287703
Publication date
Dec 29, 2005
Semiconductor Components Industries, LLC.
Francis J. Carney
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Multi-chip semiconductor connector and method
Publication number
20050285235
Publication date
Dec 29, 2005
Semiconductor Components Industries, LLC.
Francis J. Carney
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of forming a semiconductor package and leadframe therefor
Publication number
20050127482
Publication date
Jun 16, 2005
Semiconductor Components Industries, LLC.
Joseph K. Fauty
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor device and laminated leadframe package
Publication number
20040070062
Publication date
Apr 15, 2004
Semiconductor Components Industries, LLC.
James P. Letterman
H01 - BASIC ELECTRIC ELEMENTS